Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Master Bond Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity (full story)

:: Industry Leading Sulfite Gold Manufacturer Technic Introduces Elevate Gold 7990 NBV (full story)

:: News from Indium Corporation (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Master Bond Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU•in/(ft2•hr•°F) [5.5 W/(m•K)] at room temperature while its compressive strength measures 22,000-24,000 psi upon cure. It has a low coefficient of thermal expansion of 24-26 x 10-6 in/in/°C and exhibits a Shore D hardness of 85-95.

According to Rohit Ramnath, Senior Product Engineer, "EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles." This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency and Part B is a low viscosity liquid.

EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, 1/2 pint kits, and pint kits.

Master Bond Thermally Conductive Adhesives

Master Bond EP30NG is a thermally conductive epoxy system containing graphene filler. It is suitable for applications where high thermal conductivity is needed and the small amount of electrical conductivity is not a factor. Read more about Master Bond’s thermally conductive adhesives at https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.
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:: Industry Leading Sulfite Gold Manufacturer Technic Introduces Elevate Gold 7990 NBV

Technic is pleased to announce the release of an improved sulfite gold plating process, Elevate Gold 7990 NBV. An enhanced version of the company’s industry-leading Elevate Gold 7990, the NBV version provides greater adaptability with a full range of deposit thicknesses, across diverse applications.

The use of non-cyanide gold continues to proliferate within the semiconductor industry, its growth spurred by the development of challenging applications in plating processes. Deposits ranging from 10 microns to as much as 100 microns are being sought after in a variety of toolsets, from benchtop lab equipment to wet benches and mass production fountain tools. To address these diverse requirements across such a broad range of tools, Technic has made modifications to its Elevate Gold 7990, releasing an updated formulation under the name Elevate Gold 7990 NBV.

Elevate Gold 7990 NBV performs well with optimum deposits of 0.5 microns to 100 microns in virtually any toolset. The new formulation operates at a slightly acidic pH, which is advantageous with almost all photoresists.

“Elevate Gold 7990 NBV is proven to meet the diverse demands of current industry trends with exceptional performance and no harmful metallic grain refiners such as thallium, arsenic, or lead. NBV is free of cyanide and other toxic additives, making it the ideal choice for optimum safety in the work environment as well as eliminating any concerns regarding codeposition in the finished product.”

  • Anthony Gallegos, Global Product Manager, Semiconductor Technology

Elevate Gold 7990 NBV is available for demo testing in our Cranston, RI Applications Lab or a demo can be set up at a customer site with support by Technic’s technical staff.

 About Technic
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing, and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.


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:: News from Indium Corporation

Indium Corporation Expert to Present at IMAPS New England

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS New England 46th Symposium & Expo, May 7, Boxboro, Massachusetts, USA.

Jensen’s presentation, Liquid Metal Innovations for High-Performance TIMs, will examine how the thermal conductivity values of metals make them highly sought after as a thermal interface material (TIM). While the hardness of metals limits their effectiveness due to high interfacial resistance, liquid metal alloys maintain the same high thermal conductivity without the limiting factors of solid alloys. His presentation will explore the methodologies and techniques that can overcome process challenges and enable liquid metal to be used in a wider array of TIM1 and TIM2 applications.

Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers to troubleshoot and optimize SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, and thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.

 

Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities

Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and China. The company’s headquarters in Clinton, NY, USA has also achieved IATF 16949 certification.

Indium Corporation has demonstrated effective implementation of a management system that satisfies the tough global auto supply chain standard recognized by automotive industry leaders worldwide. Designed to improve customer satisfaction by meeting customer requirements and needs with high-quality products, IATF 16949 provides a critical guiding framework for the industry and encourages an internal culture focused on ongoing improvement.

According to Ross Berntson, President and Chief Operating Officer, “These certifications reaffirm to all of our customers worldwide that Indium Corporation’s soldering materials are produced with the utmost quality to ensure the reliability of our customers’ finished goods.”

The IATF 16949:2016 is an international Automotive Quality Management System Standard aimed at continuous improvement, emphasizing defect prevention, and reducing variation and waste in the automotive industry supply chain.

 

Indium Corporation Launches IndiTri™—High-Purity Indium Trichloride

IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.

IndiTri™ is used as a starting compound for the synthesis of other inorganic and organic indium compounds, making it ideal for research and development projects. It is also commonly used in the production of alkaline batteries, and in compound semiconductors, such as LEDs and lasers.

Indium Corporation’s IndiTri™ is developed to deliver controlled, low moisture content with low- and high-density options to suit application needs.

For more information about IndiTriTM, visit www.indium.com/inorganic-compounds/indium-compounds/indium-trichloride/.

 

About Indium

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

 

 

 

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:: Issue 241 ::
April 19, 2019

Presidio Components

Gannon & Scott

TopLine