Brad McCredie, IBM Fellow, to Keynote at IMAPS 2009

June 23, 2009 – Washington, DC – IMAPS, the International Microelectronics And Packaging Society, is pleased to announce that Brad McCredie, a Vice President and Fellow at IBM, has agreed to be the featured keynote speaker at IMAPS 2009, the 42nd International Symposium on Microelectronics (IMAPS 2009). The Symposium will be held November 1 – 5, 2009, at the San Jose Convention Center, San Jose, CA.

Dr. McCredie received his BS, MS, and PhD degrees in electrical and computer engineering from the University of Illinois in ’85, ’87 and ’91 respectively. His primary interests were electromagnetic modeling and simulation. He then joined IBM and continued his work in packaging focused on IBM’s mainframe systems. In ’96 he began working on POWER based systems. His first assignment was on POWER3. He delivered the cache subsystem design and packaging.

Dr. McCredie became one of the lead architects of IBM’s POWER4 systems and chip and went on to become the POWER4 system chief engineer and delivered that system in 2001. The POWER4 systems propelled IBM from a trailing position as the #3 Unix system provider in the industry to its current position as the #1 Unix systems supplier.

After delivering the POWER4 systems, McCredie led the design and delivery of the POWER6 processor for IBM. POWER6 is the highest frequency processor in the industry and is the only processor in the industry to earn a #1 benchmark result in all of the major benchmarks including SPEC, TPC-C, SAP and Java. He then focused on POWER7 systems.

After leading the chip design team for over six years, he has taken on the system executive role for POWER7. His responsibilities included delivery of all system components including hardware and software elements. In 2004 Brad was appointed to the position of IBM Fellow, IBM’s highest technical position. In 2009 Brad was appointed to the position of IBM Vice President and Fellow and is now leading all POWER chip development for IBM systems.

“IMAPS is fortunate to have a Keynoter with such an extensive background in packaging and computer systems,” said Jeff Demmin of Tessera, the General Chair of IMAPS 2009.  “Dr. McCredie brings a wealth of experience and a history of leadership to our Symposium that will be enthusiastically received by our attendees,” he added.

For more information on IMAPS 2009, please visit www.imaps2009.org.

 

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About IMAPS
IMAPS is the leading international microelectronics and electronic packaging society. Members represent every discipline and specialty in the electronics industry and include technical and marketing professionals. IMAPS hosts symposia, workshops, conferences and PDCs. The IMAPS Microelectronics Foundation provides assistance to students in electronic packaging disciplines.