IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
Topical Workshop on
Packaging of Sensors and Power Modules

October 12, 2010
Ohio Aerospace Institute
Cleveland, Ohio USA

 

This Workshop has been cancelled.
Please email Brian Schieman at bschieman@imaps.org with questions or interest.

 

 

 

 

 
© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>