to the inaugural issue of the IMAPS Corporate Bulletin. This electronic
be dedicated to news and information for and about
the IMAPS Corporate members. The
IMAPS Corporate Bulletin will run on or about the 1st and 15th
of each month.
component of this Bulletin will be electronic press releases we
receive from our Corporate Members. We will run press releases
and photos of their products along with any other pertinent news.
This is not a guarantee that everything that is sent to us will
be printed. IMAPS reserves the right to determine what the content
of each Corporate Bulletin will be. Please send your press releases
via e-mail to firstname.lastname@example.org.
you will find a section entitled "Corporate Fast Links." In this
section, we will feature different corporate member logos each
issue, with links directly to the company's homepage. To have your
company logo included in an upcoming "Fast Links", contact
Rayma Gollopp at email@example.com or
|:: Corporate Member News ::
Introduces New 353M Double-Coated Acrylic Adhesive Tape -- Formaldehyde-Free
Pressure Sensitive Tape Composition (full story)
:: AIM Appoints
Global Tech Sales & Services as Manufacturers’ Representative
in Mexico (full story)
Cookson Group Plc Announces Sale Of Specialty Coating Systems For
$55.5m (full story)
Appoints OEM Account Manager (full
Lead-free Compatible Surface Mount Adhesives to Optimize High
Speed Assembly Processes (full story)
presents Premier DDf Ultra Direct Die Feeder (full
Corporation Introduces Pb-Free Transition Wave Solder Flux (full
:: NxGen Electronics
Organization Announcement (full story)
:: SUSS MicroTec's
NC-1 Non-Contact System Wins International Award (full
Corporate Fast Links ::
below to learn more about this issue's featured corporate members.
All IMAPS Corporate
Members will have the opportunity to place their logo/link in the
"Fast Links" section. To have your company
logo included in an upcoming "Fast
contact Rayma Gollopp at firstname.lastname@example.org or
More Information ::
:: For advertising opportunities, please contact Ann Bell at email@example.com or 202-528-8717.
:: To have your
company logo included in an upcoming "Fast Links", contact
Rayma Gollopp at firstname.lastname@example.org or
:: For comments and questions about this e-mail newsletter, please
contact Brian Schieman at email@example.com or 202-548-8715.
|Adchem Introduces New 353M Double-Coated Acrylic Adhesive Tape
-- Formaldehyde-Free Pressure Sensitive Tape Composition
Adchem Corporation, a leading manufacturer of innovative,
pressure-sensitive adhesive tape systems, introduces its new
353M Double-Coated Acrylic Adhesive Tape System. 353M is formaldehyde-free
and combines the quick-stick properties of rubber-based systems
with the temperature performance of acrylic systems. Engineered
for a wide-range of industrial tapes for substrate-bonding
applications, 353M is ideal for low surface energy materials
and foams such as cross-linked polyethylene, low perms, ethers
new 300 Adhesive Series, 353M maximizes performance and optimizes
economics by incorporating a differential
caliper coating of 1.7 mils on the exposed side and 1.3 mils
on the liner side and typical peel values of 72 oz. per inch
width on the exposed side and 64 oz. per inch on the wide on
the liner side. Several liner options are available including
55 lb. densified Kraft, 74 lb. polycoated paper, 12 point board
and a 2-mil PET liner.
information, please visit www.adchem.com.
AIM Appoints Global Tech Sales & Services
as Manufacturers’ Representative in Mexico
is pleased to announce the appointment of Global Tech Sales & Services as manufacturers’ representative
for AIM’s complete line of solders and related assembly
materials in southern and central parts of Mexico. Global Tech
Sales & Services forms yet another link in the global
sales and technical support of the AIM line of assembly
Global Tech Sales & Services is a well-known manufacturers’ representative
dedicated serving the electronics manufacturing industry by
providing training, consulting, technical service, parts and
equipment sales. Their technical staff has years of experience
and the skills needed to provide the best service to the industry.
Global Tech Sales & Services may be contacted via email
at firstname.lastname@example.org and can be visited on the internet
In 1997 AIM opened the first manufacturing facility for electronic-grade
solder materials within Mexico. Today, AIM-Soldadura de Mexico
in Cd. Juarez services a significant part of the growing electronics
assembly industry of Mexico.
|Cookson Group Plc Announces Sale Of Specialty Coating
Jersey City, NJ, January 3, 2006 -- Cookson Group
plc (Cookson), the leading materials science company, announces
30 December 2005 it sold Specialty Coating Systems (SCS),
a business which forms part of the Assembly Materials sector
of Cookson’s Electronics division, to Bunker Hill Capital
for US$55.5 million (£32.3 million*). The consideration
was satisfied by way of an immediate cash payment of US$54.0
million (£31.4 million*), with an additional US$1.5
million (£0.9 million) to be paid upon closing of the
sale of the SCS China business in early 2006. The consideration
will be subject to completion of balance sheet adjustments
with respect to working capital and capital expenditure,
which are not expected to be material.
sale of SCS is part of Cookson’s strategy of achieving
progressive debt reduction, in part, through non-core business
disposals, and brings the proceeds from disposals announced
in 2005 up to the £100 million targeted by the end
of 2006. “This measure is part of the Division’s
on-going effort to increase focus on its core technologies.
