Corporate Bulletin
:: Corporate Member News ::

:: News from Technic (full story)

:: News from Indium Corporation (full story)

:: Biocompatible, Nanosilica Filled LED Curable Adhesive by Master Bond (full story)

:: Henkel Expands BERGQUIST® GAP PAD® Portfolio with New Ultra-Low Modulus Thermal Interface Materials (full story)

:: Recent Palomar Technologies News (full story)

:: Visit KemLab in Booth 65 at Device Packaging 2019 (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: News from Technic

Technic Announces Scientific Collaboration with Agilent Technologies on Semiconductor Grade Chemicals Trace Analysis

Technic, a leading global provider of semiconductor grade ultrapure chemical s, has announced a new collaboration with Agilent Technologies, a leading distributor of analytical and scientific instrumentation for achieving clean room ppt level metal trace analysis capabilities.

The collaboration will provide ongoing support to Technic utilizing the Agilent 8900 ICP-QQQ multi-element analyzer , and in turn, Technic will provide Agilent access to the company’s new metal- free clean room operation which will open in early 2019 at its Saint Denis facility. The new lab enables both Technic and Agilent to showcase the best- in- class quality control capabilities and instrumentation for semiconductor customers.

"We have worked with Agilent for many years and have a very good understanding of their products and services. We are excited to be adding their specialized, high-caliber equipment to our direct capabilities, such as the latest 8900 ICP/MS and the GC/FID-MS Intuvo for molecular and elemental analysis."

Samir SAFI
Head of Quality Control Department, Technic France

The new Agilent 8900-QQQ instrument will provide Technic with state-of-the-art sub ppb/ppt level capabilities for measuring 32S, 31P, 28Si, and 37Cl using mass shifting and filtering out interferences. This will enable Technic to control surfactant concentration in formulations at a precision never before seen. The Agilent 8900 ICP-QQQ delivers one of the lowest BEC ever achieved on a quad ICP/MS, providing more robust results and a much higher degree of accuracy.

Learn more

Technic Releases TechniClean IK73
Highly-Selective and Versatile Post-Etch Residue Cleaner

Technic has announced the release of TechniClean IK73, a post-etch residue cleaner with exceptional removal performance and selectivity to critical materials. TechniClean IK73 is specially formulated to target the selective removal of highly-inert chemical residues created during the patterning of high-k dielectric metal oxides including hafnium, zirconium and tantalum oxides. TechniClean IK73 functions well at room temperature and is easily rinsed. The process is suitable in immersion, batch-spray, and single-wafer chemical applications. TechniClean IK73 has been qualified and is in full-scale production at leading-edge semiconductor manufacturers around the globe. The ability to remove some of the toughest post-etch residues has made TechniClean IK73 an essential product for advanced semiconductor manufacturing processes.

To learn more about TechniClean IK73 and our full line of advanced semiconductor processing chemistry, visit us online at

Technic is a global supplier of advanced chemical solutions and controls for the semiconductor industry. The company manufactures a complete line of cleaners, photoresist strippers and metal etchants under the names TechniClean, TechniStrip® , and TechniEtch. Technic also manufactures fabrication and packaging chemistry marketed under the Elevate® brand name.

About Technic
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing, and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Learn more at

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:: News from Indium

Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste

Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.

Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction in the size of the largest voids, and minimized overall voiding.

Other Indium6.6HF benefits include:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • Exceptional printing process window:
    • High transfer efficiency
    • Long stencil life (up to 12 hours)
    • Excellent response-to-pause
    • Prints consistently at a wide range of speeds
  • High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation
  • Cleanable up to at least 72 hours after reflow

For more information about Indium6.6HF, visit:


Indium Corporation Announces Senior Level Promotions

Indium Corporation is proud to announce the promotion of three employees to high-level positions in their respective departments.

Scott Pringle has been promoted to Business Unit Vice President. Pringle will continue to be a member of the Management Team, with his new position bringing a focus on aligning the Global Account Sales and the China Field Sales organizations, as well as serving as leader and coordinator of the Asia Sales Leadership Team. Throughout his more than a decade at Indium Corporation, he has distinguished himself as an industry expert and built a strong global sales organization. He has broad and extensive international experience developing business in Europe, the Americas, and Asia.

