Workshop Focus:
The International Microelectronics And Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held June 14th and June 15th, in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

Abstracts being requested include the following topics:

• Wafer thickness, TTV, bow, and warp metrology
• High-aspect ratio TSV diameter, depth and profile measurements
• Cu void detection in TSV’s
• Wafer bond quality - void detection
• Scanning Acoustic Microscopy
• X-ray tomography and imaging
• Via stress measurements
• Infrared microscopy
• Bonded wafer pair overlay metrology
• Detecting defects at bonded wafer pair interfaces
• TSV interconnect, defects, processing
• Wafer edge defects
• Confocal microscopy techniques
• Bonder force uniformity measurement
• Post bond strength measurements
• Electrical test
• 3D interconnect reliability
• Optical microscopy
• Infratometry
• Die package metrology – voids in underfill, delamination, bonding connectivity
• Bump coplanarity
• FIB and plasma FIB; wafer contamination
• 3D packaging advances
• Novel packaging techniques
• Advance materials
• Novel metrology techniques

Those wishing to make a presentation at the Workshop, please submit a 250-300 word abstract electronically by May 15, 2012, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org) or call 202-548-8715.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

No formal technical paper is required.  A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee