Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: FO-WLP Panel Production Becomes a Reality according to TechSearch International (full story)

:: Indium Corporation Expert to Present at IMAPS France Workshop (full story)

:: New Low Viscocity, Thermally Conductive Underfill Epoxy by Master Bond (full story)

:: Hermetic Solutions Group Highlights Medical Products, Services at IMAPS Medical Electronics 2019 (full story)

:: Kester Launches NP505-LT Solder Paste (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at blamm@imaps.org. You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: FO-WLP Panel Production Becomes a Reality according to TechSearch International

Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.   The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC.  Future applications under consideration for panel production include application processors, memory and RF modules.  TechSearch International, Inc. details these applications and analyzes monthly panel requirements and planned capacity.  Supplier plans are discussed and consortia activities are highlighted.   

One of the major market trends in wearable electronics is the shift to smartwatches, which have surpassed shipment numbers for wristbands.   Package trends for wearable electronic products are analyzed, including Apple’s new smartwatch using TSMC’s InFO and Samsung’s Galaxy using FOPLP.  The latest trends in augmented reality (AR) and virtual reality (VR) headsets are discussed.  A detailed analysis of the change in packages from the previous generation HTC Vive VR system is presented.    

A detailed analysis of the OSAT financials is provided with regional growth documented.  Board and substrate material requirements for 5G applications are presented.

The latest Advanced Packaging Update is a 45-page report with full references and an accompanying set of 46 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch

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:: Indium Corporation Expert to Present at IMAPS France Workshop

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS France’s 14th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb. 6-7 in La Rochelle, France.

Jensen’s presentation, Innovative Liquid Metal Interface Technology for TIM2 Applications, will examine methodologies and techniques that can enable liquid metal to be used in a higher array of TIM2 applications. Jensen will also address factors limiting the adoption of liquid metal TIMS, including the difficulty of applying a significant amount of liquid metal in high volume and containing the liquid metal under the heat-sink.

Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers to troubleshoot and optimize SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, and thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.


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:: New Low Viscocity, Thermally Conductive Underfill Epoxy by Master Bond

Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.

EP3UF-1 has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], making it an effective thermal interface material. It contains a special filler with a small particle size. This allows it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. It offers superior electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as a high dielectric strength of 450 volts/mil (for 1/8” thick test specimen), both measured at 75°F.

As a single component system, EP3UF-1 is more convenient to handle, apply and store than typical two component adhesive systems. It has an unlimited working life at room temperature and cures in 20-30 minutes at 250°F, or in 10-15 minutes at 300°F. EP3UF-1 is available for use in 10 cc syringes and 30 cc syringes, which are compatible with automated dispensing systems.

Master Bond Adhesives for Electronic Applications

Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. Read more about Master Bond’s adhesives for electronics packaging and assembly at https://www.masterbond.com/industries/adhesives-assembly-electronic-devices or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

 

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:: Hermetic Solutions Group Highlights Medical Products, Services at IMAPS Medical Electronics 2019

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 22-23, 2019, at the Handlery Hotel, San Diego, CA. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices.

The Hermetic Solutions Group, a premier sponsor at the event, will have representatives ready to discuss the range of product offerings for this market including: hermetic implantable feedthrus, hermetic implantable packages, getters, preforms, thermal tabs and custom surgical device tubing products. The company will also highlight its service offerings in this area including: ISO Class 7 Cleanroom capabilities, final packaging and EtO sterilization, device assembly and its comprehensive suite of laser services.

The Hermetic Solutions Group is ISO:9001:2015, AS9100D, ISO 13485, and NADCAP certified and has been producing  components for cardiac devices, cochlear implants, neuro-stimulators, implantable drug pumps, and surgical tools for more than 40 years.

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:: Kester Launches NP505-LT Solder Paste

NP505-LT is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger packages and boards. The defects caused by the warpage may decrease board reliability and increase in rework. NP505-LT is designed to reduce warpage inherent to board-to-package. For additional information on this product including technical and safety data sheets, please visit https://www.kester.com/products/product/np505-lt-solder-paste.

For any questions or additional information, please contact: Fil Marcial-Hatfield, Global Product Manager at fmarcial@kester.com.

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:: Issue 236 ::
January 11, 2019

Presidio Components

Gannon & Scott

TopLine