Corporate Bulletin
:: Corporate Member News ::

:: Technic Releases Highly Reflective White Solder Mask for Advanced LED Applications (full story)

:: MRSI Improves Accuracy to 1.5 micrometers for MRSI-H/HVM-Series Die Bonders (full story)

:: Hesse Mechatronics Announces New Hires (full story)

:: Indium Corporation Experts to Present at IMAPS Boston (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: Technic Releases Highly Reflective White Solder Mask for Advanced LED Applications

Technic is pleased to announce the release of TechniMask ISR1000F/900G, a liquid photo-definable flexible white gloss solder mask designed specifically for today’s demanding LED applications. TechniMask ISR1000F/900G offers one of the highest-rated reflectance values while exhibiting little to no discoloration after multiple reflow applications. This product will completely eliminate any pink/violet discoloration after reflow, which can occur after standard ENIG application.

TechniMask ISR1000F/900G operates with standard exposure and UV/LED direct imaging systems with minimized undercut while maintaining very high
flexibility. The product is compatible for flexible, rigid-flexible, and rigid LED applications producing a pure white, track-free cosmetic surface that has demonstrated a > 85% reflectivity after reflow. TechniMask ISR1000F/900G is free of halogens, Sb, Be, and phthalates. This product is also RoHS compliant and meets or exceeds IPC SM 840E specifications.

“TechniMask ISR1000F/900G represents several years of development, with some of the most challenging applications in the LED industry. We are very excited with the response from a number of customers that are very pleased with the results in both its application and performance.”

Tom Horigome
Global Director - Imaging Products

About Technic
Technic Inc. is a Rhode Island based, privately held corporation with over 950 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

Learn more at or contact us at (401) 781-6100.

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:: MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 micrometers at 3 sigma, to ±1.5 micrometers at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly known as MRSI-H3 and MRSI-HVM3).

MRSI’s trademark of high-speed and high flexibility remains uncompromised with the improved accuracy. Our customers now have options to design products for higher density and higher speed parts in miniature packages. This is critical for advanced products such as 400G+ photonics devices for data centers and backbone networks, as well as complex DFB/WDM/EML TO-can TOSA/ROSA devices for 5G wireless applications.

“MRSI is always looking ahead to address future customer needs. With proven success in the field and a large worldwide installation base, these MRSI-H/HVM-series products have demonstrated their ability to deliver ultra-precision, high-speed, and high-flexibility concurrently. This is critical for our customers’ high-mix high-volume photonics manufacturing,” said Dr. Yi Qian, Vice President of Marketing of MRSI Systems.

“MRSI has been serving optoelectronic and microelectronic customers for the past thirty-five years and understands their requirement to scale efficiently in today’s fast paced marketplace. We are pleased to announce the latest advancement with our high-speed die bonder product line,” concluded Mr. Michael Chalsen, President of MRSI Systems.

MRSI will be attending CIOE in Shenzhen, from September 4-7, 2019. Experience what the demo center has to offer. Discuss your application requirements and MRSI’s solutions. To schedule a meeting or learn more, contact your MRSI Sales Representative or email

For additional information, please contact:
Dr. Yi Qian
Vice President of Marketing, MRSI Systems
Tel: +1 (978) 667-9449, e-mail:
Time Zone: ET – Eastern Time

About MRSI Systems 
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit 

About Mycronic  
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarter is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic (MYCR) is listed at Nasdaq Stockholm. 

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:: Hesse Mechatronics Announces New Hires

Hesse Mechatronics is pleased to announce our latest hires that will address our growing business in the newly emerging battery and energy storage markets.  Both Louis and Mark will join Vicmark Divinagracia in our lab on campus at the University California-Irvine where we have our BJ855 and BJ985 Wire Bonders.

Louis Castellanos is a Sr. Field Service Technician with Hesse Mechatronics.  In this role, Louis will service, provide process support, and develop wire bonding programs and process parameters for customer applications.  Before joining Hesse Mechatronics, Louis spent eight years working for EV Grid. There he managed battery production for electric vehicles and energy storage. Louis is proficient in CAD modeling, prototyping, fabrication, battery assembly and testing.  He developed unique wire bonding parameters for cylindrical cells and busbars.  Louis, with his knowledge and experience, will assist finding new solutions and create cost-saving methods for customers such that these companies can reach their production goals.

