Workshop Focus:
Onset of 21st Century is marked with significant nanotechnology breakthroughs to enable new class of designs, materials and processes and nano-integrated systems. Microsystems, including microelectronics packaging, are one of the primary beneficiaries of this revolution. At the foundation of these nano innovations are the fundamental value additions offered due to nano size (<100 nm) enabling high surface to volume ratio, pristine functional characteristics and thus, unique device and material properties, ultra high packaging density, etc. Examples of nanoscale building blocks are nano structured metals like copper, quantum dots of III-V compounds, carbon nanotubes, zinc oxide nanorods, BaTiO3 nanoparticles, etc. These new classes of materials and their unprecedented properties offer opportunities to deliver excellent candidates for next generation of packaging delivering high performance and multifunctions, per dollar. Example beneficiaries are LEDs and OLEDs, z-axis interconnects, anisotropic underfills, thermally conductive epoxies, die attach solders, passive capacitors, etc. This first workshop is an important forum towards building a community of scientists, engineers and businesses working on nanointegrated technologies adding value to traditional products as well as creating new products in electronic, energy, communication, chemical and other sectors of businesses for sustainable economy.

Planned sessions include the following technical areas for keynote and invited speakers:

• Session I: Nano Materials and Properties
• Session II: Nonmaterial Integrated Structures: (substrates, interconnects, Underfill, adhesive, etc.) and performance
• Session III: Nanofabrication and Assembly Processes and Instrumentation
• Session IV: Nano-Integrated Microsystems Packaging Applications and Case Studies
• Panel: Quo Vadimus for enabling Nano-integrated Packaging Product Innovations

Those wishing to discuss the findings and developments in the form of a presentation at this workshop, should immediately submit a 250-300 word abstract electronically using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent advanced technology and be unpublished work. The abstracts should highlight the energy field, application area, design, and process/material. The submission section will aid in grouping the work within these four areas.

No formal technical paper is required. A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet in mid-September. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  Speakers and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.