Corporate Bulletin
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:: Corporate Member News ::
Micross

:: KemLab Inc. Photoresists Awarded ISO 9001:2015 Certificate (full story)

:: Heraeus Presents World’s First Gold-Coated Silver Bonding Wire for Semiconductor Technology to Ensure High Performance at Significant Lower Cost (full story)

:: Visit the MST Group at Booth #315 and Find Out More About Our Flexible and Rigid Ultra-Thin Base Materials Taking PCB Miniaturization to the Next Level (full story)

:: Hary Manufacturing Inc, Manufacturer of Precision Screen Printers for the Printed Electronics Industry, Debuts Updated Website Showing Videos of Popular Models (full story)

:: Advanced Gold-Tin Electroplating Process from Technic in Spotlight with Growth of 5G, DCI, and LiDAR (full story)

:: YINCAE’s New NC 256 Zero Residue Flux & New High Purity Liquid Encapsulant SMT 158HA (full story)

:: Cicor Group Introduces Printed Electronics at IMAPS 2019 (full story)

:: Royce Instruments' New AP+ with Automatic Inspection (full story)

:: Corporate Fast Links ::
PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Sponsor - SemiDice / Analog Devices

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - 3M
Networking / Event Sponsors:

Lunch & Break Sponsor:

EMD Performance Materials - Corporate Sponsor

Lunch Sponsor:

Lunch Sponsor: MRSI

Keynote/Plenary Sponsor:

Keynote Sponsor: SAMTEC

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Student & Diversity Programs Sponsor:

Honeywell - Student Programs Sponsor

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Spectrum Semiconductor Materials

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

   
Golf Sponsors
Technic - Golf Hole Sponsor
Golf Hole Sponsor: Amkor Technology
Stellar Industries - Golf Hole Sponsor

Break Sponsor: Geib Refining

Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC
Media Sponsor: US Tech
Media Sponsor: Semiconductor Digest
Media Sponsor: Electronics Cooling

 

 

:: Sponsors and Exhibitors at IMAPS 2019::


THANK YOU IMAPS 2019 SPONSORS AND EXHIBITORS
Visit exhibitors and sponsors on Tuesday, October 1st and Wednesday, October 2nd.

Click here to download complimentary exhibits visitor pass.

EXHIBIT HALL OPEN
Tuesday, October 1: 11:00 AM - 5:00 PM
Wednesday, October 2: 10:00 AM - 6:15 PM
Happy Hour in Exhibits: 5:00 PM - 6:15 PM

Company Booth Confirmed
5N Plus Micro Powders 434
Accretech America Inc.
215
AdTech Ceramics 216
Advanced Dicing Technologies, Inc. 436
Advanced MicroAnalytical 412
AI Technology Inc. 316
Air Products 511
Ajinomoto Fine-Techno USA Corporation 618
AMADA MIYACHI AMERICA 314
Appli-Tec, Inc. 438
ASE Group 206
ASM Pacific Technology 411
Axus Technology 406
BESI North America, Inc. 227
Binghamton University 224
Boschman (Neu Dynamics & Sales and Service Inc.) 601
BSET EQ 326
BTG Labs 410
BTU International 313
Cadence Design Systems 519
Canon USA 424
centrotherm 517
Cicor Group 219
Control Laser Corporation 524
CWI Technical Sales 413+415+417+419
Datum Alloys 429
DfR Solutions 407
DuPont Electronics & Imaging 512
ECSI Fibro Tools, Inc.  414
EPP GmbH 214
F&K Delvotec 622
Ferro Corporation 400
Finetech 422
Forgione Engineering Inc 600
FRT of America LLC 623
Geib Refining 322
Haiku Tech, Inc. 231
Hary Manufacturing Inc. 218
Heidelberg Instruments 529
Henkel Corporation 408
Heraeus Electronics 308
Hesse Mechatronics, Inc. 311
Hi-Rel 213
IBM Canada 335
Indium Corporation 507
Integra Technologies, LLC 401
JCET 300
JFE Shoji Electronics Corporation 427
KEMLAB INC. 226
King Industries 525
Kulicke & Soffa Industries 522
Kyocera International, Inc. 518
LFG Micro 330
LINTEC OF AMERICA, INC. 230
LPKF Laser & Electronics 225
Materion Corporation 329
Metalor Technologies USA 318
Micro Systems Technologies, Inc. 315
MicroChem Corp 324
MicroCircuit Laboratories  514
MicroScreen LLC 430
Micross 230
Midas Technology 328
Mini-Systems, Inc. 327
MRSI Systems 306
Nanosystec Inc. 416
Neu Dynamics (Sales and Service Inc. & Boschman) 601
NorCom Systems, Inc. 209
Nordson DAGE 210
Nordson SONOSCAN 223
Noritake 515
NTK Technologies, Inc. 207
Oneida Research Services, Inc. 217
Palomar Technologies Inc. 212
Particle Measuring Systems 428
PCB Technologies Inc 339
Perfection Products Inc. 317
PlasmaTreat 431
Protavic America 509
Pyromet 508
Quik-Pak 238
Raytheon 426
Reldan Metals Co, Division of Abington Reldan Metals LLC 425
Riv Inc - Precision Printing Screens 325
Rochester Electronics 501
Royce Instruments 506
Rudolph Technologies 423
Sales and Service Inc. (Neu Dynamics & Boschman) 601
Samtec 307
SemiDice, Inc. 319
Silitronics 229
SMART Microsystems 523
Specialty Coating Systems 531
Stellar Industries Corp 331
StratEdge Corporation 234
SUSS MicroTec Inc. 228
SVXR 510
Technic 323
TechSearch International, Inc. 312
Torrey Hills Technologies, LLC 236
TRIMECH 513
UnitySC 500
UTZ Technologies 619
YINCAE Advanced Materials, LLC. 530
ZESTRON Americas 211

 

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: KemLab Inc. Photoresists Awarded ISO 9001:2015 Certificate

KemLab Inc., a global manufacturer of advanced photoresists and electronic chemicals, announced the successful completion of its International Organization for Standardization (ISO) 9001:2015 audit for its manufacturing and distribution facilities in Woburn, MA. In June 2019, KemLab Inc. was audited and certified as meeting the ISO requirements for the Design, Development, Manufacturing, Distribution, and Sale of Photoresist and Specialty Chemicals.

Recognized worldwide as the international benchmark for quality within an organization, ISO 9001 is achieved by implementing a Quality Management System (QMS) across the company that matched the ISO 9001 quality management principles. Achieving an ISO 9001:2015 certification means we have been independently assessed and recognized for implementing QMS requirements across all areas of our business.

Click here to learn more and see the certificate.

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:: Heraeus Presents World’s First Gold-Coated Silver Bonding Wire For Semiconductor Technology To Ensure High Performance At Significant Lower Cost

In the highly competitive memory market, no adequate substitute for gold bonding wire has been developed – until now. With AgCoat Prime, Heraeus Electronics introduces gold-coated silver bonding wire that provides the bondability and reliability of gold wire, enabling significant net cost savings.

Memory devices in the semiconductor industry rely heavily on gold for wire bonding. However, today’s electronics devices are hungry for ever more memory, with big data storage driving demand. At the same time, the need for cost-efficient production has led manufacturers to seek alternatives to gold bonding wires. Heraeus has now developed the world's first solution to this challenge: AgCoat Prime.

AgCoat Prime is a silver alloy bonding wire coated with a layer of gold. “Bondability and reliability performance are the most important aspects of this development,” says Eric Tan, Director, Product Management at Heraeus Electronics. “Customers can be sure that our new product achieves the same performance as gold wires at significantly lower cost.”

Alternative to gold bonding wire
Because the specifications of AgCoat Prime are closely aligned to gold bonding wire, no inert gas is required, so no investment or changes to production equipment and facilities are necessary. It offers essentially a plug-and-play solution for ball bonding machines – and at every level, Heraeus supports customers in optimizing their AgCoat Prime applications.

In 2018, gold made up 36 percent of the global bonding wire market. For many semiconductor applications, silver, bare copper and copper-palladium wire have become established alternatives. Gold coated silver wire now opens the door to create a similar change within the memory device market.

The solution to change
With AgCoat Prime Heraeus has developed the first viable solution to cutting costs while maintaining the required quality. As a leading supplier of bonding wires, Heraeus again leads in providing a new solution for customers in the memory market.

For more information click here:
More Information on AgCoat Prime

 

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:: Visit the MST Group at Booth #315 and Find Out More About Our Flexible and Rigid Ultra-Thin Base Materials Taking PCB Miniaturization to the Next Level 

Micro Systems Technologies Group (MST) invites you to the upcoming IMAPS Microelectronics exhibition in Boston. Please visit us at booth #315.

