Corporate Bulletin
:: Corporate Member News ::

:: Recent Palomar Technologies News: SST Vacuum Reflow Systems Presenting Advanced Solutions for Power Module Manufacturers (full story)

:: World’s smallest active NFC sensor module by DYCONEX (full story)

:: Heraeus develops world’s first gold-coated silver bonding wire for semiconductor technology (full story)

:: Indium Corporation Launches New Water-Soluble, Halogen-Free Flux (full story)

:: Corporate Fast Links ::

Click below to learn more about this issue's featured corporate members.

All IMAPS Corporate Members will have the opportunity to place their logo/link in the "Fast Links" section. To have your company logo included in an upcoming "Fast Links," email your logo as a JPEG or GIF to Brianne Lamm at You should also identify which URL to link your logo to. If you have questions, contact Brianne. There is no charge for this service, it is offered as part of the corporate membership benefits.

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm,, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.

:: SST Vacuum Reflow Systems from Palomar Technologies Presenting Advanced Solutions for Power Module Manufacturers

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, will be presenting at the iMAPS-UK Microtech 2019: Power in Packaging on April 4, 2019 in Cambridge, UK. 

The presentation will evaluate an assembly process using a flux-free, vacuum pressure solder reflow system to deliver a reliable, low-void attachment of key components commonly used to assemble IGBT/Power Modules. Read the full press release:  

Subscribe to the PTI Blog! Join the industry peers who already have!
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:: World’s smallest active NFC sensor module by DYCONEX

DYCONEX AG, an MST company,  has developed a novel approach to miniaturized, hermetic and highly reliable smart sensor modules with diameters down to 6 millimeters. They are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.

The tiny modules are based on Liquid Crystal Polymer (LCP), a thermoplastic dielectric material with very low water absorption (< 0.04%), high chemical stability and low thermal expansion. LCP is best suited both as a substrate material and as an encapsulate. The permeability for water and gases is the lowest among all polymeric materials. Soak tests with an embedded, moisture sensitive test chip have demonstrated long term stability (> 14 months) and sufficient hermeticity for exposures in harsh environments.

Processing techniques for LCP substrates are the same as for other substrate materials. Resolution of lines, spaces and vias are comparable, multilayer structures can be built and part of the metal layers can be used to form a coil for NFC (Near Field Communication). The substrates can be assembled with standard SMT processes as well as connected and sealed without the need for any adhesives by benefiting from its thermoplastic properties. LCP is a homogenous material and can be easily machined with UV lasers with a precision down to the micrometer scale, for example to integrate cavities and openings for recessed components.

For further information on the sensor modules please contact Dr. Eckardt Bihler, Business Development & Program Manager at DYCONEX. He will also hold a presentation on this subject at Smart Systems Integration 2019.

Meet DYCONEX at the following upcoming events:

Smart Systems Integration: April 10-11, 2019
Hotel Barceló Sants, Barcelona, Spain
Booth H-17

SMT connect: May 7-9, 2019
Messezentrum Nuremberg, Germany 
Booth 218E, Hall 5

T4M: May 7-9, 2019
Messe Stuttgart, Germany 
Swiss Pavilion Booth 30.6, Hall 9D

With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in applications where miniaturization, increased functionality, quality and the highest level of reliability play a role. Headquartered in Bassersdorf, DYCONEX has 180 employees and the company is a member of the Micro Systems Technologies Group.

About the Micro Systems Technologies group
The Micro Systems Technologies group consists of four high-tech companies that offer innovative components and services for high-tech industries that demand exceptional performance, quality and the highest levels of reliability such as med tech and aerospace.
The globally active companies that make up the MST group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

Grindelstrasse 40
8303 Bassersdorf
Phone +41 (43) 266 1100

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:: Heraeus develops world’s first gold-coated silver bonding wire for semiconductor technology

Heraeus AgCoat Prime ensures high performance at significantly lower cost

Heraeus, the global technology company, announced that the development of the industry’s first gold-coated silver bonding wire for the semiconductor industry. The new product, AgCoat Prime, is a gold-coated silver bonding wire that provides the bondability and reliability of gold wire, while enabling significant net cost savings.

In the highly competitive memory market, no adequate substitute for gold bonding wire has been developed. Memory devices in the semiconductor industry rely heavily on gold for wire bonding. However, today’s electronics devices are hungry for ever more memory, with big data storage driving demand. At the same time, the need for cost-efficient production has led manufacturers to seek alternatives to gold bonding wires. Heraeus AgCoat Prime is the world's first solution to this challenge.

AgCoat Prime is a silver alloy bonding wire coated with a layer of gold. “Bondability and reliability performance are the most important aspects of this development,” says Eric Tan, Director, Product Management at Heraeus Electronics. “Customers can be sure that our new product achieves the same performance as gold wires at significantly lower cost.”

Alternative to gold bonding wire

Because the specifications of AgCoat Prime are closely aligned to gold bonding wire, no inert gas is required, so no investment or changes to production equipment and facilities are necessary. It offers essentially a plug-and-play solution for ball bonding machines – and at every level, Heraeus supports customers in optimizing their AgCoat Prime applications. In 2018, gold made up 36 percent of the global bonding wire market. For many semiconductor applications, silver, bare copper and copper-palladium wire have become established alternatives. Gold coated silver wire now opens the door to create a similar change within the memory device market.

The solution to change

With AgCoat Prime Heraeus has developed the first viable solution to cutting costs while maintaining the required quality. As a leading supplier of bonding wires, Heraeus again leads in providing a new solution for customers in the memory market.

About Heraeus

A globally leading technology group, Heraeus is headquartered in Hanau, Germany.

Founded in 1851, it is a family-owned portfolio company which traces its roots back to a pharmacy opened by the family in 1660. Today, Heraeus combines businesses in the environmental, energy, electronics, health, mobility and industrial applications sectors. In the 2017 financial year, Heraeus generated revenues of €21.8 billion. With approximately 13.000 employees in 40 countries, the FORTUNE Global 500-listed company holds a leading position in its global markets. Heraeus is one of the top 10 family-owned companies in Germany. With technical expertise, a commitment to excellence, a focus on innovation and entrepreneurial leadership, we are constantly striving to improve our performance. We create high-quality solutions for our clients and strengthen their long-term competitiveness by combining unique material expertise with leadership in technology.




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:: Indium Corporation Launches New Water-Soluble, Halogen-Free Flux

Indium Corporation has released TACFlux® 066HF, a new water-soluble halogen-free (ORH0) hand soldering and rework flux. 

TACFlux® 066HF is compatible with typical Sn/Pb and Pb-free alloys for PCB assembly applications. TACFlux® 066HF joins Indium Corporation’s versatile offering of specialty fluxes designed to provide solutions for current and evolving industry challenges. Benefits include:

  • Halogen-free per IEC 61249-2-21 test method EN14582
  • Outstanding wetting performance in air or nitrogen atmospheres
  • Shelf life of up to 6 months

For more information about TACFlux® 066HF, visit

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.



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:: Issue 240 ::
March 29, 2019

Presidio Components

Gannon & Scott