KESTER

17th Symposium on Polymers for Microelectronics
Innovations Driving a Smart and Interconnected World

Winterthur Museum
5105 Kennett Pike (Route 52) | Winterthur, DE 19735
April 25-27, 2016


SOP Steering Committee:
Susan Bagen
Application Development Manager
Micro Systems Technologies, Inc.
Kevin DeMartini
Sales Manager - Americas
HD MicroSystems
Alan Huffman
WLP Technology Program Manager
RTI International’s Electronics and Applied Physics Division
Edward R. Prack
Founder
MASIP, LLC
Michael Toepper
Business Development
Fraunhofer
Dean Zehnder
Engineer Manager, Wafer Level Packaging
Amkor Technology
Advisory Board:
Michael Gallagher
DOW
Bob Hubbard
Lambda Technologies, Inc.
Ioan Matthews
HD MicroSystems
Mark Poliks
Binghamton University
Bill Weber
Educator
Rob White
Coherent Technical Services, Inc.

**CHECK-IN AT THE VISITOR'S CENTER WHEN ARRIVING AT THE SYMPOSIUM**

SOP History | Speaker Information
* Polymers, a Key Enabler in Semiconductor Packaging (Short Course) *


THANK YOU TO OUR SYMPOSIUM SPONSORS!
DOW
HD Microsystems

Supporting SponsorEMD Performance Materials

MST

 

The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing the 17th Symposium on Polymers for Microelectronics. The theme for the 17th Symposium on Polymers for microelectronics is Innovations Driving a Smart and Interconnected World and will continue the event’s focus on polymeric materials for microelectronic applications including traditional and new application areas.


  MONDAY, APRIL 25 | Pre-Symposium Agenda

7:00am-5:00pm Registration Open

8:00am-12:00pm

Pre-Symposium Professional Development Course (Short Course) on:

Polymers, a Key Enabler
in Semiconductor Packaging
PDC Instructor: Dr. Jeff Gotro, InnoCentrix LLC

Additional registration fee from Symposium Registration

Course Description: The course will provide an overview of polymers and the important structure-property-process-performance relationships for electronic packaging. The main learning objectives will be: 1) learn how polymers are used in electronic packaging including die attach adhesives, underfills, mold compounds and substrate materials 2) gain insights on how polymers are used in 2.5D and 3D packaging, 3) learn the key polymer challenges and processes for 2.5D and 3D packaging, 4) develop a foundation in rheology and rheology issues in electronic packaging. Participants are invited to bring problems for discussion.

Who Should Attend?: Packaging engineers involved in the development, production, and reliability testing of electronic packages would benefit. Those interested in gaining a basic understanding of the role of polymers and polymer-based materials used in electronic packaging will also find this PDC valuable.

Jeff Gotro Dr. Jeff Gotro has over thirty three years’ experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, and Ablestik Laboratories. Jeff is an expert in thermosetting polymers used in electronic packaging. In 2014 Jeff was elected IMAPS Fellow of the Society and also is the recipient of the John A. Wagnon, Jr. Technical Achievement Award for his sustained technical contributions in the area of polymers used in electronic packaging. He has received invitations to speak at Gordon Research Conferences (Thermosetting Polymers and Composites) and has presented numerous invited lectures and short courses at technical meetings, has over 60 technical publications and 21 patents/patent applications. Jeff was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993. Jeff is a member of the International Microelectronics Assembly and Packaging Society (IMAPS), the American Chemical Society (ACS), the Institute for Management Consultants (IMC), the Forensic Expert Witness Association (FEWA), Society of Plastics Engineer (SPE), and the Society for the Advancement of Material and Process Engineering (SAMPE).

