Corporate Bulletin
:: Corporate Member News ::

Be Sure to Visit the 66 Booths on Display at Device Packaging on March 5 (10:00am-6:30pm) and March 6 (10:00am-4:00pm) (view exhibitors)

:: MacDermid Alpha Announces the Release of MICROFAB® TS-650: Tin Silver Bump Metallization for WLP (full story)

:: Visit KemLab in Booth 65 at Device Packaging 2019 (full story)

:: Recent Palomar Technologies News (full story)

:: Visit Amkor Technology at Booth #37 during IMAPS DPC – and Meet Our Packaging Experts! (full story)

:: Visit PacTech at Booth #25 and find out more about our Equipment Manufacturing & Subcontracting Services (full story)

:: Visit Rudolph Technologies at the IMAPS Device Packaging exhibition! (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

Device Packaging 2019 Sponsors


Premier Gold 
Sponsor - EMD Performance Materials
Premier Gold Sponsor - XYZTEC
Premier Gold Sponsor - JCET Group
Premier Silver Sponsor: Amkor Technology
Premier Silver Sponsor: NAMICS
Premier Silver Sponsor: Cadence
Premier Silver Sponsor: Mentor Graphics
Premier Silver Sponsor: Xperi / Invensas
Corporate Sponsors
Corporate Sponsor - NGK NTK
Corporate Sponsor - DuPont Electronics & Imaging
SPTS - Corporate Sponsor
Mobile APP Sponsor: SETNA
MacDermid Alpha Electronics Solutions - Corporate Sponsor
Corporate Sponsor - Technic
Corporate Sponsor: Pac Tech
Corporate Sponsor: Evatec
Corporate Sponsor: Applied Materials
Additional Event Sponsors

Break Sponsor: Metalor

Coffee Break

Exhibit Reception Sponsor: JX Nippon Mining & Metals

Exhibit Reception

Notebook Sponsor: SMART Microsystems

Session Notebooks/Pens

Golf/Foundation Sponsors

"Birdie" Sponsor:

DPC/GBC Premier Sponsor: ASE US, Inc.

Hole: 5 - Closest to Pin

"Birdie" Sponsor:

EMD Performance Materials - Corporate Sponsor

Hole: 9 - Closest to Pin

"Birdie" Sponsor:

Premier Gold Sponsor - XYZTEC

Hole: 15 - Closest to Pin

"Birdie" Sponsor:

Premier Gold Sponsor - JCET Group

Hole: 7 - Closest 2ND SHOT

"Birdie" Sponsor:

Golf Hole Sponsor: Amkor Technology

Hole: 18 - Longest Putt

"Birdie" Sponsor:

DPC/GBC Premier Sponsor: NAMICS

Hole: 12 - Longest Drive

"Birdie" Sponsor:

DPC Premier Gold Sponsor: Cadence

Hole: 1

"Birdie" Sponsor (1 hole):

Premier Silver Sponsor: Mentor Graphics

Hole: 2

"Birdie" Sponsor:

Premier Silver Sponsor: Xperi / Invensas

Hole: 3

ASM Pacific - Hole Sponsor

Hole: 13

Golf Hole Sponsor: Advance Reproductions

Hole: 6

Golf Sponsor: NxQ
Mask Aligners

Hole: 8

Golf Hole Sponsor: Nikon

Hole: 10

Exhibit Reception Sponsor: JX Nippon Mining & Metals

Hole: 14

Golf Sponsor - Kite Rocket

Hole: 16

Golf Sponsor - SUSS Microtec

Hole: 17

Golf Hole Sponsor: Dixon Golf

Hole: 4 - Straight Drive Competition
Hole: 11 - Hole-in-One Competition

Official Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: MacDermid Alpha Announces the Release of MICROFAB® TS-650: Tin Silver Bump Metallization for WLP

MacDermid Alpha Electronics Solutions, announces the release of the MICROFAB® TS-650 process, a high speed tin silver bump metallization for bump, pillar and capping in wafer level packaging.  The TS-650 provides a highly smooth and uniform deposit for coplanarity at the package to substrate interface.  The lead-free tin-silver top layer applied by the process provides excellent morphology before and after the assembly reflow.  Customers combining the TS-650 with MacDermid Alpha‘s market leading copper pillar for FO-WLP technologies will achieve better process consistency and higher production speeds.

Eric Gongora, Director of Strategic Marketing for Semiconductor Solutions, noted, “We are excited to add TS-650 to our MICROFAB® family of chemistries. This allows our customers to plate their copper pillar stack with an optimally matched copper, nickel, and tin-silver plating scheme. No supplier offers the comprehensive portfolio of industry leading chemistries, innovative manufacturing processes and collaborative chemistry development – from front end to back end in the electronics supply chain.“

About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at

For more information on MICROFAB® TS-650 contact:
Eric Gongora
Director of Strategic Marketing, Semiconductor Solutions

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:: Visit KemLab in Booth 65 at Device Packaging 2019

Check out K-PRO Advanced Packaging Resist with film thicknesses up to 50 μm and formulated for easy removal. Visit KemLab® at Booth #65. 

KemLab® is a growing photoresist manufacturer and innovation company focused on quality and cost-competitive imaging materials used in the electronics industry.

KemLab® offers Positive and Negative photoresists for advanced packaging, MEMS & Microfluidics, integrated circuits, metal lift-off, LED, and sensor markets.

Twitter: @kemlabthinks
Phone: (781) 281-0174


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:: Recent Palomar Technologies News

Bridging the Valley of Death: Meeting Advanced Microelectronic and Photonic Packaging Needs
Over the past several years, R&D spending, innovation, and invention has increased in Asia as these economies become more developed and their technology prowess more sophisticated. Today, there is substantial demand for advanced photonics packaging process development to bridge between mini-production ramps and high-volume production in Asia. As technology development increases in Asia, it is not always feasible or necessary to ship new product introduction (NPI) materials and send NPI teams to the US from Asia to do process development and prototyping work. By partnering with a local expert in process development, prototyping, test and measurement, process maturation and a mini-production, companies in Asia can retain their NPI locally ensuring faster time to market, ramp-up, and success. Read the full blog:  

SST Vacuum Reflow Systems Delivers Multiple Model 3150 High Vacuum Sealing Furnaces
Palomar Technologies Inc., a global leader in total process solutions for advanced photonics and microelectronic device packaging announced today that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, has taken an order for multiple SST 3150 Vacuum Reflow Furnaces, which are used in the assembly of hermetically sealed, high reliability MEMS packages. These particular systems are for the assembly of IR microbolometers, which are the heart of an IR Imager that can be found in various IR cameras for a variety of applications.
A.J. Wilson, President of SST Vacuum Reflow Systems and CMO for Palomar Technologies commented, “In recent years, we have seen a sharp increase in the demand for IR microbolometers for various IR imaging applications, such as automotive hazard detection systems, security and video surveillance cameras, PVS (Personal Vision Systems), and virtual reality headgear. The IR image and detector market continues to expand into many other applications and we are excited to be a reliable supplier of the assembly solutions for this rapidly growing segment.” Read the full press release:  

Subscribe to the PTI Blog! Join the industry peers who already have!


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:: Visit Amkor Technology at Booth #37 during IMAPS DPC – and Meet Our Packaging Experts!

Amkor’s unique expertise in high-volume manufacturing techniques and the ability to solve the technological challenges facing the industry are among our greatest strengths. Customer demand for highly sophisticated products has made semiconductor packaging a vital contributor to system performance. As one of the world’s largest suppliers of outsourced semiconductor advanced packaging design, assembly and test services, Amkor helps make innovative technologies a reality.

Amkor offers more than 1,000 different package formats and sizes. Products range from traditional leadframe ICs for through-hole and surface mounting to the latest chip scale packages (CSP) and ball grid array (BGA) solutions required in high pin count and high-density applications.

Our diverse portfolio includes stacked die, wafer level, MEMS, flip chip, Through Silicon Via (TSV) and 2.5/3D packaging, allowing us to be a single source for many of our customers. We fulfill total semiconductor packaging requirements from legacy devices to System in Package (SiP) solutions. The availability of high-quality packaging services allows customers to focus their resources on semiconductor design and wafer fabrication while utilizing Amkor as their packaging technology innovator and test partner.

Amkor’s operations encompass more than 10M ft2 of floor space with production facilities, product development centers, sales and support offices strategically located in key electronics manufacturing regions. Our customers benefit from our extensive global footprint, enabling us to easily handle large orders and offer quick turnaround times.

Amkor works closely with substrate and software suppliers to drive next generation package design. Our design engineers are trained experts and experienced in the latest design tools and packaging technology. This enables our World Class Design Centers to reduce design cycle times and provide expert advice.

Consumers are demanding greater functionality and performance in a smaller space at a lower cost. Amkor is an industry leader in finding semiconductor packaging solutions to meet these complex requirements.

With global high-volume manufacturing, Amkor assembles a broad portfolio of packaging solutions including wirebond and flip chip using Pb-free and green packaging.

Amkor provides a complete range of semiconductor test services including various types of final, system level, wafer and strip testing and complete end-of-line services up to and including final shipping.
As the industry moves aggressively to advanced technologies such as 3D stacking of integrated circuits, the complexity of chip package interaction is increasing significantly. Companies look to Amkor to deliver end-to-end solutions that meet the requirements of a broad range of product designs.

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:: Visit PacTech at Booth #25 and find out more about our Equipment Manufacturing & Subcontracting Services

PacTech - Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: Manual & Automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders. SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG or ENEPIG for UBM (solder bumping) or OPM (wirebond). Other services include Electroplating, Laser Solder Jetting, Wafer Level Solder Balling, Re-passivation, RDL, Backmetal, Wafer Thinning, Wafer Dicing, Tape & Reel, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for electroless plating.

PacTech USA Inc.
328 Martin Avenue
Santa Clara, CA 95050
Phone: 408-588-1925
Booth: #25

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:: Visit Rudolph Technologies at the IMAPS Device Packaging exhibition!

Visit Rudolph Technologies at the upcoming IMAPS Device Packaging conference and exhibit in Arizona! Stop by booth #31 to talk all things advanced packaging and learn about the latest application challenges Rudolph has solved.
Rudolph provides process and control solutions for fan-out, panel, RDL, TSV, bumping, post-saw, and more.

Rudolph’s integrated process control solutions include combined 2D/3D inspection and metrology, post-saw dicing/chipping detection, residue detection, and interconnect metrology. Advanced ADC reduces operator review time, improving throughput.

Powerful fabwide software allows manufacturers to perfect yield with proactive optimization throughout the process and across the supply chain.

Rudolph’s innovative StepFAST Solution improves producitivity and reduces cost for panel lithography by correcting die shift and rotation without impacting throughput.  Learn how at booth 31.

We look forward to seeing you there!

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View the Corporate Bulletin Archives



:: Issue 238 ::
February 22, 2019

Presidio Components

Gannon & Scott