Chris Bastecki has been promoted to the position of Director of Americas Sales and Global PCBA Marketing. Bastecki, who joined Indium Corporation in 2012, will now lead both the Americas sales and service organization, and the global PCBA product groups to create and execute successful sales strategies and sustained growth. He has more than 25 years of experience in electronics materials marketing, sales, and business management. Chris has a bachelor’s degree in metallurgical engineering from the University of Pittsburgh and an MBA from Carnegie Mellon University. He has participated in numerous leadership development programs at Harvard University and other institutions, as well as Six Sigma training.

Jonas Sjoberg has been promoted to Associate Director of Global Technical Service and Application Engineering. He provides direct management of the Asia Technical team, focusing on promoting career development among his team members through trade show participation and creation of papers for industry publications. Sjoberg also coordinates global technical initiatives with the other technical teams in Europe and the Americas. He joined Indium Corporation in 2014 and has more than 20 years of technical experience in the electronics industry, establishing himself as an industry expert.


Indium Corporation Names Silver Quill Award Winners

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.

Indium Corporation’s Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to reward employees for generating leading-edge research and thought-leadership technical content that addresses issues concerning customers in the electronics industry.

In 2018, three papers and their respective authors were recognized for their research and technical content:

The Silver Quill Paper of the Year, Impact on Stencil Quality on Solder Paste Printing Performance, was co-authored by Jeffrey Len, Technical Support Engineer, Malaysia; Leon Rao, Senior Technical Support Engineer, Eastern China; Evan Yin, Assistant Manager – Process Development Lab, Suzhou, China; and Wisdom Qu, Area Tech Manager, Eastern China. The paper was first published at the South East Asia Technical Conference on Electronics Assembly in Kuala Lumpur, Malaysia, May 2018. The paper examines how stencil quality impacts the screen printing process amid ongoing packaging and board-level assembly miniaturization trends.   

Two other papers were recognized with honorable mention awards:

D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding by Kimberly Flanagan, Technical Support Engineer, USA, and Greg Wade, Technical Support Engineer, Global Accounts. The paper examines why a D-PAK exhibits more voiding than other types of bottom termination components. It also looks at the physics behind D-PAK voiding to provide more insight on how to remedy the phenomenon. The paper was first published at IPC APEX Expo 2018, February 2018, in San Jose, California, USA.

Reinforced Solder Preforms for High-Reliability and Low Voiding was authoredby Tim Jensen, Senior Product Manager for Engineered Solder Materials (ESM); Sunny Neoh, Assistant Product Manager for ESM in Asia; and Adam Murling, Technical Support Engineer, Global Accounts. The paper examines the challenges of high power applications on solder joints, and identifies how reinforced solder preforms can address these issues. First published at SMTA PanPac , January 2018, in Kauai, Hawaii, USA.


Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.

Dr. Lee earned a Best of Track award for his paper Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications, which reported on the development, testing, and results of Indalloy®276, a lead-free solder alloy created to target wide service temperatures with high reliability.

For a look at additional papers authored by Dr. Lee and Indium Corporation’s other industry experts, visit

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, as well as high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.


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:: Biocompatible, Nanosilica Filled LED Curable Adhesive by Master Bond

Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system does not need a UV light for curing it is intrinsically more user friendly”, says Rohit Ramnath, Senior Product Engineer. “LED405Med has a nanosilica filler resulting in both lower shrinkage upon cure, as well as greater dimensional stability with a coefficient of thermal expansion of 35-40 in/in x 10-6/°C. This product cures to a hardness of 65-75 Shore D, indicating that it is not too stiff, thereby offering good toughness.”

LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60 Hz. It has good flowability with a viscosity of 2,000-8,000 cps and can be used for bonding, sealing and coating. LED405Med cures up to 0.125 inch thick and is suitable for small encapsulations involving optical assemblies or other sensitive components.

This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. LED405Med is serviceable from -60°F to +250°F and withstands gamma radiation as well as various chemical sterilants including EtO.

Master Bond LED Curing Adhesives

Master Bond LED405Med is a single component, LED curing adhesive, sealant, coating and encapsulating compound for medical device assembly. This nanosilica filled system offers high optical clarity, dimensional stability and electrical insulation properties. Read more about Master Bond’s LED curing adhesives at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:


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:: Henkel Expands BERGQUIST® GAP PAD® Portfolio with New Ultra-Low Modulus Thermal Interface Materials

Henkel Corporation today announced the addition of two ultra-low modulus BERGQUIST® GAP PAD® thermal interface materials (TIMs) to its award-winning line of high compliance thermal management products. BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM have been formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0 W/m-K, respectively.

