|:: Corporate Member News ::
High Temperature Electronics Conference (HiTEC 2006) Just Two Weeks
Expands Open-Cavity Plastic IC Package Offerings (full
Corporation’s Dr. Ning-Cheng Lee to Receive Exceptional
Technical Achievement Award (full
:: Henkel Receives
Top Honors for Innovative Lead-Free Solder Paste (full
Appoints Electri-Rep as Sales Representative (full story)
:: Remtec Announces
RoHS Compliance and IS0 9001:2000 Registration (full story)
More Information ::
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Temperature Electronics Conference (HiTEC 2006)
Just Two Weeks Away!
HiTEC 2006 is
being held May 15 - 18, 2006, at the Hilton of Santa Fe
in Santa Fe, New Mexico. The exhibit hall and sessions
are filling fast with nearly 200 attendees already pre-registered.
Visit http://www.imaps.org/hitec to
learn more about the program and to register today. For
information on exhibiting, please contact Ann Bell, email@example.com or
the premier event addressing the needs of the high temperature
electronics community. Applications for high temperature
electronics include underhood automotive, oil well logging,
geothermal, more electric aircraft, space, industrial sensors,
2006 provides a comprehensive technical program addressing
the applications, and the latest development in devices,
circuits, MEMS, sensors, packaging, power sources, and materials
to address the challenges of these applications. Tabletop
exhibits will complement the technical program by providing
you an opportunity to view the latest products for high temperature
a truly unique opportunity for suppliers, fabricators, and
users to meet and talk about the needs, issues and opportunities
in this exciting and important area. Please
join us in wonderful Santa Fe, New Mexico for HiTEC 2006.
Expands Open-Cavity Plastic IC Package Offerings
has announced that it has used its patented open-cavity process
open a new generation dual-row, 12 mm x12 mm 156-lead MLF package
for re-assembly. The open-cavity configuration allows for the
immediate assembly of new die in the package, cutting weeks
or months off the design-verification process. This expands
Quik-Pak’s current line of open-cavity plastic packages,
which includes TQFPs, LQFPs, TSSOPs, SOICs, BGAs, PLCCs, PDIPs,
SOTs, and virtually any other plastic IC package, with sizes
ranging from 2x2mm MLFs to 45x45mm BGAs.
For further information contact firstname.lastname@example.org.
|Indium Corporation’s Dr. Ning-Cheng Lee to Receive Exceptional
Technical Achievement Award
Vice President of Technology, Dr. Ning-Cheng Lee, has been
chosen to receive the 2006 Exceptional Technical Achievement
Award IEEE Components, Packaging and Manufacturing Technology
Society (CPMT). The award presentation will take place on June
1, 2006 as part of the Electronics Components and Technology
Conference (ECTC) in San Diego, California, USA.
This annual award recognizes significant contributions to
new and important technology or product(s) that advances the
state of the art in fields encompassed by the CPMT Society.
Dr. Lee was selected due to his major contributions to surface
mount technology and electronics packaging assembly.
Lee is an integral part of the Indium Corporation team of
experts, and has contributed extensively to addressing the
reliability needs of customers. He was named SMTA Member
of Distinction in 2002 and received the Soldertec Global
Lead-Free Solder Award in 2003. Dr. Lee’s credits also
include being a SMTA board member, liaison to the Taiwan
SMTA chapter, coordinator and chair of the entire 2005 Nepcon
Shanghai technical program, and author of two books and over
100 technical papers.
Lee, a world-renown soldering expert, has extensive experience
in the development of high-temperature polymers, encapsulates
for microelectronics, underfills, and adhesives. His current
research interests cover advanced materials for interconnects,
and packaging for electronics and optoelectronics applications,
with emphasis on both high performance and low cost ownership.
|Henkel Receives Top Honors for Innovative Lead-Free Solder Paste
Henkel’s award-winning record continues with yet another
industry accolade, which was bestowed upon the global materials
leader at the recent Nepcon China exhibition in Shanghai, China,
where the company’s Multicore® LF318 lead-free solder
paste received the prestigious Electronics Manufacturing Asia
Innovation Award in the category of solder materials.