DYCONEX, one of the MST companies, features ultra-thin base materials in flexible and rigid technology enabling highly reliable, thinner PCBs.
Almost all markets are experiencing increasing demand for smaller, thinner and lighter electronic devices. Although a great deal of miniaturization can be achieved in the X and Y directions, the technology is beginning to reach its limits. Another level of compactness is possible by using rigid and flexible ultra-thin base materials enabling higher-density designs with enhanced miniaturization in the Z direction. A 6-layer system with ultra-thin base material is approx. 50% thinner compared to a 6-layer system using standard material.
To find out more about these advanced materials please contact our exhibition team at IMAPS Microelectronics.

The MST Group is your one-stop partner for turning any of your ideas into an innovative solution in the field of highly reliable and miniaturized electronics.
Our solutions are targeted at the requirements of high-tech industries demanding exceptional performance and the highest level of reliability. The capabilities include design service, manufacturing of organic and ceramic substrates, component qualification, semiconductor packaging, advanced board assembly and module qualification.

ITAR compliance. Micro Systems Technologies, Inc. is a U.S. incorporated business that is registered with the U.S. Department of State as compliant to ITAR (International Traffic in Arms Regulations) and EAR (Export Administration Regulations) and has a manufacturing license agreement (MLA) in place with DYCONEX to build substrates compliant to ITAR and EAR.

Our exhibition team looks forward to meeting you.
For an appointment on site, kindly contact us at: sales.msti@mst.com
www.mst.com

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:: Hary Manufacturing Inc, Manufacturer of Precision Screen Printers for the Printed Electronics Industry, Debuts Updated Website Showing Videos of Popular Models

HMI screen printers, Lebanon, NJ formerly AMI/Presco  continues to improve our visitors website experience by providing professional machine video of their popular model, MSP-485, including the manual vision alignment system . HMI recently began collaborating with a well known video production company.  The first of several videos is now on HMI’s home page www.hmiprinters.com .  Please visit the website to see the various model screen printers offered.  In the upcoming weeks additional videos will be uploaded.  These have been proven to be useful to our customers when trying to determine which model best suits their needs.   



Hary Manufacturing Inc. is a premier supplier of precision screen printers for the thick-film, hybrid and other precision deposition applications.  Complimenting products include infrared conveyor dryers and substrate handling automation for a wide range of applications.  HMI offers spare parts and technical support for AMI Presco printers as well as HMI equipment.  Our consumable product lines provide printing squeegees and lint-free cleaning cloths to satisfy the production needs of our customers.  For more information please call us at (908) 722-7100 or visit our website: www.hmiprinters.com.

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:: Advanced Gold-Tin Electroplating Process from Technic in Spotlight with Growth of 5G, DCI, and LiDAR

Technic is reporting increased market demand of its advanced gold-tin electroplating process, Elevate® AuSn 8020. The company attributes the increased demand to a significant expansion in the manufacture and use of 5G capable wireless devices, LiDAR remote sensing technology, and Data Center Interconnect (DCI) technology. 

Due to advances in 5G, LiDAR, and DCI, requests for high-reliability solder that meets new manufacturing requirements have surged substantially. Gold-Tin solder has become the standard in integrated photonic interconnections due to several unique properties that make it an ideal process. These include favorable soldering temperature (300 – 310 oC), high strength, fluxless assembly, and optimum wetting performance.

Technic attributes a number of factors responsible for making the Elevate® AuSn 8020 process the clear choice for Gold-Tin deposition. First, Elevate® AuSn 8020 deposits alloy at and near the eutectic of 80%Au-20%Sn from a single solution. Secondly, the process offers a cost-effective alternative to other industry-standard solder deposition processes such as preforms and evaporation. Finally, unlike other Gold-Tin deposition processes, Elevate® AuSn 8020 does not have any feature or thickness limitations.

“It’s an exciting time for integrated photonics and the implementation of 5G and other applications requiring photonic integrated circuits. With this rapid development, we are also seeing that standard solders such as SnAg are reaching their limitations. Elevate® AuSn 8020, has the proven track record as an ideal option for companies that are building devices from high-reliability substrates such as indium phosphide and need a solder deposit with excellent thermal and mechanical properties.”

Anthony Gallegos
Global Product Manager, Semiconductor Technology

Elevate® AuSn 8020 is currently in production on many tool platforms globally as well as laboratory wet benches.

 

About Technic
Technic Inc. is a Rhode Island based, privately held corporation with over 950 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing, and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

Learn more at www.technic.com or contact us at (401) 781-6100.

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:: YINCAE’s New NC 256 Zero Residue Flux & New High Purity Liquid Encapsulant SMT 158HA

YINCAE’s New NC 256 Zero Residue Flux

YINCAE is excited to announce that we have successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process.  NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill.  To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing.  Using NC 256 and SMT 158HA together can eliminate cleaning completely.  NC 256 can be used for mass reflow process or rework process. 

