Corporate Bulletin
:: Corporate Member News ::

:: TechSearch International Releases Latest Advanced Packaging Update - Market and Technology Trends Report (full story)

:: News from Indium Corporation (full story)

:: Master Bond Supreme 3HTS-80 and EP93AOFR Product Information (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: TechSearch International Releases Latest Advanced Packaging Update - Market and Technology Trends Report: Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry.  Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling.  TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out on substrate, and organic solutions such as Intel’s EMIB.  Homogeneous packaging solutions such as AMD’s multichip package are also discussed.  The report explains the reason for adoption in each application and provides market projections.  A roadmap of future 3D packaging trends is presented and new concepts such as Intel’s Foveros are discussed.
Changes in RF package adoption are examined.  Antenna-in-Package solutions for 5G are introduced and a market forecast is provided.  A special section examines trends in 3D printing, highlighting printed antennas.    

The latest Advanced Packaging Update is a 41-page report with full references and an accompanying set of 48 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see  Follow us on twitter  @Jan_TechSearch

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:: News from Indium Corporation

Indium Corporation Celebrates 85 Years of Technology Innovation and Growth

Indium Corporation employees around the world joined in celebrations this week to mark the company’s 85th anniversary.

Indium Corporation was founded in 1934 in Utica, NY by Dr. William S. Murray—a man who dedicated his life to investigating and developing the uses of indium metal. Since those early days, the company has continued to lead and support the advancement of technologies on which we rely today.

“We believe that materials science changes the world,” said Ross Berntson, President and COO. “Almost every great advancement in technology can be attributed to a breakthrough in materials science. Since the company’s founding, Indium Corporation has been driven by its curiosity to look at materials from a different perspective—transforming the ordinary into the unexpected. Today our products enable leading edge technology such as aerospace, medical, and telecommunications electronics.”

Today, the company has over 900 employees and 12 sites around the world.

“In an industry that thrives on rapid change, Indium Corporation has been a constant, stable source of quality assembly materials and we will continue to do so for a very long time,” Berntson said.

Indium Corporation Launches New Hybrid Metal Thermal Interface Materials

Indium Corporation has released m2TIMTM – a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.

Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.

Other m2TIMTM benefits include:

  • Availability in a variety of alloys, including InGa and InGaSn
  • Extraordinary wetting ability to both metallic and         non-metallic surfaces
  • Extremely low interfacial resistance at surfaces
  • Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms

For more information about Indium Corporation’s line of thermal interface materials (TIM) products, visit

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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::Master Bond Supreme 3HTS-80 and EP93AOFR Product Information

Silver Conductive, One Component Epoxy Cures at 80°C

Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature. “While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath, Senior Product Engineer. “Curing at such temperatures makes this system advantageous for bonding applications involving heat sensitive substrates.”
Supreme 3HTS-80 has a volume resistivity of less than 0.05 ohm-cm. Upon curing, it exhibits a hardness of 50-60 Shore D and a high thermal conductivity over 20-25 BTU•in/(ft2•hr•°F) [2.9-3.6 W/(m•K)]. This 100% reactive epoxy bonds well to metals, composites, glass, ceramics, and many plastics. As a toughened system, Supreme 3HTS-80 can withstand thermal cycling and shock with a service operating temperature range from -100°F to +350°F [-73°C to +177°C].
Supreme 3HTS-80 is a thick paste with a specific gravity of 3.9 that can be readily dispensed from a syringe. Storage in a conventional refrigerator is recommended as this system does not require freezing. This compound is packaged in syringes or glass jars with common sizes including 20 grams, 50 grams, 100 grams, 1 pound and multiple pound units.

Master Bond Silver Filled Conductive Adhesives

Master Bond Supreme 3HTS-80 is an electrically conductive epoxy system containing silver fillers. It is suitable for applications where the substrates or components being bonded are sensitive to heat and require a combination of electrical conductivity and thermal cycling resistance. Read more about Master Bond’s silver filled conductive adhesives at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:


Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm. EP93AOFR has an easy to use 1:1 mix ratio by weight and a good flow profile with a mixed viscosity of 30,000-150,000 cps.”
The Federal Aviation Regulations (FAR) Standard 14 CFR 25.853(a) test is typically used for determining material compatibility for various components inside aircrafts. This material has met and exceeded the requirements for the vertical ignition test where castings of the epoxy EP93AOFR were exposed to flames for 60 seconds. The results show that it took under 4 seconds to extinguish the flames, well under the allotted 15 seconds permitted by the test. The second part of this test measures how far the flame spreads. EP93AOFR exhibited a burn length of just 1.2 inches, well under the maximum allowed of 6 inches.
EP93AOFR bonds well to a variety of different substrates including metals, composites, glass, ceramic, FR4 and other plastics. It is serviceable from -80°F to +300°F [-62°C to +149°C] and offers good chemical resistance to water, fuels, oils, and many common solvents. This system is available for use in ounce, ½ pint, pint, quart and gallon kits. It can also be purchased in premixed and frozen syringes.

Master Bond Thermally Conductive Adhesives

Master Bond EP93AOFR is a flame retardant epoxy system for encapsulating, potting, bonding, sealing, and coating. It is suitable for applications that require a combination of thermal conductivity along with superior protection from flames and heat. Read more about Master Bond’s thermally conductive adhesives at or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email:




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:: Issue 239 ::
March 15, 2019

Presidio Components

Gannon & Scott