SCS is an excellent business with both strong financial and
product technology foundations, however its future growth
is not strategically aligned with Assembly Materials Group’s
markets,” noted David Zerfoss, President Cookson Assembly
SCS comprises a group of companies and business assets with
its main operations in the USA, Europe and Asia-Pacific.
Its primary business is the service application of Parylene,
a specialty conformal coating, principally for use in medical,
electronic and automotive applications.
2005, Cookson announced a target of raising over £100
million from disposal proceeds by the end of 2006. In the
six month period to 30 June 2005, proceeds from disposals
totaled £13 million. Furthermore, on 15 December it
was announced that a conditional agreement had been entered
into to sell Cookson’s Laminates business for US$91
million (£53 million*). On completion of that disposal,
(expected in February 2006) together with some further property
disposals completed recently and including the proceeds from
this transaction, Cookson will have generated disposal proceeds
of over £100 million.
on the sale of SCS, Nick Salmon, Chief Executive of Cookson
Group plc, said, “SCS is a good quality
business, as reflected in the price achieved. However, it
does not fit strategically with our core electronics business,
and the sale represents further significant progress in terms
of our strategy of progressive debt reduction. Following
the recent announcement regarding the sale of our Laminates
business, this deal means we have achieved our strategic
goal of raising £100 million through disposals, a year
ahead of schedule.
strategic plan also involves achieving significant improvements
in profitability, and our third quarter trading
update in early November demonstrated that we are making
solid progress in this regard as well.”
|Deweyl Appoints OEM Account Manager
Fielitz has been appointed OEM Account Manager for DeWeyl
will be based in Arizona. Todd brings 18+ years of
experience in semiconductor and microelectronic assembly packaging
technology and technical sales to his new position.
the announcement, David Pasfield, DeWeyl Tool's Director
of Sales & Marketing, stated that "Todd's considerable
experience on the manufacturing floor as well as on the side
of selling assembly products, in particular his familiarity
with wire and die bonding equipment, will be a real asset to
We look forward to the benefit of his experience and skills
and welcome him to the DeWeyl Tool family."
Lead-free Compatible Surface Mount Adhesives to Optimize High
Speed Assembly Processes
|Following a period
of extensive lead-free evaluation trials, the electronics group
of Henkel has revealed that selected Loctite® Chipbonders® are
not only capable of running lead-free, but are designed to optimize
lead-free processes, eliminating chip loss and saving components
by low temperature curing systems. The trials involved testing
a range of Loctite Chipbonder adhesives on ‘difficult to
bond’ components. Using Loctite Chipbonder test boards,
the trials employed both lead-free and tin-lead dual wave solder
machines using a range of Multicore® fluxes. The results
proved that Chipbonders 3609, 3616, 3621, 3627 and 3629 are optimized
for lead-free compatibility.
temperatures of lead-free wave soldering processes reduce
strength of adhesives. In order to overcome
poor hole fill and wetting, the contact time on the solder
wave is often increased and the wave shape more turbulent.
This has an additional impact on the adhesive’s performance.
Especially where non VOC-free, means alcohol-based fluxes,
are in use the chemical resistance of adhesives used in lead-free
processes needs to be significantly higher.
“With the deadline to Go-Lead-free now less than 9 months
away, manufacturers around the world are currently optimizing
their processes for effective operation in these conditions,” comments
Matthias Brachmann, Application Engineer Europe, Henkel. “Lead-free
is already having a significant impact on a range of materials,
including Surface Mount Adhesives (SMA). Ultimately, SMAs need
to be able to withstand considerably greater levels of thermal
and chemical stress in order to prevent chip loss and component
movement. Following Henkel’s recent lead-free evaluation
trials, the Loctite Chipbonder range is currently being well
received by manufacturers managing the transition to lead-free,
whilst seeking to maintain optimal high speed assembly processes.”
of the recent trials showed that Loctite 3609 is ideal for
general purpose high speed dispensing,
boasting a high wet strength and long machine on stencil life.
