2nd International Conference on Device Packaging
Planned for March ’06 in Scottsdale, AZ

October 25, 2005 – Washington, D.C. – The International Microelectronics And Packaging Society (IMAPS) has announced that plans are underway for the Second Annual International Conference and Exhibition on Device Packaging, March 20 – 23, 2006, at the Doubletree Paradise Valley Resort in Scottsdale, Arizona.

Device Packaging ‘06 will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types.  Dr. Andrew Strandjord, IMAPS Vice President of Technology and  Device Packaging ’06 General Chair, stated “This Conference will feature a new format– six Workshops concentrating on: 3D Packaging; Copper/Low-K; Flip Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics. These workshops are a continuation of past successful IMAPS Topical and Advanced Technology Workshops. This new format will provide a forum for presentations of leading edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.”

Device Packaging ‘06 will also feature one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging in each of the topical areas addressed during this Conference. This venue features an ideal atmosphere to showcase products and services to key decision making professionals in the industry. Full 10' by 10' exhibit spaces will be available. 

For more information, please visit www.imaps.org/devicepackaging.

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About IMAPS:
IMAPS conducts 30 meetings each year that offer a full spectrum of educational and marketing opportunities to the microelectronics and packaging professional.  IMAPS symposia, conferences, and workshops feature preeminent presentations of the ongoing work in the industry worldwide.  Exhibitions and trade shows highlight the latest product and service applications of the current technology. IMAPS meeting attendees are able to meet and exchange ideas and information with the best and brightest professionals in the international microelectronics and packaging industry.