Developed to appeal particularly to multinational manufacturers
who wish to qualify a single solder paste that offers reliable
performance regardless of climactic condition, Multicore LF318
is a lead-free, halide-free, pin-testable paste formulation
that delivers a broad process window for both printing and
after 72 hours at 27 Celsius and 80 percent relative humidity,
Multicore LF318 achieves a consistently high degree of coalescence
upon reflow. And, when tested to IPC ANSI/J-STD-005 and JIS-Z-3284
standards, the material displays excellent resistance to
slump. With a superior tack life and an open time greater
than 24 hours, Multicore LF318 delivers incredibly low paste
wastage, which is very important to manufacturers as they
seek to extend the life of their lead-free materials. The
lead-free material has a high initial tack force of 2.0g/mm2,
providing excellent resistance to component movement during
for reflow in air or nitrogen, Multicore LF318 is highly
versatile and displays excellent solderability on a wide
range of surface finishes, including Ni/Au, immersion Sn,
immersion Ag and OSP copper. After reflow, only soft, non-stick,
colourless residues remain, easing visual inspection and
permitting reliable in-circuit testing without clogging test
probes, even after many hundreds of tests following double
“ This material has broad appeal for many reasons,” says Doug Dixon,
Global Marketing Manager for the electronics group of Henkel. “In addition
to its outstanding reliability and very wide process window, Multicore LF318
is particularly attractive because of its ability to perform well in any climate – from
arid to humid. We are pleased that Electronics Manufacturing Asia has recognized
these significant advantages and honored Henkel with this prestigious award.”
information on Multicore LF318, log onto www.goleadfree.com.
Appoints Electri-Rep as Sales Representative
has announced that it recently has appointed Electri-Rep as
its Sales Representative for the areas of Kansas, Missouri,
Iowa, and Nebraska.
Electri-Rep, Inc. has been providing top of the line electronics
manufacturing equipment and assembly materials for over 30
years in the Kansas, Missouri, Nebraska, Iowa and Southern
Illinois territory. Their product lines include Pick-n-Place,
Wave Solder, Printing, Reflow Ovens, Dispensing, ICT, SMT Rework,
PCB Cleaning Materials, Soldering Irons, Benches, X-Ray, Solder
Paste and Fluxes, SMT Stencils, Conformal Coating Machines,
AOI, Lead Forming, and now Standard and Custom Solutions for
For further information, email email@example.com.
|Remtec Announces RoHS Compliance and IS0 9001:2000 Registration
Norwood, MA. April 24, 2006. Remtec Inc.,
a leader in custom and semi-standard ceramic packaging, has
announced the successful completion of the compliance program
for the Restriction of Hazardous Substance (RoHS) Directive
and the registration by the International Organization of Standardization
as an IS0 9001:2000 Registered Company.
In making this announcement,
Remtec president, Nahum Rapoport, explained: “Many
of our customers do business on a worldwide basis, and need
the assurance that we meet or exceed the highest
international standards for quality and the restriction of
hazardous materials. We can now give our customers the assurance
that we have raised our standards to world class levels and
consistently produce the highest quality electronic packaging
is already experiencing positive results of their recently
implemented ISO Quality System. As a result, non-conformance
reports are down, and scrap rates and on-time delivery have
“ ISO mentality” focuses on problem solving and corrective action
throughout the company. With the ability to review the effectiveness of any operation,
Remtec’s overall productivity has also increased.
Michael Hipsman, manufacturing operations manager, explains: “We
have a more thorough understanding of our operations and
the process to expose problems and take corrective action.
Our ISO registration gives our customers a higher level of
confidence that their expectations for consistent high quality
will be met.”
compliance with the new RoHS Directive (which limits the
use of lead, cadmium, mercury, hexavalent chromium, PBB or
PBDE flame retardants in products shipped to the European
Union after July 1, 2006) will benefit customers doing business
in the EU. Remtec’s RoHS compliance will also benefit
customers doing business in 27 U.S. states, China, Taiwan
and Japan where similar legislation is being developed.
Issue 7 ::
May 1, 2006