IMAPS to Sponsor HiTEC 2006
Washington, D.C. – The International Microelectronics And Packaging Society (IMAPS) is once again sponsoring the 2006 International Conference on High Temperature Electronics (HiTEC 2006). The Conference will be held May 15 – 18, 2006, at the Hilton of Santa Fe, Santa Fe, NM.
“HiTEC 2006 will be the forum for presenting leading high temperature electronics research results and application requirements. There will be a focused table-top exhibition for suppliers who support the use of high temperature technology,” stated
R. Wayne Johnson, Auburn University, HiTEC 2006 General Chair.
HiTEC 2006 will continue the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. For more information, please visit www.imaps.org/hitec
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About IMAPS:
IMAPS conducts 30 meetings each year that offer a full spectrum of educational and marketing opportunities to the microelectronics and packaging professional. IMAPS symposia, conferences, and workshops feature preeminent presentations of the ongoing work in the industry worldwide. Exhibitions and trade shows highlight the latest product and service applications of the current technology. IMAPS meeting attendees are able to meet and exchange ideas and information with the best and brightest professionals in the international microelectronics and packaging industry.
