|:: Corporate Member News ::
Finetech Appoints Illinois and Wisconsin Representatives (full
Thermally Conductive Adhesive from Henkel Selected for APEX’s
Innovative Technology Showcase (full story)
Corporation Celebrates 72nd Anniversary (full story)
Announces Deliveries of UV DPSS Laser GaAs and GaP Wafer Dicing Systems (full story)
Asymtek Opens New Facilities in China (full
MicroTec and Instrument Systems Announce Alliance Wafer-level LED
Test Experts (full story)
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Finetech Appoints Illinois and Wisconsin Representatives
Inc. has announced that it has named Hattas and Associates
Plus as representatives for Illinois and Wisconsin. Hattas and Associates and Technology
Plus work together in partnership to represent Illinois and Wisconsin
Hattas and Associates is a manufacturers' representative company
dedicated to providing customers with production equipment,
services and products, including SMT and microelectronics assembly,
from quality suppliers worldwide.
Associated with Hattas and Associates is Technology Plus,
offering complementary assembly equipment as well as test equipment
to meet the electronics industry needs.
and Lee each have more than 25 years experience in consultative
capital equipment sales. Technology Plus mutually covers IL/
WI/IA and in addition MN.
are pleased to have such experienced partners,” said
Chris Underhill, general manager. “Dave, Lee and their
technical staff have numerous years of experience supporting
their customers’ assembly processes. Hattas and Associates
and Technology Plus are ready to immediately assist our Illinois
and Wisconsin customers, providing the lowest cost of ownership
process for assembly operations.”
Thermally Conductive Adhesive from Henkel Selected for APEX’s
Innovative Technology Showcase
recognized as an industry leader in materials development
and formulation, the electronics group of Henkel was again
awarded with top honors for yet another innovative material
solution. At the recent APEX show in Anaheim, California,
Henkel’s Loctite® 3876 was chosen to be part of
show organizer IPC’s (Association Connecting Electronics
Industries) Innovative Technology Showcase. As defined by
the host of the contest, those products that are selected
represent a real, relevant value to the electronics manufacturing
supply chain and deliver a new idea or practice that achieves
novel functional capability.
on proven proprietary Bead-on-Bead cure technology, Loctite
3876 is a new no-mix, no measure two-part thermally conductive
adhesive. A revolutionary concept in the bonding of heat-dissipating
electronic devices to heat sinks or spreaders, Loctite 3876
offers superior bond strength within seconds of assembly.
The low viscosity of the material removes the need for meter-mix
dispense systems and gives manufacturers an extremely wide
traditional methods of bonding heat dissipating components
and electrical devices required pre-mixing or solvent activated
systems, Loctite Bead-on-Bead technology enables manufacturers
to apply each part independently to the component so that
mixing occurs only when the two items to be bonded are joined
together. With a high thermal conductivity of 1.75W/m°C,
Loctite 3876 offers a 40% improvement in cooling performance
over previous products. Fast fix and cure rates allow for
increased throughput, while extensive testing has confirmed
the product’s high environmental resistance and suitability
for a range of manufacturing conditions.
are honored that IPC has chosen Loctite 3876 for this year’s
Innovative Technology Showcase,” says Doug Dixon of
the electronics group of Henkel. “Bead-on-Bead technology
represents a major advancement in adhesives development and
provides Henkel customers with superior, advanced thermal
management products as they transition to smaller, more functional
devices with increasing heat generation. Henkel is delighted
that IPC has recognized these achievements with its selection
of this product for this highly-coveted honor.”
|Indium Corporation Celebrates 72nd Anniversary
In March 1934, Indium Corporation was founded
in Utica, NY, USA. From a start-up business in a garage in
Utica, NY, Dr. William S. Murray (President), J. Robert Dyer,
Jr. (Vice President) and Daniel Gray (Research), revolutionized
the solder and indium chemical worlds.
For the past 72
years, Indium Corporation has been a world leader in the
manufacture of standard and specialty solders,
Pb-free alloys, and solder fabrications, including: solder
pastes, solder wire, solder ribbon, solder foil, solder preforms,
and solder fluxes. The company also produces thermal interface
materials, underfill materials, die-attach materials, and
related polymers for the electronics assembly industry. In
addition, Indium Corporation is the world’s premiere
refiner, producer, and fabricator of indium and indium chemicals.
Where Indium Began in 1934
with manufacturing facilities in China, Singapore, the United
Kingdom, and the USA, and with sales offices at several locations
throughout the world, Indium Corporation continues to provide
customers with the comprehensive solutions that combine award-winning
products, an extensive knowledge and service base, and technologies
to optimize finished goods reliability.
|JPSA Announces Deliveries of UV DPSS Laser GaAs and GaP Wafer Dicing
P Sercel Associates (JPSA) has begun shipping solid state
UV laser wafer dicing systems
that include new features
and process innovations that solve problems associated with
GaAs and GaP contamination. JPSA recently shipped multiple
ChromaDice™ UV laser wafer processing systems to major
GaAs wafer producers, featuring JPSA’s ProtectoLED® Technology,
a proprietary, patent-pending system based on a water-soluble
protective coating that prevents contamination of the wafer
during the dry-etch process. In addition to the established
process, the shipments also included a patent pending development
for containing and removing toxic by-products of laser processing
GaAs and GaP wafers. Multiple orders of this GaAs dicing
system have been received from other manufacturers.
the announcement, Jeffrey P. Sercel, President, said, “Our
scribing results have been consistently excellent with this
new process, which effectively removes any concerns about
dry-etch contamination and toxic laser ablation by-products.
always offered the finest resolution laser scribing technology
available, which further reduces the amount of heat input
into the wafer during cutting and scribing and reduces the
of material removed during the process. The customer has
the option of using an in-house scrubber, or a small filter
to remove the waste materials for easy disposal, depending
IX-300 ChromaDice™ system operates at cut rates
up to 150mm/second on GaAs wafers, with kerf widths of typically
down to 2.5µm with JPSA's patent-pending high-resolution
JPSA’s IX-300 ChromaDice™ system can process wafers up to 6"in
diameter, and uses efficient, cost-saving UV-DPSS laser technology at a choice
of either 355nm or 266nm wavelengths. JPSA ChromaDice™ technology is
now available in the high-volume, high duty cycle IX-300 format or the smaller
lower duty cycle and lower cost IX-200 package.
Asymtek Opens New Facilities in China
announces the opening of two new facilities in China: a customer
applications lab in Guangzhou and a new
office in Beijing. These new locations join Nordson Asymtek’s
existing facility in Shanghai to provide a strong applications
and technical support network for all market segments and regions
in China. Local representatives Electronic Scientific Engineering
(ESE), D-TEK, Leeport, Kankun Trading Company and Antais Electronics
Technology (ATS) all attended the grand opening ceremonies
engineering staff at Guangzhou provides applications evaluations,
equipment demonstrations and process development for its
customers. The 100 square meter lab is well equipped with
dispensing and coating systems, plus the latest valves and
jetting technology. The facility also offers on-site equipment
service and training.
Beijing office has dedicated technical and sales staff
for optimal customer service in the Northern region. Along
local representative Antais Electronics Technology’s
well-established customer support network, Nordson Asymtek’s
customers are assured to receive products with efficiency
and value-added service. For more information, contact Luke
Regional Sales Manager, at 86-20-8554-9996, or email@example.com.
and Instrument Systems Announce Alliance Wafer-level LED
SUSS MicroTec and Instrument Systems announced their partnership
today for developing a next-generation, high-throughput test
system for LED devices at wafer level. It will enable manufacturers
to test up to 70,000 LED dies per hour.
demand for LED devices is growing exponentially as the
devices replace older technologies in everyday applications.
This means that time-to-market and production costs for an
LED device are critical for the manufacturer. In order to achieve
cost-effective production, manufacturers are increasingly using
on-wafer testing to prevent the packaging of bad devices -
a costly error. Additionally, speed is critical for meeting
the demands of the consumer on time.
new test system from SUSS MicroTec and Instrument Systems
is being designed to meet these demands from LED manufacturers. "We
did not simply combine the fastest spectroradiometric LED measurement
equipment with the industry's leading high-speed probe system.
With this innovative solution, we are leveraging our combined
know-how in LED testing to optimize throughput, achieving speeds
never seen before," said Dr. Thomas Attenberger, LED-Product
Manager at Instrument Systems.
fast and accurate BlueRay™ probe system
from SUSS will be fully integrated with the high-precision
optical measurement equipment from Instrument Systems using
a high-speed software and communication architecture. The system
is semiautomatic, but can be upgraded to a fully-automated
system in the field. This means that production ramp-ups no
longer need lengthy equipment changeovers.
"We are excited to have Instrument Systems as our partner," said
Dr. Claus Dietrich, Division Manager of Test Systems at SUSS
MicroTec. "They share our commitment to innovation, quality
and customer satisfaction, all of which are important factors
in the success of this project."
A prototype of the system will be exhibited at SEMICON China
from March 21-23 at the Shanghai New International Expo Center,
booth #4323 in hall W4.
Issue 4 ::
March 15, 2006