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Advanced Technology Workshop on
High Reliability Microelectronics for Military Applications

August 31 - September 2, 2010
Bethesda North Marriott Hotel & Conference Center
5701 Marinelli Road, Bethesda, MD, 20852

Early Registration and Hotel Deadlines: August 6, 2010

General Chair:
Greg Caswell
DfR Solutions
Office: 301-474-0607
gcaswell@dfrsolutions.com

Technical Team:
Ed Kurek- Northrop Grumman- edward.kurek@ngc.com
Rick Gunn – NexTek Inc.- rick.gunn@nextekinc.com
Maureen Curran – Orbital Sciences - curran.maureen@orbital.com
Keith Sturken – BAE Systems- keith.sturcken@baesystems.com
Bruce Romenesko-JHU-APL - Bruce.Romenesko@jhuapl.edu
Carolynn Drudik - DMEA - carolynn.drudik@dmea.osd.mil

Corporate Sponsors:

Corporate Sponsor - DfR Solutions
Corporate Sponsor - Indium Corporation
Corporate Sponsor - Lockheed Martin
Corporate Sponsor - Nextek, Inc.
IMAPS Chesapeake Chapter


Workshop Focus:
In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level.

Tuesday, August 31st

Registration: 7:00 am - 4:15 pm
Continental Breakfast: 7:15 am - 8:00 am

Opening Remarks: 8:00 am - 8:15 am
General Chair: Greg Caswell, DfR Solutions

Keynote Presentation: 8:15 am - 9:00 am
Challenges in DoD Acquisition: Reliability Design and Assessment in a Post-MIL-STD World

Grant Schmieder, USD AT&L/DDR&E/SE/MA

Grant Richard Schmieder is a senior reliability engineer supporting the Office of the Director, Defense Research and Engineering/Systems Engineering, in Arlington, VA.  Mr. Schmieder has 26 years of experience in logistics and reliability engineering, including 19 years in defense; a BS in engineering from the University of Santa Clara in Santa Clara, CA; and an MS in systems and industrial engineering from the University of Arizona in Tucson. He spent 16 years with Hughes (now Raytheon) Missile Systems in Tucson, working as a logistics engineer on the Maverick, AMRAAM, ESSM, AIM-9X, and Phoenix missile programs. Transitioning to reliability engineering while obtaining his master’s degree in systems and industrial engineering, he served as the reliability engineer on the Stinger missile system. After a brief stint as a reliability engineer for Cubic Defense Systems in San Diego, he spent 7 years working as the reliability lead for Telabs’ Salix Division and BioVeris Corporation in Maryland. He is an American Society for Quality Certified Reliability Engineer and holds the Professional Certificate in Reliability and Quality Engineering from the University of Arizona.


Keynote Presentation: 9:00 am - 9:45 am
Pb-Free Electronics Overview

Edward A. Morris, Lockheed Martin Corporation

Edward A. Morris is Director of Mechanical Engineering & Manufacturing on the Lockheed Martin Corporate Engineering & Technology team.  His focus is on improving the effectiveness of mechanical engineering design and manufacturing processes and technologies, and establishing practices that link the Mechanical Engineering, Production, Supply Chain Management and Sustainment communities so that life-cycle cost can be effectively managed.  He is Vice Chairman of the Lockheed Martin Corporate Production Council.  Additionally, Ed is responsible for developing and executing a proactive Lockheed Martin approach for Pb (lead)-free electronics risk management.  Ed has a BS in Aeronautical Engineering from Purdue University and an MBA from the University of Texas at Arlington.  He has 39 years of defense, commercial and international aerospace industry experience.

Break: 9:45 am - 10:15 am

Session 1: System Level/Mission Assurance
Session Chair: Keith Sturcken, BAE Systems
10:15 am - 11:45 am

Microcircuit Reliability Prediction Based on Physics-of-Failure Models
Lloyd Condra, Boeing; Craig Hillman, Ed Wyrwas, DfR Solutions; Dave Redman, Aerospace Vehicle Systems Institute

HB0009 Reliability Program Handbook - Effective Reliability Programs
Paul E. Shedlock, Raytheon Missile Systems

Lunch: 11:45 am - 12:45 pm

Session 2: System Level Reliability
Session Chairs: Maureen Curran, Orbital Sciences; Keith Rogers, Department of Defense
 12:45 pm - 4:15 pm

Enhancing MIL-HDBK-217 Reliability Predictions with Physics of Failure Methods
Jim McLeish, DfR Solutions

NanoChromics™ Printed Security Solutions Applications to Anti-Counterfeit, Identification, and Authentication Applications
Alain C. Briancon, NTERA, Inc. 

Minimizing the Risk of Counterfeit Electronic Devices
Mark Marshall, Integra Technologies LLC

Break: 2:15 pm - 2:45 pm

High Reliability Avionics at Northrop Grumman Electronic Systems
Bill Marsh, Northrop Grumman

Considering Counterfeits - Evaluating Anti-Counterfeit Partners and Strategies with Business Fundamentals
Philip Comer, DMEA

Using DNA to Safeguard Electrical Components and Protect Against Counterfeiting and Diversion 
Janice Meraglia, James Hayward, Applied DNA Sciences

Wednesday, September 1st

Registration: 7:00 am - 4:15 pm
Continental Breakfast: 7:15 am - 8:00 am

Session 3: Test Session/Reliability, Qualification
Session Chair: Rick Gunn, NexTek Inc.
8:00 am - 11:30 am

Optical Leak Test Data per Latest Release of MIL-STD 750, Test Method 1071
Chris Aubertin, Dick Vanderneut, NorCom Systems Inc.; Thomas J Green, TJ Green Associates LLC

Low Cost Hermetic Sealing of Large Electronic Packages
Thomas E. Salzer, Hermetric, Inc. 

Quantifying the Impact of Lead Free Assembly Using High Temperature Testing
Bill Birch, PWB Interconnect Solutions Inc.

Break: 9:30 am - 10:00 am

Reliability Testing for Microvias in Printed Wire Boards 
Bill Birch, PWB Interconnect Solutions Inc.

Understanding Semiconductor Package Hermeticity
John Pernicka, Pernicka Corporation

Automated Design Analysis: Accurately Capturing Warranty and End-of-Life Risks Early in Product Development
Nathan Blattau, DfR Solutions

Lunch: 11:30 am - 12:30 pm

Keynote Speaker: 12:35 pm – 1:15 pm
Leading on the Tough Days

Colonel Danny McKnight

Colonel Danny R. McKnight, U.S. Army, Retired, was born in Columbus, Georgia; moved to Rockledge, Florida in 1959; graduated from Cocoa High School in 1969 and Brevard Community College in 1971. He was a Distinguished Military Graduate from Florida State University in 1973, where he earned a BS in Management. In 1985, Danny earned his Master’s in Higher Education from the University of Florida while assigned as an Assistant Professor of Military Science in the ROTC Department.  His military career included combat duty on two occasions, Panama 1989 and Somalia 1993 (basis for the Book and Movie “Black Hawk Down”). Colonel McKnight now focuses all his efforts on being a nationwide motivational speaker. He and his wife, Linda, reside in Rockledge, Florida.

Session 4: Packaging/Board Level
Session Chair: Ed Kurek, Northrop Grumman
1:15 pm - 4:15 pm

Leveraging Device Level 3D Integration Technologies for High Performance/Reliability Modules
Dan Baldwin, Engent

Ceramic Column Grid Array Durability in Rugged Environments
Jerry Keller, Scott Dukes, Roy Belaen, Honeywell Aerospace 

Break: 2:15 pm - 2:45 pm

Printed Wiring Board Failure - Detailed Investigation
David Boyarsky, Debasis Basak, Orbital Sciences Corporation

Electronic Packaging Trends and Drivers in USA
Voya Markovich, Endicott Interconnect, Inc.

Low-Temperature Soldering Options for High-Reliability Hermetic Sealing
Christopher Nash, Thomas Acchione, Carol Gowans, Indium Corporation

Thursday, September 2nd

Registration: 7:00 am - 10:00 am
Continental Breakfast: 7:15 am - 8:00 am

Session 5: Materials/Components
Session Chair: Carolynn Drudik, DMEA
8:00 am - 10:00 am

A Review of Flip Chip Ceramic CGA Packaging
Joseph Fabula, Xilinx, Inc. 

Mixed Metals Impact on Reliability
Rick Gunn, Nextek Incorporated

The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications
Stephen Meschter, BAE Systems; Joelle Arnold, DfR Solutions

Closing Remarks: 10:00 am

Register On-line


Housing:

Hotel Deadline: August 6, 2010

Bethesda North Marriott Hotel & Conference Center
5701 Marinelli Road; Bethesda, MD  20852
Accessible by Metro - Red Line, White Flint Station.

For reservations, call (800) 228-9290 or (301) 822-9200 and ask for “International Microelectronics And Packaging Society
Group Rate: $149/night plus tax

Pre registered attendees can save $12/day on parking.  (Attendees must be pre registered by Friday, August 27th.)

Guests booking rooms through the official block will receive complimentary Internet access in their sleeping room, a savings of $12.95/day.


Speaker Dates/Information:

  • Speaker Notification/Confirmation emailed: July 9, 2010
  • Extended Abstract or Presentation Material due: August 6, 2010
  • Early Registration and Hotel Deadlines: August 6, 2010
  • Powerpoint/Presentation file for CD-Rom due not later than: September 2, 2010
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A); 45 minutes for Keynote Presenters

 


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
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Phone: 202-548-4001