10:00am-10:30am Coffee Break & Networking

1:00pm MONDAY, APRIL 25 | Full Symposium Program Begins…

1:00pm-1:15pm Opening Remarks: Sue Bagen, MST - General Chair

1:15pm-2:00pm

KEYNOTE PRESENTATION:
Changing Requirements for Thin Film Polymers in the Next Decade of Advanced Packaging
Abstract: PI, PBO and BCB are widely used in the microelectronic industry due to very high reliability. New applications and the ongoing miniaturization set higher demands on the material properties of the used polymers. A lot of new Polymers enter the market which could be described as the next generation polymers. These classes of polymers are invented with the aim of well optimized mechanical parameters. The cure temperature is pushed down to decrease the stress in thin chip applications or apply usage for temperature sensitive materials especially for FO-WLP applications. The young’s modulus, elongation at break and tensile strength are improved for higher reliability and modified to get the best protection for mechanical sensitive ULK structures. The talk will summarize the different requirements of the polymers for the packages being currently developed.

Keynote - Windrich Frank Windrich graduated in Chemical Engineering from the University of Applied Science Dresden (2003). He received a M.Sc. degree in Chemistry (2013) from the Technische Universität Dresden for a work about thin-film polyimide cure kinetics collaborated with the Leibniz Institut für Polymerforschung (IPF / Dresden). Since 2010 he is with Fraunhofer IZM working at the "All Silicon System Integration Dresden - ASSID" 300mm Wafer Level System Integration facility. He is scientific responsible for photoresist and thin-film polymer dielectric materials used for lithographic processes at IZM-ASSID. Frank’s current research interests are mainly focused on low-temperature cure thin-film polymer dielectrics and thick-film photoresist materials used for Advanced Wafer Level Packaging and 3D-Integration technologies. Prior IZM he was with Fuba Printed Circuits (2003 -2009) working as process engineer in the PCB industry responsible for lithography processes. Frank Windrich is a member of MRS and authored and co-authored around 10 publications.

SESSION 1

NEW PACKING MATERIAL DIRECTIONS AND TEMPORARY BONDING MATERIALS
Session Chair: Bob Hubbard, Lambda Technologies, Inc.

2:00pm-2:30pm Status of the Polymeric Dielectric Materials for Wafer Level Packaging
Amandine Pizzagalli, Yole Développement
2:30pm-3:00pm Directions and Challenges in IC Packaging: Focus on Fan Out Packaging
Edward Prack, MASIP LLC

3:00pm-3:30pm

Coffee Break

Sponsored by:
FUJIFILM


3:30pm-4:00pm Temporary Wafer Bond Adhesives with High Thermal Stability and Enhanced Processability
Mel Zussman, HD MicroSystems (Glenn Lebo, HD MicroSystems; Kai Zoschke, Thorsten Fischer, Matthias Wegner, Fraunhofer IZM)
4:00pm-4:30pm New Non Conductive Film for Collective Bonding Process
Masao Tomikawa, Toray Industries (Kazuyuki Matsumura, Sakabe Yohei, Yoichi Shinba)
4:30pm-5:00pm Microelectronic Applications and Processes Enabled with Thermoplastic Liquid Crystal Polymer (LCP) Dielectric
Eckardt Bihler, Dyconex AG; Susan Bagen, Micro Systems Technologies, Inc.

 

 


TUESDAY, APRIL 26


7:00am-6:00pm Registration Open

9:30am-7:00pm Exhibits Open (when not in session)

7:00am-8:00am Breakfast

8:00am-8:15am Opening Remarks: Sue Bagen, MST - General Chair

8:15am-9:00am

KEYNOTE PRESENTATION:
Flexible Hybrid Electronics Technologies as the Foundation for a Connected World
Abstract: Flexible Hybrid Electronics (FHE) is a forward-looking landscape that combines elements from advanced silicon form factors, printed components and interconnects, as well as sensor integration and assembly technologies in order to produce thin, light, and flexible electronics that can be used in new ways. FHE is uniquely able to adapt to challenging form factors, dynamic motion applications, and specialized environmental conditions where traditional electronics technologies are not well suited. Key application areas for the institute include medical and human monitoring devices, asset monitoring devices, soft robotics, and integrated array antennas. Proliferation of these technologies into the edge-device domain for the Internet of Things is anticipated to be significant, and the FHE MII (Flexible Hybrid Electronics Manufacturing Innovation Institute) is working to bring the technology experts in these historically disparate disciplines together in order to advance the maturity of the industry, and allow these technologies to be seamlessly integrated into the design of the next generation of products and services.