Additional information on the NC 256 is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly designed for large components with small bumps and for applications with strict environmental regulations.

SMT 158HA has been particularly designed to be used for large component applications as it is highly viscous and allows air to easily escape from the gap during the underfilling process. The slow cure process allows air bubbles to migrate to the edge and escape. Though these processes generally do not significantly impact most components, they require more time to complete for large chips, and the design of SMT 158HA creates the conditions to lead to a void free underfill. As a result, components will exhibit lower thermal stress, and thus improved reliability for devices.

In additional to numerous processing benefits, SMT 158HA also offers many material benefits. SMT 158HA has a low CTE (20 ppm/K), a high glass transition temperature (156°C), is fast flowing, and offers a high adhesion strength.

For more information on YINCAE’s SMT 158HA underfill, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

* * * * * * * * * *
 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 

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:: Cicor Group Introduces Printed Electronics at IMAPS 2019

Cicor was the first supplier in Europe and one of the first worldwide to open an application laboratory for printed electronics in Bronschhofen (Switzerland) in the first quarter of 2019 and will continue to invest in its expansion over the next two years.

An increasing number of electronic devices in more and more application areas necessitates the development and industrialization of new manufacturing technologies. Flexible additive manufacturing processes play a central role in substrate manufacturing and connection technology. The unique printing technology used by the Cicor Group enables the printing of a wide variety of conductive, non-conductive and biocompatible materials on a wide variety of substrates and forms. In addition, there are new possibilities for interconnection technologies that can lead to performance improvements and cost optimizations.
We look forward to meeting you at our booth 219 for more information on printed electronics as well as on our complete portfolio.

The Cicor Group is a globally active development and manufacturing partner with innovative technology solutions for the electronics industry. With about 2100 employees at ten production sites, Cicor offers highly complex printed circuit boards, hybrid circuits with thin-film and thick-film technologies, printed electronics, as well as comprehensive electronic manufacturing services (EMS) including microelectronic assembly and plastic injection molding. Cicor supplies customized products and services from design to the finished product from one source.

 

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:: Royce Instruments’ New AP+ with Automatic Inspection

Royce Instruments is excited to announce that we have successfully developed and automated inspection package for the AP+ with sub-micron resolution and multi-spectrum top surface illumination.

Application Details:

  • For automated visual inspection of top die surface and one edge surface.
  • Inspection to be performed during the AP+'s die sort process after pick and before placement to output.
  • Allows devices to be screened for:
    • Singulation and wafer thinning defects (cracks, edge chip outs).
    • Foreign material detection.
    • Device feature inspection.
    • Dimension verification.
  • Die sorted to output based on inspection results.
  • Inspection results included in AP+ run log for complete traceability.

Technical Specifications:  

  • Die placed on inspection pedestal with X-Y-theta adjustment for die position correction prior to the inspection of 0.03 degrees for theta and 10 microns for X and Y (to ensure edge image is in focus), up to 360 degree rotation and 1.0 inch travel in X-Y directions possible.
  • One camera for top surface inspection and one camera for edge inspection (both cameras are 21 MP, 16x speed, monochrome).
  • Ultra High-resolution, low-distortion, telecentric macro lens for top and edge inspection offers approx. 4x optical magnification for sub-micron pixel resolution, allowing features as small as 1.68 microns to be detected (assuming a minimum of 2 pixels per feature).
  • Top illumination: Multi-Spectrum LED Illuminator, available peak wavelengths UV (405 nm), Blue (457 nm), Green (527 nm), Orange (600 nm), Red (660 nm), Far Red (730 nm), Infrared (860 nm), and White (600 nm) (one wavelength at a time).
  • Side illumination: Red LED Ring Light with Diffusion Plate.
  • Image export to USB 3.0 HDD (SSD) or SD card.
  • Inspection controlled by Keyence CV-X platform, which includes:
    • Variety of inspection tools for ease of programming including tools to detect flaws, presence/absence, count, OCR, measurements and dimensions, etc.
    • Image processing filters allow for more robust performance of inspection tools, for example the subtraction filter compares current image to reference image and highlights differences.
    • Ability to perform a multi-capture inspection where each image can have different capture settings (including different illumination wavelengths) and different programmed inspection tools.
  • System can be configured with one camera and lens for applications where only top surface inspection is needed.

For more information on the automated inspection package, or to learn more about what Royce Instruments offers, please email us at: customerservice@royceinstruments.com

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:: Issue 250 ::
September 27, 2019

Presidio Components

Gannon & Scott

TopLine