“As densities increase with electronics miniaturization, maximizing heat dissipation while minimizing assembly stress on delicate components is challenging but essential for reliability,” says Danny Leong, Henkel Global Technology Manager, Thermal Products. “Our new ultra-low modulus TIMs provide this unique performance combination in custom-sized pads with easy handling to enhance process efficiency.”

BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are very soft pads with high conformability to rough or irregular surfaces, effectively filling intricate gaps and allowing for thorough wet out at the interface for maximum thermal transfer. Historically, marrying ultra-low modulus (Shore 000, ASTM D2240) properties with high thermal conductivity has been challenging at best. However, due to the advanced silicone-based resin formulation and filler package, the new BERGQUIST GAP PADs provide exceptionally low assembly stress alongside high thermal control.

Ideal for telecom and datacom applications such as high-end routers, switches, servers and base band units, the ultra-low modulus TIMs also deliver on manufacturers’ processability requirements. Easy-to-use, BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are naturally tacky on both sides. BERGQUIST GAP PAD TGP 6000ULM integrates fiberglass support with one side offering minimal tack for simple handling and rework. BERGQUIST GAP PAD TGP 7000ULM is supplied without fiberglass support and similar tackiness levels on both sides of the pad. Available in custom-cut shapes and sizes with top- and bottom-side protective liners, the ultra-low modulus BERGQUIST GAP PADs are ready for immediate use upon receipt and can be stored at room temperature.

Samples of the new BERGQUIST GAP PADs are available upon request. For more information about the latest materials or any of Henkel’s thermal management solutions, visit or call 1-800-347-4572.

About Henkel in North America
Henkel operates across its three business units – Adhesive Technologies, Beauty Care and Laundry & Home Care – in North America. Its portfolio of well-known consumer and industrial brands includes Schwarzkopf® hair care, Dial® soaps, Right Guard® antiperspirants, professional hair care brand Sexy Hair®, Persil®, Purex® and all® laundry detergents, Snuggle® fabric softeners as well as Loctite®, Technomelt® and Bonderite® adhesives. North America is an important region for Henkel: With sales of around 5.8 billion US dollars (5.2 billion euros) in 2017, North America accounts for 26 percent of the company’s global sales. Henkel employs more than 9,000 people across the U.S., Canada and Puerto Rico. For more information, please visit

About Henkel
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2017, Henkel reported sales of 22.6 billion US dollars (20 billion euros) and adjusted operating profit of around 3.9 billion US dollars (3.5 billion euros). Combined sales of the respective top brands of the three business units – Loctite, Schwarzkopf and Persil – amounted to 7.2 billion US dollars (6.4 billion euros). Henkel employs more than 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX. For more information, please visit

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:: Recent Palomar Technologies News

Finding the Right Solution to Achieve Gold Planar Bumps for Flip Chip Bonding with Challenging Specifications
The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. Achieving consistent, quality Au Planar bumps has been a challenge that the industry has been trying to meet for years. In this case study, we explore these shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights for flip chip applications and how to achieve them. Read the full blog:

Photonics Lights the Way for Smart Cities Around the World
Today, Singapore, London and Dubai lead the world when it comes to powering a world-class smart nation, bypassing tech-savvy capitals like New York, Paris and Beijing.
Singapore has been consistent in its efforts to deploy disruptive technologies to improve the life of citizens in areas such as mobility, transportation, energy, education, healthcare and public services. It is at the helm of developing these innovations, and today, it is common to see and hear of driverless cars, video streaming networks, telemedicine, and the coming roll out of 5G services. Read the full blog:

Subscribe to the PTI Blog! Join the industry peers who already have!
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:: Visit KemLab at Device Packaging 2019

Visit KemLab® at Booth #65. Check out the K-PRO Advanced Packaging Resist with film thicknesses up to 50 μm and formulated for easy removal.

KemLab® is a growing photoresist manufacturer and innovation company focused on quality and cost-competitive imaging materials used in the electronics industry.

KemLab® offers Positive and Negative photoresists for advanced packaging, MEMS & Microfluidics, integrated circuits, metal lift-off, LED, and sensor markets.

Twitter: @kemlabthinks
Phone: (781) 281-0174

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View the Corporate Bulletin Archives



:: Issue 237 ::
February 8, 2019

Presidio Components

Gannon & Scott