Keynote - Marsh Jason Marsh is the Director of Technology at NextFlex – America’s Flexible Hybrid Electronics Manufacturing Institute. NextFlex mobilizes companies, academic institutions, nonprofits, and state and local governments toward a single goal: to advance the manufacturing ecosystem of flexible hybrid electronics in America. Prior to joining NextFlex, Jason worked on both the technology and business side of industry. Having studied materials science and robotics at Stanford University, Jason worked on early versions of 3D printing technology using ceramics and metals, as well as developing instruments for theoretical physics experiments such as Gravity Probe B. In industry, Jason has worked across the globe in Japan, India, Germany, Mexico, Malaysia and China where he lived between 2003 and 2008, establishing greenfield factories for Kyocera. As Vice President at Insulectro, Jason focused on new materials and supply-chain strategies for the printed circuit board and flexible hybrid electronics industries, with a focus on high reliability applications including: medical, military, and aerospace products. Jason has an in-depth knowledge of signal integrity needs for digital circuits and an understanding of the reliability implications of materials selection and process methodologies for flexible electronics. He has served on advisory boards and consulted for companies in a wide range of industries from artificial intelligence to outdoor equipment to solar power to agriculture. He is passionate about seeing manufacturing companies thrive and is focused on the requirements needed to keep US-based manufacturing operations differentiated and globally competitive.

SESSION 2

PRINTING, LOW STRESS AND LOW T CURE MATERIALS
Session Chair: Edward R. Prack, MASIP, LLC

9:00am-9:30am The Chemistry of Low Stress Epoxy Curing
Robert Hubbard, Lambda Technologies (D. R. Tyler, M. Strain)

9:30am-10:15am

Coffee Break in the Exhibit Area

Sponsored by:
EMD Performance Materials


SESSION 2

Continued...

10:15am-10:45am Low Warpage Wafer Buffer Coating Material
James Huneke, Designer Molecules Inc. (Gary Yeager)
10:45am-11:15am Effective Chemical Shrinkage and Viscoelastic Properties of Advanced Polymer Materials: Their Effect on Residual Stress and Warpage
Bongtae Han, University of Maryland

11:15am-12:45pm Lunch in the Exhibit Area

12:45pm-1:30pm

KEYNOTE PRESENTATION:
Imprint Lithography and Self Assembly with Novel Materials for High Integration Density Printed Devices and Components
Abstract: Printing truly intelligent devices and integrated sensor platforms requires the development of manufacturable approaches that yield very high device integration densities as well as cost-effective production of functional device components. We are developing nanoscale fabrication techniques including self-assembly of hybrid (inorganic/organic) materials and nanoimprint patterning using polymers, hybrid polymer/inorganic resists and crystalline nanoparticle ink systems that enable large area production of sub-micron features. Applications include printing of 2-D and 3-D crystalline inorganic structures for light and energy management, printed micron scale transistors and printed microfluidic sensors. In addition, printing of functional structures using nanoscale fabrication and traditional printing techniques can be used to prepare or modify the performance and behavior of adjacent commodity flex/hybrid device components. The processes described can be scaled in the new $25 Million Advanced Print and Roll-to-Roll Manufacturing Demonstration Facility at UMass.

Keynote - Watkins Jim Watkins is Professor of Polymer Science and Engineering and Director of the Center for Hierarchical Manufacturing, a National Science Foundation Nanoscale Science and Engineering Center (NSEC) at the University of Massachusetts, Amherst. Professor Watkins received his B.S. and M.S. degrees in Chemical Engineering from the Johns Hopkins University and his Ph.D. in Polymer Science and Engineering from the University of Massachusetts. He joined the Chemical Engineering faculty at UMass in 1996 and the Polymer Science and Engineering faculty in 2005. He is the recipient of a Camille Dreyfus Teacher-Scholar Award and a David and Lucile Packard Foundation Fellowship for Science and Engineering and is a Fellow of the American Physical Society.