Loctite 3616 was proven to be primed for high speed printing,
whilst Loctite 3621 was revealed as being the top-of-the-range
choice for dispense jetting. Meanwhile, Loctite 3629 low temperature
cure SMA for dispensing and ProFlow printing was shown to reduce
manufacturing costs by curing at 120°C instead of 150°C
and saving temperature sensitive components at the same time.
An additional feature is that Loctite 3629 turns fluorescent
when uncured for cure visibility. “In combination, the
lead-free compatible Loctite Chipbonder range presents Henkel
customers with Surface Mount Adhesives for every manufacturing
environment,” concludes Matthias Brachmann.
|Hover-Davis presents Premier DDf Ultra Direct Die
The Semiconductor Feeding Solutions Group of Hover-Davis Inc.,
the leader in design and manufacturing of component delivery
systems for the circuit board assembly industry, presents the
latest addition of its Direct Die Feeding product line, the DDf
Ultra. The DDf Ultra is capable of feeding a wide range of bare
die and flip chips with high throughput, and can be mounted on
almost every placement machine.
As a complement
to the DDf, which has been an industry leading die feeding solution
for the past four years, the performance of DDf Ultra is optimized
around the handling of small flip chips. Upon release, the DDf
Ultra is capable of feeding die down to 0.5 mm sq. with a throughput
exceeding 6,000 die/hour with smaller die sizes and higher throughputs
Heitmann, Director of the Semiconductor Feeding Solutions
Group, said, “We have seen a rapid expansion in the number
of applications requiring volume assembly of die below 1 mm
sq., driven by RFID and LED technologies. These potential customers
require very low assembly costs and have very high volumes.
By combining our DDf Ultra with a state-of-the-art SMT chip
shooter, we can create a “die shooter” or “flip
chip shooter,” which is essentially new class of die
assembly solution. We believe these solutions have the capability
of offering our customers unprecedented reductions in assembly
cost, which in turn will aid in the proliferation of new products
|Indium Corporation Introduces Pb-Free Transition
Wave Solder Flux
Indium Corporation introduces WF-9942, a powerful new Wave
Solder Flux that offers three important features:
• It is No-Residue and No-Clean.
• It works in both mixed-technology and through-hole applications.
• It addresses the Pb-Free transition question, as it can be used with
both Pb-Free and SnPb solder
Flux WF-9942’s wide process window offers
excellent solderability, superior hole fill, and reduced solder
balling on all surface finishes. This formulation’s tremendous
thermal stability accommodates the increased temperatures used
in the Pb-Free wave soldering process.
Indium Corporation Product Manager, Leo Devine, said, “WF-9942
is a great resource for people facing the Pb-Free soldering
transition. They can now purchase
one flux that satisfies their cumulative no-clean, mixed-technology, and Pb-Free/SnPb
requirements. This truly compliments the complex requirements that the market
faces in these times.”
|NxGen Electronics Organization Announcement
NxGen is pleased to announce the following promotion and organization
changes, effective immediately:
Kron is promoted to Vice President of Sales and Operations.
Kevin will be responsible for managing NxGen’s rapid
future planned growth. In addition to developing business
at new accounts in existing and emerging markets, he will
for Operations and Program Management.
brings to this position broad operations experience from
the EMS and OEM manufacturing segments, as well as a comprehensive
understanding of the service needs of our customer base and
our operational capabilities.
|SUSS MicroTec's NC-1 Non-Contact System Wins International
SUSS MicroTec AG has announced that the world's first and only
non-contact probe system, the NC-1, has been honored with the "Best
in Test" award from the leading industry journal Test & Measurement
World. As one of twelve products selected by the editors, it
is the only probe system to be presented with the award, which
recognizes particularly innovative and useful test products.
"SUSS MicroTec is honored to have one of its products
selected as 'Best in Test' for 2006," states Dr. Claus
Dietrich, Managing Director of the Test Systems division at
SUSS MicroTec. "This shows that we are capable of offering
the latest and most innovative technology for design and
test engineers working on the most advanced devices in the
The NC-1 Non-Contact System uses a patented technique to acquire
signals from very small features without loading the circuit
under test or relying on optical emissions. The NC-1 supplies
both voltage and timing information, and the integrated atomic
force probe enables deep sub-micron scanning and positioning.
To extract measurements from the device, the tip of the probe
is stimulated with electrical pulses after being placed above
the area of interest. The forces generated between the tip
and the device under test are then measured and analyzed by
the NC-1 software, and the signal voltage waveform is extracted.
This data is presented to the user in an easy-to-read format.
"Our editorial panel was pleased to select the NC-1 as
one of our Best in Test products for 2006," said Test & Measurement
World Chief Editor Rick Nelson. "Its novel approach to
acquiring voltage and timing information without physical or
electrical contact should prove to be valuable in failure analysis
and other applications," he added.
Issue 1 ::
February 1, 2006