Corporate Bulletin
NEWS | FAST LINKS
:: Corporate Member News ::
Micross

:: YINCAE’s New NC 256 Zero Residue Flux & New High Purity Liquid Encapsulant SMT 158HA (full story)

:: Indium Corporation Expert to Present at EMPC 2019 (full story)

:: TechSearch International: High-Performance IC Substrate Manufacturing at an Inflection Point (full story)

:: Visit Rudolph Technologies at the 52nd IMAPS Symposium in Boston (full story)

:: Particle Measuring Systems Cleanroom Contamination Control Course Announced (full story)

:: KemLab K-PRO Photoresist for Packaging & Electroplating (full story)

:: MRSI Systems welcomes Hendry He as China Country Sales Director (full story)

:: Cicor Group Introduces Printed Electronics at IMAPS 2019 (full story)

 

:: Corporate Fast Links ::
PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Sponsor - SemiDice / Analog Devices

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - 3M
Networking / Event Sponsors:

Lunch & Break Sponsor:

EMD Performance Materials - Corporate Sponsor

Lunch Sponsor:

Lunch Sponsor: MRSI

Keynote/Plenary Sponsor:

Keynote Sponsor: SAMTEC

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Spectrum Semiconductor Materials

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

other
sponsorships
available
   
       
Golf Sponsors
Technic - Golf Hole Sponsor
Golf Hole Sponsor: Amkor Technology
Stellar Industries - Golf Hole Sponsor
holes available
Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC
Media Sponsor: US Tech
Media Sponsor: Semiconductor Digest
Media Sponsor: Electronics Cooling

 

 

:: More Information ::

:: Only news about IMAPS Corporate Members will be published in this Corporate Bulletin. Please send your electronic press releases to Brianne Lamm, blamm@imaps.org, at least 3 days before the first or fifteenth of every month to be considered for publishing in this bulletin. All corporate bulletin questions - news releases, advertising, logo inclusion, IMAPS membership, and more - should be addressed to Brianne.


:: YINCAE’s New NC 256 Zero Residue Flux & New High Purity Liquid Encapsulant SMT 158HA

YINCAE’s New NC 256 Zero Residue Flux

YINCAE is excited to announce that we have successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process.  NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill.  To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing.  Using NC 256 and SMT 158HA together can eliminate cleaning completely.  NC 256 can be used for mass reflow process or rework process. 

Additional information on the NC 256 is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

 

YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly designed for large components with small bumps and for applications with strict environmental regulations.

SMT 158HA has been particularly designed to be used for large component applications as it is highly viscous and allows air to easily escape from the gap during the underfilling process. The slow cure process allows air bubbles to migrate to the edge and escape. Though these processes generally do not significantly impact most components, they require more time to complete for large chips, and the design of SMT 158HA creates the conditions to lead to a void free underfill. As a result, components will exhibit lower thermal stress, and thus improved reliability for devices.

In additional to numerous processing benefits, SMT 158HA also offers many material benefits. SMT 158HA has a low CTE (20 ppm/K), a high glass transition temperature (156°C), is fast flowing, and offers a high adhesion strength.

For more information on YINCAE’s SMT 158HA underfill, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

* * * * * * * * * *
 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

   ^ Top

:: Indium Corporation Expert to Present at EMPC 2019

Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference, September 16-19, in Pisa, Italy.

Wilson’s presentation, Substrate to Baseplate Attach: A Novel Solder Solution with an Embedded Metal Matrix for Enhanced Reliability, discusses the importance of strong, uniform bondline control between the power device and substrate to achieve high mechanical reliability. This is especially important due to power electronics’ changing requirements for functional reliability, particularly in automotive markets. Wilson also examines how Indium Corporation’s InFORMS® technology provides a stable and reliable drop-in solution.

Wilson is an Applications Engineer for Indium Corporation’s European operations. He provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and engineered solders to customers in electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. Wilson has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

   ^ Top

:: TechSearch International: High-Performance IC Substrate Manufacturing at an Inflection Point

Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing.  Increasing I/O counts are driving substrate layer counts to more than 20.  Larger die sizes and multiple die mounted on the substrate are driving the need for larger body sizes, up to 100 mm x 100 mm.  Some companies use a silicon interposer with multiple redistribution layers (RDLs) to provide the connection between logic and high bandwidth memory (HBM).  Others use fan-out on substrate with RDLs.  A number of companies are considering new RDL on organic solutions with 2µm line width and spaces and Intel is exploring an expanded role for its Embedded Multi-die Interconnect Bridge (EMIB).  Several companies are making investments in fab-like processing equipment for the next generation IC packaging substrates. These developments are described and a forecast for high-density substrates is provided in TechSearch International’s newest Advanced Packaging Update.  

TechSearch International’s annual survey on substrate design rules is highlighted, with special coverage of suppliers of laminate flip chip BGA and CSP substrates worldwide.  The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish.

The latest Advanced Packaging Update is an 85-page report with full references and an accompanying set of 42 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.  Follow us on twitter  @Jan_TechSearch

 

   ^ Top

:: Visit Rudolph Technologies at the 52nd IMAPS Symposium in Boston

Visit Rudolph Technologies at the upcoming IMAPS International Symposium on Microelectronics conference and exhibit in Boston September 30 - October 3! Stop by booth #423 to talk all things advanced packaging and learn about the latest application challenges Rudolph has solved.

Join Rudolph’s Dr. Priya Mukundhan after the Welcome Reception on Monday, September 30 for a special talk about breaking through barriers to expand opportunities. Dr. Mukundhan is Rudolph Technologies’ Director of Metrology Product Management and will share her unique perspective about how a diverse and inclusive workplace fuels innovation.



Plan to attend several of the Rudolph speeches taking place Wednesday, October 2, including:

  • FOWLP / FOPLP Lithography Solutions to Overcome Die Placement Error, Predict Yield, Increase Throughput and Reduce Cost (Oct 2 @ 9:30am)
  • Improve Control Amidst Die Shrink, 3D Package Complications (Oct 2 @ 9:30am)
  • Automated Optical Inspection (AOI) for FOPLP with Simultaneous Die Placement Metrology (Oct 2 @ 10:00am)
  • Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D Stacking (Oct 2 @ 11:00am)

Rudolph Technologies collaborates with its customers around the globe to develop innovative, data-driven solutions that increase the yield and profitability of microelectronics manufacturing operations. Rudolph’s comprehensive, state-of-the-art inspection, measurement, data analysis and lithography solutions for semiconductor manufacturing and advanced packaging processes accelerate product and process development, increase yields and reduce costs to enable its customers to be first-to-market with premium products at premium prices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

We look forward to seeing you in Boston!

   ^ Top

:: Particle Measuring Systems Cleanroom Contamination Control Course Announced

Particle Measuring Systems announces that the next Particle College will be held in Boulder, CO in September 2019.

Particle College, a course teaching contamination monitoring to the Electronic / Semiconductor and Life Sciences / Pharmaceutical Industries, will be held in Boulder, CO on September 25-26, 2019. Particle Measuring Systems has been hosting this intensive 2-day training course for over 20 years. Ten industry leading instructors are scheduled to present and be available to answer one on one questions with attendees.

Particle College attendees are divided into three tracts to best identify needs of the attendees and provide thorough and relevant training. Tracks are divided by industry (Electornics and Life Sciences), with the Electronics track further divided into Air and Liquids:

  1. Electronics/ Semiconductor Track:
    1. Air Focus: Cleanroom particle counting and molecular monitoring; facility monitoring.
    2. Liquid Focus: Particle counting in chemicals and water. 
       
  1. Life Sciences / Pharmaceutical Track
    Particle counting, microbial monitoring, laboratory water particles, facility monitoring, data management, data interpretation, risk assessment overview, understanding and meeting regulatory requirements.

Attend to learn about industry best practices, understand your data, and network.

Early bird discounted pricing is available until August 23rd.

Learn more or register.

About Particle Measuring Systems
Particle Measuring Systems Inc. (PMS), a subsidiary of Spectris plc, is a global technology leader in contamination monitoring, the inventor of laser particle counting, and is now the leading provider of solutions for monitoring and controlling many forms of contamination that impact companies that manufacture in ultra-clean environments.

For more information on PMS, visit pmeasuring.com.

   ^ Top

:: KemLab K-PRO Photoresist for Packaging & Electroplating

K-PRO is an advanced packaging positive photoresist for use in bumping, plating, TSV, and advanced packaging applications. It offers high sensitivity, high throughput, and excellent process latitude. KemLab delivers better photoresists for a lower price.  See K-PRO and other high quality, low-cost photoresists at www.KemLab.com.

 

   ^ Top

:: MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our customer’s needs.

MRSI is expanding globally in the die bonding market with the support of our Swedish parent company, Mycronic. Hendry is joining the team at a busy and exciting time for MRSI, as our growth continues. “Joining a market leader that continues to adapt to the changing needs of its customers through significant new product launches is a great opportunity,” said Hendry He.

Hendry spent the past 18 years working in the microelectronics/optoelectronics industry including advanced photonics holding senior positions in the areas of sales management, technical service, and process engineering at First Technology, a subsidiary of Sojitz Group, Plasmatreat Trading Shanghai Co., Ltd, ASM Pacific, Shanghai, and Vishay Passive Components, Shanghai Co., Ltd.

“Hendry will be an asset to the MRSI team. He has a deep understanding of automation and broad exposure to multiple market applications,” said Daniel Crowley, Vice President of Sales, MRSI Systems.

 
About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products.  With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com 

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com

 

   ^ Top

:: Cicor Group Introduces Printed Electronics at IMAPS 2019

Cicor was the first supplier in Europe and one of the first worldwide to open an application laboratory for printed electronics in Bronschhofen (Switzerland) in the first quarter of 2019 and will continue to invest in its expansion over the next two years.

An increasing number of electronic devices in more and more application areas necessitates the development and industrialization of new manufacturing technologies. Flexible additive manufacturing processes play a central role in substrate manufacturing and connection technology. The unique printing technology used by the Cicor Group enables the printing of a wide variety of conductive, non-conductive and biocompatible materials on a wide variety of substrates and forms. In addition, there are new possibilities for interconnection technologies that can lead to performance improvements and cost optimizations.
We look forward to meeting you at our booth 219 for more information on printed electronics as well as on our complete portfolio.

The Cicor Group is a globally active development and manufacturing partner with innovative technology solutions for the electronics industry. With about 2100 employees at ten production sites, Cicor offers highly complex printed circuit boards, hybrid circuits with thin-film and thick-film technologies, printed electronics, as well as comprehensive electronic manufacturing services (EMS) including microelectronic assembly and plastic injection molding. Cicor supplies customized products and services from design to the finished product from one source.

 

   ^ Top

 

View the Corporate Bulletin Archives

 

 


:: Issue 249 ::
September 6, 2019

Presidio Components

Gannon & Scott

TopLine