SESSION 3

PROCESS OPTIONS FOR ADVANCED PACKAGING
Session Chair: Kevin DeMartini, HD MicroSystems

1:30pm-2:00pm Innovative Uses for Plasma in the Assembly of Electronic Devices
Andy Stecher, Plasmatreat (Paul Mills)
2:00pm-2:30pm In-situ FT-IR Curing Studies for Low-temperature Cure Thin Film Polymer Dielectrics in Solid State
Frank Windrich, Fraunhofer IZM (Mikhail Malanin, Klaus-Jochen Eichhorn, Brigitte Voit, Leibniz-Institute for Polymer Research Dresden)
2:30pm-3:00pm Comparing Crosslinking Effects in the Low Temperature Curing of PBOs
Robert Hubbard, Lambda Technologies (Melvin Zussman)
3:00pm-3:30pm Slot Die Coating for Wafer Level Packaging Applications
Greg Gibson, nTact

3:30pm-4:15pm

Coffee Break in the Exhibit Area

Sponsored by:
EMD Performance Materials


4:15pm-5:45pm

PANEL SESSION ON:
Material Requirements for Panel Processing of FO-WLP, Current Challenges and Lessons from the Past
The industry is buzzing with talk of moving to large form factor or “panel” processing as a way to reduce cost for next generation packaging. This panel will discuss the current alternatives proposed for panel processing and the challenges. We will also examine the lessons learned during similar transitions in the circuit board, package molding, roll-to-roll and display industries to identify potential solutions that could be applied to advance the packaging industry.

MODERATORS: Karen Carpenter, TechSearch International; Edward Prack, MASIP, LLC

PANELISTS:
Rey Alvarado, Qualcomm
Elvino da Silveira, Rudolph Technologies
Greg Gibson, nTact
John Hunt, ASE US, Inc.
Jason Marsh, NextFlex


5:45pm-7:00pm

Welcome Reception in the Exhibit Area

Sponsored by:
EMD Performance Materials


 

 


WEDNESDAY, APRIL 27


7:00am-3:00pm Registration Open

10:00am-1:30pm Exhibits Open (when not in session)

7:00am-8:00am Breakfast

8:00am-8:15am Opening Remarks: Sue Bagen, MST - General Chair

8:15am-9:00am

KEYNOTE PRESENTATION:
Photosensitive Materials: New Materials Solving Old Problems
Abstract: In the last half-century, critical dimensions in electronic devices have been reduced from micrometers to a few tens of nanometers on a pace that has been consistent for decades. Lithography now touches many areas of science ranging from electronics to biology and the life sciences. To continue on this remarkable path predicted in 1965 and to approach molecular scale pattern formation, new breakthroughs in patterning methods are needed. This talk will focus on new concepts, methods and materials, in particular efforts in directed self-assembly (DSA), orthogonal patterning and metal oxide nanoparticle lithography.

DSA harnesses the phase separation behavior of block copolymers to create patterns defined by the microstructure of the polymer. Strongly phase separated polymers have the capability to create nanostructures of a few tens of nanometers. A current challenge is formation of long range order oriented using guiding patterns and carrying this out rapidly. This presentation will discuss new molecular design, solvent vapor annealing to induce both equilibrium and non-equilibrium microstructures and the use of laser spike annealing to induce ultra-rapid (millisecond) order formation.

Orthogonal patterning also makes use of phase separation, but instead targets the contamination free patterning of organic or biological materials. This new class of photomaterials is typically built from fluorinated components. The presence of fluorine keeps the photoresist and the developer from mixing with organic materials. For example, in the case of an organic semiconductor, organic materials can poison a conventional photoresist and the photoresist can change the mobility of the semiconductor. By preventing mixing of the materials, the mutual contamination can be avoided. High-resolution materials for displays and organic electronics will be described.

