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IMAPS and SEMI proudly announce an
Advanced Technology Workshop on

Wire Bonding
Monday, July 14, 2008
Intercontinental Hotel, San Francisco

Co-located with SEMICON West 2008
Co-located with SEMICON West 2008

Hotel Cut-off is June 27, 2008

General Chair:

Wire Bonding Workshop Organizing Committee:

Joseph S. Bubel
Hesse & Knipps, Inc.
P: 484-665-0219
bubel@hesse-knipps.us

Please copy Dana Baedke dana@keymarketing.biz
on all correspondence to general chair.

Bob Chylak

Kulicke & Soffa         

bchylak@kns.com

Joe Lippincott

Oerlikon

joe.lippincott@oerlikon.com

Mike McKeown

Orthodyne

mike.mckeown@orthodyne.com

Daniel Evans

Palomar

devans@bonders.com




Monday, July 14, 2008
Registration: 7:00am - 5:00pm

 

Session 1: Applications and Ultrasonics
Co-Chairs: Lee Levine, Process Solutions Consulting & Daniel Evans, Palomar Technologies, Inc.
8:00 AM - 12:00 PM

Wire Bonding of a RF-SOE Package using a Gold Ball Bonder
Daniel D. Evans, Jr., Alberto Perez, Palomar Technologies, Inc.

Overview of Fine Pitch Wire Bonding Development on Low k/Cu Wafers for High Reliability Performance
Chu-Chung (Stephen) Lee, TuAnh Tran, Freescale Semiconductor, Inc.

High Resolution Failure Analysis Comparing Au Wire Thermosonic Bonding and Ultrasonic Bonding using an Al-Coated Au Wire for IC Interconnection
Robert Klengel, L. Berthold, M. Petzold, E. Milke, T. Müller, Fraunhofer Institute for Mechanics of Materials

Session 2: Heavy Wire Wedge & Ribbon Bonding
Co-Chairs: Mike Mckeown, Orthodyne Electronics Corporation & Jovy Michael G. Sena, Oerlikon ESEC USA Inc.
8:00 AM - 11:00 AM

Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination to Improve Wire Bonding
Scott D. Szymanski, March Plasma Systems

Ribbon Bonding for High Frequency Applications
Roberto Gilardoni, Hesse & Knipps GmbH

PowerRibbon – An Alternative Power Interconnect for Hybrid DC-DC Converter Multi-Chip Packages
Christoph Luechinger, Orthodyne Electronics Corporation


Break: 9:30 am - 10:00 am


Frequency Interactions with Semiconductor Packaging using Thermosonic Wire Bond Interconnects
Jon W. Brunner, Gary Schulze, Dominic DeAngelis, Bob Chylak, Kulicke and Soffa Industries, Inc.

The Effects of 120KHz Ultrasonic Frequency on the Reliability of Fine Pitch Gold Wire Bonding
Minh-Nhat Le, Jianbiao (John) Pan, Cuong Van (C.V.) Pham, California Polytechnic State University

Process Integrated Quality Control for Wire Bonding
Roberto Gilardoni, Hesse & Knipps GmbH

The Characteristics of Copper Bonding Wire for Standard IC Package Marcus Goh, Tanaka Electronics Singapore Pte. Ltd.

Wire Bond Comparison of Different Aluminum Alloys and Thicknesses
Barry Njoes, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics Corporation; Alex Marralaw, Jason Hibbert, Farmingdale State University

Large Diameter Wedge & PowerRibbon™ Bumping Technology
Mike Mckeown, Orthodyne Electronics Corporation

Automatic Optical Inspection of Wire Bonds
Wolf Rüdiger Pennuttis, Viscom Inc.


Lunch: 12:00 noon – 1:00 pm

Session 3: Stacked Die, Copper, Reliability
Co-Chairs: Jianbiao (John) Pan, California Polytechnic State University & Chu-Chung (Stephen) Lee, Freescale Semiconductor, Inc.
1:00 PM - 5:00 PM

Die-Breakage and Ultra-Low-Loop Wire Bond Mechanisms for Very Thin Overhang Stacked Die
Jovy Michael G. Sena, Marcelino Buenaflor, Ireneo Villavert, Oerlikon ESEC USA Inc.

Addressing Challenges of Stacked Die Wire Bonding
Shinichi Nishiura, Shinkawa Ltd.

Wire Bond Challenges of Stacked Dice Devices
Charles J. Vath, III, J. Premkumar, M. Sivakumar, M. Kumar, ASM Tech Singapore, Pte. Ltd.

Break: 2:30 pm - 3:00 pm

Copper Wire Bonding for Mid to High I/O Count Packages
Bob Chylak, Kulicke and Soffa Industries Inc.

Investigation on Copper Wire Bonding Reliability on TQFP Package
Hong Meng Ho, Sutiono Sylvia, Jamin Ling, Kulicke & Soffa (S.E.A.) Pte., Ltd.; Spencer Chew, Andrea Soriano, Alvin Seah, Cookson  Semiconductor Packaging Materials

Bondability and Reliability of X-WireTM Insulated Wire for Advanced Packaging Applications
William Crockett, Y. K. Song, Microbonds Inc.; H. T. Lee, G. S. Yun, STATSChipPAC Ltd.

Converting Au Stud Bumps to a Non-Embrittling Surface for Sn Based Solders
Terence Q. Collier, CV Inc.

Closing Remarks: 5:05 pm

Register On-line | Hotel Reservations


Housing: Hotel Cut-off is June 27, 2008
The IMAPS ATW is being run at the Intercontinental San Francisco Hotel, in conjunction with SEMICON West.
To book online, Please visit the official housing site: https://www.cmrhousing.com/SEMI_S4/Welcome.aspx
Or call the SEMICON West Housing Office
Monday - Friday, 9am - 9pm (Eastern Time)
1.800.421.2499 (US & Canada)
1.415.979.2287 (International)

Room Rate: Single/Double: $245/night
Please reference SEMICON West when making reservations by phone.

InterContinental San Francisco Hotel
888 Howard Street
San Francisco, CA 94103

Speaker Dates/Information:

  • Abstract(s) due to IMAPS: April 25, 2008
  • Speaker Notification/Confirmation emailed: April 30, 2008
  • Extended Abstract or Presentation Material due: June 13, 2008
  • Powerpoint/Presentation file for CD-Rom due not later than: July 14, 2008
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


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Phone: 202-548-4001