Dr. Irwin Jacobs of Qualcomm to Keynote at IMAPS 2006

May 23, 2006 – Washington, D.C. – IMAPS, the International Microelectronics & Packaging Society, has announced that Dr. Irwin Jacobs, Chairman of Qualcomm, Inc., has agreed to be the featured Keynote Speaker at the 39th Annual Symposium on Microelectronics, October 8-11, 2006, at the San Diego Convention Center, San Diego, CA.

Dr. Irwin Mark Jacobs is co-founder and chairman of the board of directors of QUALCOMM Incorporated, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology. Dr. Jacobs served as chief executive officer of the Company until July 2005. 

Dr. Jacobs has led the commercialization of CDMA technology and its success as the world’s fastest-growing, most-advanced voice and data wireless communications technology.  CDMA is the basis for all third-generation (3G) wireless networks; these 3G CDMA networks now carry the voice and data traffic of more than 150 million subscribers worldwide.

In announcing Dr. Jacobs participation, Steve Adamson of Asymtek, General Chair of IMAPS 2006, said “we are extremely honored to have Dr. Jacobs agree to speak at our Symposium.  We know that his address will be of interest and important to all that attend our Annual Symposium.”

IMAPS 2006 will have a full technical program along with an impressive slate of Professional Development Courses and a full Exhibit Hall.  More information can be found at www.imaps2006.org.

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About IMAPS:
IMAPS conducts 30 meetings each year that offer a full spectrum of educational and marketing opportunities to the microelectronics and packaging professional.  IMAPS symposia, conferences, and workshops feature preeminent presentations of the ongoing work in the industry worldwide.  Exhibitions and trade shows highlight the latest product and service applications of the current technology. IMAPS meeting attendees are able to meet and exchange ideas and information with the best and brightest professionals in the international microelectronics and packaging industry.