As a final example, metal oxide nanoparticle photoresists will be described. Targeted for EUV patterning, these new metal oxide nanoparticles can be patterned using a range of wavelengths and enable the production of arbitrary patterns at very small length scales. The patterning mechanism seems to function with any metal oxide, using a new, previously undiscovered patterning process that depends upon the selection of ligand, photoactive compound and bake cycle. Both negative tone and positive tone images are possible. These and other advances in lithography will be described.

Keynote - Ober Christopher Ober is the Francis Bard Professor of Materials Engineering at Cornell University. He received his B.Sc. in Honours Chemistry (Co-op) from the University of Waterloo, Ontario, Canada in 1978 and his Ph.D. in Polymer Science & Engineering from the University of Massachusetts (Amherst) in 1982. From 1982 until 1986 he was a senior member of the research staff at the Xerox Research Centre of Canada where he worked on marking materials. Ober joined Cornell University in the Department of Materials Science and Engineering in 1986. He recently served as Interim Dean of the College of Engineering. From 2008 to 2011 he was President of the IUPAC Polymer Division and he is presently an elected member of the IUPAC Bureau, its governing body. He has pioneered new materials for photolithography and studies the biology materials interface. A Fellow of the ACS, APS and AAAS, his awards include the 2013 SPSJ International Award, 2009 Gutenberg Research Award from the University of Mainz, the 1st Annual FLEXI Award in the Education Category (for flexible electronics) awarded in 2009, a Humboldt Research Prize in 2007 and the 2006 ACS Award in Applied Polymer Science. In 2014 he was a JSPS Fellow in Tokyo, Japan.

SESSION 4

LITHO MATERIALS FOR PACKAGING
Session Chair: Robb White, Coherent Technical Services, Inc.

9:00am-9:30am Photopatternable Laminate BCB-based Dielectric for Advanced Packaging
Corey O'Connor, Dow Electronic Materials (Tina Aoude, Robert Barr, Jeffrey Calvert, Michael Gallagher, Elissei Iagodkine, Jong-Uk Kim, Tanja Braun, Robert Gernhardt, Karin Hauck, Klaus-Dieter Lang, Piotr Mackowiak, Michael Töpper, Martin Wilke, Markus Wöhrmann)
9:30am-10:00am Ultra-thick Photo Resist for FO-WLP
Hisanori Akimaru, JSR Micro N.V.

10:00am-10:45am

Coffee Break in the Exhibit Area

Sponsored by:
Yield Engineering Systems


10:45am-11:15am Positive Photoresist Development for Fine RDL Applications
Medhat Toukhy, EMD Performance Materials Corp. (PingHung Lu, Walter Liu, Lei Lu)
11:15am-11:45am Characterizing and Solving Imaging Challenges in Thick Resists for Wafer and Panel based Lithography Applications
Jim Webb, Rudolph Technologies (Keith Best)
11:45am-12:15pm Thick Film Aqueous Developable Photodielectric Material for Advanced Packaging Applications
Michael Gallagher, Dow Electronic Materials (Joe Lachowski, Rosemary Bell, Kevin Wang, Masaki Kondo, Yuta Anezaki, Janet Okada, David Louks, Michelle Riener, Hua Dong, Greg Prokopowicz, Duane Romer, Wes Sattler, Bob Barr, Dave Fleming, Tina Aoude, Jenna Cordero)

12:15pm-1:30pm Lunch in the Exhibit Area

SESSION 5

PACKAGING MATERIALS (NON PSB)
Session Chair: Michael Gallagher, DOW

1:30pm-2:00pm Joint Healing Thermal Interface Material: A Case Study
Jason Strader, Laird (Phillip Fosnot, Amkor)
2:00pm-2:30pm Degradation Mechanisms in Tantalum Capacitors with Conductive Polymer Electrodes
Anto Peter, University of Maryland (Michael Azarian, Michael Pecht)
2:30pm-3:00pm Conformal Composite Coatings for Tin Whisker Mitigation
Suraj Maganty, Binghamton University (Stephan Meschter, Junghyun Cho)

3:00pm Closing Remarks

   
 

 



Speaker Dates/Information:

  • Abstract Deadline Extended to: February 10, 2016
  • Speaker Email Notification: February 19, 2016
  • Early Registration Deadline: March 31, 2016
  • Speaker 2-3 sentence biography due not later than: April 15, 2016
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: April 27, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


Registration Information: (Early Registration Deadline: March 31, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. CANCELLATION POLICY: Refunds for advance payment, less a $50 processing fee, will be given in full provided cancellation by phone or e-mail is received 10 business days before the event (April 15th).

