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Advanced Technology Workshop on
High Reliability Microelectronics for Military Applications

May 17-19, 2011
Holiday Inn Baltimore-BWI International Airport
(Soon to be the Doubletree BWI - March 2011)
890 Elkridge Landing Rd, Linthicum Heights, MD 21090

Early Registration and Hotel Deadlines: April 30, 2011

General Chair:
Greg Caswell
DfR Solutions
Office: 301-474-0607
gcaswell@dfrsolutions.com

Technical Team:
Bruce Romenesko-JHU-APL - Bruce.Romenesko@jhuapl.edu
Jeremy Palmer, Sandia National Laboratories - japalme@sandia.gov
Jeff Kennedy, Celestica, Inc. - kennedj@celestica.com
Carolynn Drudik, DMEA - carolynn.drudik@dmea.osd.mil

 



Workshop Focus:
The International Microelectronics And Packaging Society (IMAPS) is sponsoring an Advanced Technology Workshop on Military High Reliability Packaging Issues and Applications to be held May 17 - 19, 2011, at the Holiday Inn Baltimore-BWI International Airport (soon to be the Doubletree BWI), Linthicum Heights, Maryland.

In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level.

 

Technical Program
Register On-Line | Hotel Reservations

 



Housing:

Hotel Deadline: April 30, 2011

Holiday Inn Baltimore-BWI International Airport
(Soon to be the Doubletree BWI - March 2011)
890 Elkridge Landing Rd, Linthicum Heights, MD 21090

For reservations, call 1-800-465-4329 or direct to the hotel 410-859-8400 and mention group rate for “IMA
Group Rate: $100/night plus tax

Complimentary Internet in guest rooms.
All parking is complimentary to all paid guests.


Speaker Dates/Information:

  • Abstract Deadline: March 11, 2011
  • Speaker Notification/Confirmation emailed: March 18, 2011
  • Extended Abstract or Presentation Material due: April 25, 2011
  • Early Registration and Hotel Deadlines: April 30, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: May 19, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A); 40-45 minutes for Keynote Presenters

 


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001