Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna in Package Technology (full story)

:: Indium Corporation to Feature LV1000 Preforms at IMAPS Boston and Launches New Indium Oxide (full story)

:: FINETECH Expands with New Customer Center in Amherst, New Hampshire (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna in Package Technology

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is paving the way for 5G mmWave antenna-in-package (AiP) technology. Amkor’s cutting-edge AiP technology has already been deployed into modules designed for smartphones and other mobile devices. Starting in July 2018, Amkor was the first OSAT to market with 5G mmWave AiP technology, expanding on years of advanced System in Package (SiP) experience.

“Amkor has deployed our AiP technology into 5G product applications with a major global communications company, working with them to produce their first AiP product to go to market,” said Ron Huemoeller, Corporate VP of R&D for Amkor Technology. “A key focus for us is to continue to develop AiP products with revolutionary packaging concepts that are vital to the implementation of highly integrated circuitry,” he added.

The total RF front-end module SiP market is projected to reach US $5.3 billion by 2023, representing an 11.3% compound annual growth rate (CAGR) according to Yole Développement, SA, an industry consulting firm.

“5G will bring more packaging business for OSAT providers,” said Santosh Kumar, Yole Korea principal analyst and director, Packaging, Assembly & Substrates. “Typical RF front-end components in smartphones include various switches, filters, amplifiers and the antennas themselves. More and more, SiP technology is needed to implement an increasing number of bands and the development of circuitry in ever-smaller surfaces.”

In addition to its formidable SiP capacity and AiP technology, Amkor has developed an extensive toolset to maximize circuit density and address the sophisticated packaging formats required to productize 5G applications – such as double-sided assembly, embedded die in substrate, advanced RDL molding and various types of RF shielding. This toolset, combined with the company’s expertise in RF and antenna package design, uniquely positions Amkor to serve customers who want to outsource the challenges and high investment associated with combining multiple ICs with advanced package assembly and test technologies for 5G networks.

As demand for packages that support 5G starts to climb, Amkor is already well underway with the successful implementation of AiP technology. To learn more about Amkor’s capabilities in SiP and AiP, visit https://amkor.com/aip-aop

About Amkor Technology, Inc.

Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operating base includes 11 million square feet of floor space with production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. For more information, visit www.amkor.com.

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:: News from Indium

Indium Corporation to Feature LV1000 Preforms at IMAPS Boston 

Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, in Boston, Massachusetts. 



Indium Corporation’s LV1000 answers the demands of 5G wireless infrastructure by delivering superior reliability and performance. LV1000 produces lower voiding as compared to conventional solders, especially for bottom termination components (BTCs), which do not allow for proper outgassing of volatized flux. Its glossy, uniform flux coating eliminates the fluxing step. Combined with its durability, LV1000 can be integrated easily into automated assembly processes.

LV1000 technology consists of both a unique flux formulation and a coating process to produce flux-coated solder preforms that meet the tightest tolerances for flatness. This minimizes defects by ensuring that electronic components solder correctly.

For more information about LV1000, visit www.indium.com/LV1000.


Indium Corporation Launches New Indium Oxide

Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material that is insoluble in water and volatizes at 850°C.

When doped with tin oxide, IndiOx™ forms ITO, the material of choice to form transparent conductive oxide (TCO) layers in flat-panel displays and touch sensors for mobile devices. The ITO layer is deposited onto glass from a sputtering target that is manufactured from the ITO powder by sintering.   

Other uses for IndiOx™ include glass coloring, gassing suppression in alkaline batteries, and as an anti-arcing additive in high current electrical switches and contactors.

IndiOx™ is available in three powder types:

  • Type A – Crystalline: particle size distribution D10–D90 ranges from 0.8–38μm.
  • Type B – Fine: particle size distribution D10–D90 ranges from 0.5–6μm.
  • Type T – Target Grade: particle size distribution D10–D90 ranges from 0.1–7.5μm. The primary particle size is about 100nm.

For more information about Indium Corporation’s suite of compound materials, visit www.indium.com/indiox.

 

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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:: FINETECH Expands with New Customer Center in Amherst, New Hampshire

FINETECH, a leading provider of precision bonders and advanced rework equipment, announces its new, larger facility in Amherst, New Hampshire.  The stand-alone building houses the Finetech eastern sales and applications support team.  Its extensive equipment room features both R&D and production die bonders, as well as rework systems.  The systems are available for demonstration, customized training and sample bonding.


 
As FINETECH grows its production equipment segment, it understands the importance of local engineering support and having equipment onhand for a range of needs. The company‘s mission is to provide solutions for each stage of the customer journey - from R&D and prototype, to fully automated production.

Neil O’Brien, general manager, said, “The new building is helping us keep pace with our growth in North America.  We have the ability to showcase our full range of capabilites here and in our Gilbert, Arizona facility. It gives our customers convenient access to not only equipment, but application and technical resources.  Access to our  automated bonders (Femto2 and FineXT5205) has been in high demand.  By having these systems available, we have already partnered with customers to develop processes in next generation photonic assemblies, high density sensors, flexibly hybrid electronics (FHE), as well as implantable devices“.

About Finetech
Finetech is a leading manufacturer of equipment for manual and fully automatic high-precision bonding and component rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research. Corporate headquarters and main production are in Berlin, Germany. Sales and Technical support centers are located in Gilbert, Arizona; Amherst, New Hampshire; Shanghai, China; Kuala Lumpur, Malaysia; and Tokyo, Japan.  www.finetechusa.com.

 

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:: Issue 247 ::
August 9, 2019

Presidio Components

Gannon & Scott

TopLine