Mark Newborn is a Sr. Supervisor Field Service and Applications Engineer with Hesse Mechatronics. In this role, Mark will support the company's wire bond product and services effort providing pre-sale applications, customer demonstrations, and on-site machine installations. Mark will be responsible for customer training and application support and assist with field service and applications scheduling of resources.

Before joining Hesse Mechatronics, he spent nearly 20 years working with semiconductor equipment company Kulicke and Soffa Industries (KNS) where he managed the Engineering Lab at their R&D facility. Mark also brings with him over 20 years of experience in the areas of electronic repair, reverse engineering, metrology, and research and development. He proudly served 4 years in the United States Navy where he was responsible for numerous shipboard weapons systems. With his extensive management experience and strong technical background, Mark will assist in providing enhanced products and services to the customers of Hesse Mechatronics.

Hesse Mechatronics is a wire bonder manufacturer for ball, fine wedge, heavy wedge and ribbon.  For more information on our product line, please visit our website at  For specific questions about this press release or if you would like to learn more about our wire bonders and services, please contact Mike McKeown at

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:: News from Indium Corporation

Indium Corporation Experts to Present at IMAPS Boston 

Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston, Massachusetts. 

Dr. Ning-Cheng Lee
, Vice President of Technology, will lead a professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.

Dr. Lee will also present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will discuss the development of fluxes for flip-chip and SiP assembly. These high-viscosity, high-tack fluxes are designed to be used to secure components at the placement and reflow stage as they become low-viscosity after reflow, allowing the flux residue to be cleaned.

Sze Pei Lim, Regional Product Manager for Semiconductor Products, will present Flip-Chip Flux Evolution, which examines the growth and trends of flip-chip technology, specifically the flip-chip interconnect as a critical assembly process. She will discuss the many variables associated with the flip-chip assembly process, and the need for increased reliability as the technology inevitably moves into the high-volume, zero-defect arena of automotive electronics.

Dr. Sihai Chen, Research Chemist, will present his interactive poster, Conventional Reflow Oven Sinterable Pressure-less Silver Paste for Drop-In Die-Attach Assembly. The presentation reviews the development of pressure-less silver sintering materials which can be adopted as a drop-in process using conventional convective reflow ovens normally used for solder processing. He will review various factors that were considered during the study, including paste optimization; device structure, such as surface metallization of the substrate; joint BLT; and die size. He will also explore their effect on the joint reliability during TCT.

Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present his poster, High-Performance Liquid Metal Thermal Interface Materials, which will review the main challenges associated with using a liquid metal as a thermal interface material (TIM), such as pump-out and moisture sensitivity, as well as a number of material and process innovations to overcome those challenges.

Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present Design and Evaluation of a Thermal Interface Material Automated Cycling Durability Test Program. The paper, co-authored by Jensen and Ron Hunadi, Indium Corporation Market Development Manager, Semiconductor and Advanced Materials, evaluates a mechanical reliability test program developed and implemented for specialized TIMs to meet the very challenging requirements for the semiconductor test market.

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has more than three decades in the development of fluxes, alloys and solder pastes for SMT industries. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.

Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has earned her Six Sigma Green Belt. Lim has been with Indium Corporation since 2007.

Dr. Chen specializes in silver sintering paste product development. He has authored several Indium Corporation patents for silver sintering paste, thermal interface material, heat dissipating paint, and indium bump bonding. Dr. Chen has published in numerous journals, including the Journal of the American Chemical Society, Nano Letters, Langmuir, and The Journal of Physical Chemistry. He earned his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Dr. Chen also holds a Six Sigma Green Belt and has been certified as an IPC Specialist for IPC-A-610.

Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.

To view additional papers authored by Indium Corporation’s experts, visit


Elements of Indium by Indium Corporation: Burn-In
In celebration of Indium Corporation’s 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.

Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal is literally all around us.

Indium metal, specifically foil made of pure indium, InSn, InAg, and pure indium clad with aluminum, efficiently removes process heat, making it a preferred choice for burn-in and test.

Since pure indium is more likely to stick to the burn-in head, a very thin cladding of aluminum is used to reduce the sticking. It is much more expensive to test at the board level—after the components have been soldered to the board—than to test each individual chip.

Indium Corporation’s Heat-Spring® thermal interface material (TIM) is designed to be used as an interface between a heat source and a heat-sink, heat-spreader, or heat-pipe. The malleability of indium metal maximizes the Heat-Spring’s thermal resistance and enhances cooling.

For more information on indium metal, visit


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.


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:: Issue 248 ::
August 23, 2019

Presidio Components

Gannon & Scott