All prices below are subject to change.

 

Type
Early Fee
Through 3/31/16
Advance/Onsite Fee
After 3/31/16
IMAPS Member
$500
$600
Non-Member
$595
$695
Speaker
$350
$450
Session Chair
$350
$450
Student
$100
$150
Tabletop Exhibit (Member) - Total of 15 Tabletops For Conference
$500
$550
Tabletop Exhibit (Non-Member) - Total of 15 Tabletops For Conference
$600
$650
Pre-Workshop Short Course (PDC): Polymers, a Key Enabler in Semiconductor Packaging
(Monday, 8am-12pm. PDC Instructor: Dr. Jeff Gotro, InnoCentrix LLC)
$200
$250
Premier Sponsorship (Includes Tabletop, 4 Attendees)
$5000
$5000
Supporting Sponsorship (Includes Tabletop, 2 Attendees)
$2500
$2500
Associate Sponsorship (Includes 1 Attendee)
$1250
$1250
Reception Sponsorship (Includes 2 Attendees)
$2000
$2000
Coffee Break Sponsorship
$750
$750

 



Hotel Reservations

There is not a "host hotel" where conference activities will be held, as all events will be held at the Winterthur Museum. There is not a reserved hotel room block as a result. But IMAPS does recommend the following area hotels for those traveling from out of town.

Fairfield Inn & Suites Wilmington New Castle
Doubletree by Hilton Hotel Wilmington
The Inn at Montchanin Village
Sheraton Wilmington South


SYMPOSIUM ON POLYMERS ARCHIVES!

2014 Symposium Program | 2012 Symposium Program | 2010 Symposium Program

During the past few meetings, the Symposium on Polymers has welcomed 100-150 participants from year to year. We expect the same level of participation, if not more, this year! To give you an idea of the types of participants you can expect at this symposium, here is a listing of the 2014 Participating Companies:

Akron Polymer Systems, Inc.
Amkor Technology
Asahi Kasei E-Materials Asahi Kasei E-materials Corporation
ASE (US) Inc.
AZ Electronic Materials
Binghamton University
Brewer Science
Dow Chemical Company
Dow Electronic Materials
DuPont
DuPont de Nemours(Deutschland) GmbH
DuPont Taiwan Limited
EV Group
FFEM USA Inc.
Fraunhofer IZM
Fujifilm Electronic Materials Europe NV
FUJIFILM Electronic Materials U.S.A., Inc.
Georgia Institute of Technology
HD MicroSystems
Heraeus PM Daychem, LLC
Hitachi Chemical
IBM
Intel Corporation
J&J Chemical Consulting
JSR corporation
Korea Research Institute of Chemical Technology
Lambda Technologies
MEPTEC
MicroChem
MST CONFERENCES
NFME
NISSAN CHEMICAL TAIWAN
Promerus
Qualcomm Technologies, Inc.
Rensselaer Polytechnic Institute
Rudolph Technologies
S- Cubed
Samsung Cheil Industries
Silex Microsystems
Strategic Foresight Investments
Sumitomo Plastics America, Inc.
TechSearch Int'l.
Texas Instruments
Toho Chemical Industry Co.,LTD
TOK America
Toray Industries
Tousimis
UTZ LLC

OUR CHARTER: The charter for the Symposium on Polymers for Microelectronics is to promote the integration of advanced polymeric materials into semiconductors, MEMS, sensors, electronics packaging, displays, solar, optical and medical application areas. Meetings are held biannually with a strong emphasis on new polymer development and processing. We look forward to seeing you in April 2016 at the beautiful Winterthur Gardens!

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems