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IMAPS and SEMI proudly announce a
Topical Workshop on

Wire Bonding
Thursday, July 15, 2010
San Francisco Marriott Hotel
San Francisco, CA

This event will be co-located with IMAPS Workshop on Advanced Interconnect Technologies
and with SEMICON West 2010

Early Registration Deadline: June 25, 2010

General Chair:

Wire Bonding Workshop Organizing Committee:

Lee Levine
Process Solutions Consulting
Phone: 610-248-2002
levilr@ptd.net

Joe Bubel

Hesse & Knipps

bubel@hesse-knipps.us

Bob Chylak

Kulicke & Soffa         

bchylak@kns.com

Daniel Evans

Palomar

devans@bonders.com

Mike McKeown

Orthodyne Electronics

mmckeown@kns.com

Leroy Christie

ASM Pacific

leroy.christie@asmpt.com




Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Thursday, July 15, 2010

Registration: 8:00 am - 3:40 pm

Continental Breakfast: 8:00 am - 9:00 am

Opening Remarks: 9:00 am - 9:15 am

Session 1: Fine Au & Cu Wire Bonding
Session Chair: Leroy Christie, ASM Pacific Technology, Ltd.
9:15 am - 12:30 pm
More than 90% of all chip interconnections are produced by wire bonding either fine gold or copper wire. Gold is still the dominant wire material but the use of copper wire is increasing rapidly and represents the highest growth segment of the market. This session will focus on the use of fine wire (<0.1mm diameter) for chip interconnection.

Ball Bonding with Pd-Coated Cu Wire
Horst Clauberg, John Foley, Bob Chylak, Kulicke & Soffa Industries, Inc.

Comparison of Bare Copper and Palladium Coated Copper Wire in Wire Bonding
Johnny Yeung, Dominik Stephan, Frank Wulff, Heraeus Materials Singapore Pte Ltd.

Fine Copper Wire Bonding for IC & Advanced Packaging Applications: Challenges & Solutions
Mohandass Siva Kumar, Balasubramanian Senthil Kumar, James Song, Leroy Christie, ASM Technology Singapore PTE LTD. 

Session 2: Heavy Wire Bonding
Session Chair: Mike McKeown, Orthodyne Electronics Corporation
9:15 am - 12:00 pm
Power devices are often bonded with larger diameter wire or ribbon and are widely used in automotive and power controlling applications. This session will focus on the unique metallurgical requirements for successfully bonding heavy wire and ribbon.

Wire Bond Surfaces for Large Diameter Aluminum Wire and PowerRibbon® Bonding
Mike McKeown, Orthodyne Electronics Corporation

Effects of Rigidity of Adhesively Attached Boards on Heavy Gage Al Wire Bond Performance
William S. Boyce, Sensata Technologies Inc.

Ribbon Bonding: Qualification Tests, Actual Projects, Problems
Martin Strasser, AB Mikroelektronik GmbH

Break: 10:45 am - 11:00 am

FAB Characterization for Copper Fine Pitch Bonding
Liming Shen, Don Capistrano, Adeline Lim, Oranna Yauw, Kulicke & Soffa Pte. Ltd.; John Foley, Kulicke & Soffa Industries, Inc.  

Active and Semi-Active Vibration Control of Ultrasonic Bonding Transducers
Marcus Neubauer, Sebastian M. Schwarzendahl, Jörg Wallaschek, Leibniz University Hannover; Michael Brökelmann, Hans-J. Hesse, Hesse & Knipps GmbH

Conditions for Optimized Deep Access - Gold Ball Bonding Performance
Larry E. Crider, Stephen Russell, Christopher Martin, Harris GCSD

A Low Cost Aluminum Wire Bondable Nickel Coating For use in Electronic Applications
Michael J. Brouillard, Sumco LLC

The Effects of Loop Geometry on Life Test Durability for 10mil Al Wire Bonds
William S. Boyce, Sensata Technologies Inc.

Lunch: 12:30 pm - 1:30 pm

Session 3: Wire Bonding Reliability and Testing
Session Chair: Daniel Evans, Palomar Technologies, Inc.
1:35 pm - 3:35 pm
Assuring the reliability of wire bonds by mechanically testing has been adopted widely. Pull testing and shear testing on a sampling basis are common. New in-process techniques are always of interest, especially in environments where high-reliability is required. This session will focus on wire bonding quality and reliability.

Improved Bond Reliability Through the use of Auxiliary Wires (Security Bumps/Wires and Stand-Off Stitch - Stitch on Bump)
David Rasmussen, Palomar Technologies, Inc.; Rod Thompson, Goodrich Corporation

Automatically Better Pull- and Shear Tests
Josef Sedlmair, Siegfried Seidl, Farhad Farassat, F&K Delvotec Semiconductor GmbH

The Importance of Bond Strength Measurement
Bob Sykes, XYZTEC

Adverse Effects of Cross Contamination of AgPd Bond Pads During Processing
William S. Boyce, Sensata Technologies Inc.

Closing Remarks: 3:35 pm

Register On-Line



Housing:Hotel Cut-off is July 1, 2010

The IMAPS Topical Workshop is being run at the San Francisco Marriott Hotel, in conjunction with SEMICON West.

San Francisco Marriott Hotel
55 Fourth Street
San Francisco, CA 94103

To book online, Please visit the official housing site: Several hotels to choose from. Room Rates Vary. https://www.cmrhousing.com/SEMI_S6/HotelList.aspx

Or call the SEMICON West Housing Office
Monday - Friday, 6:00am - 6:00pm Pacific Standard Time
1.800.421.2499 (US & Canada)
1.415.979.2287 (International)
Please reference SEMICON West when making reservations by phone.


Speaker Dates/Information:

  • Abstract(s) due to IMAPS: April 30, 2010
  • Speaker Notification/Confirmation emailed: May 10, 2010
  • Extended Abstract or Presentation Material due: June 18, 2010
  • Powerpoint/Presentation file for CD-Rom due not later than: July 15, 2010
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


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Phone: 202-548-4001