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IMAPS and SEMI proudly announce a
Topical Workshop on

Wire Bonding
Thursday, July 14, 2011
San Francisco Marriott Hotel
San Francisco, CA

Be sure to attend other IMAPS co-located events:
IMAPS Workshop on Advanced Interconnect and Substrate Technologies (July 13); and

IMAPS TechXPOT on Next Generation Materials and Processing for High Performance Packaging (July 13).
And don't miss othe activities at SEMICON West 2011

Early Registration Deadline: June 29, 2011
Hotel Deadline: June 29, 2011

General Chair:

Wire Bonding Workshop Organizing Committee:

Lee Levine
Process Solutions Consulting
Phone: 610-248-2002

Joe Bubel

Hesse & Knipps

Bob Chylak

Kulicke & Soffa 

Daniel Evans


Mike McKeown

Materion Technical Materials

Leroy Christie

ASM Pacific

Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Thursday, July 14, 2011

Registration: 7:00 am - 5:30 pm

Continental Breakfast: 7:00 am - 7:55 am

Opening Remarks: 7:55 am - 8:00 am

Session Chair: Michael McKeown, Materion Technical Materials
8:00 am - 12:00 pm
More than 90% of all chip interconnections are produced by wire bonding either fine gold or copper wire. Gold is still the dominant wire material but the use of copper wire is increasing rapidly and represents the highest growth segment of the market. This session will focus on the use of fine wire (<0.05mm diameter) for chip interconnection.

Getting the Most Out of Gold in Wire Bonding in Semiconductor Packaging
Charles J. Vath, III, Richard Holliday, ComSol Consulting Pte. Ltd.

Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
Daniel D. Evans, Jr., David Rasmussen, Palomar Technologies, Inc.

Physically Robust Interconnect Design n BOAC for Cu Wire Bond
Stevan Hunter, Troy Ruud, Bryce Rasmussen, Diann Dow, Harald Anderson, Jim Mohr, ON Semiconductor

Ball Bond Aging with Integrated Under-Pad Microheater
Michael Mayer, Michael McCracken, Samuel Kim, John Persic, University of Waterloo

Break: 10:00 am - 10:30 am

Fine Pitch Cu Wire Bonding Reaching Maturity
Bernd K. Appelt, Andy Tseng, William T. Chen, ASE Group

The Growth of Copper Ball Bonding
Lee Levine, Process Solutions Consulting, Inc.

Enabling Ultra Fine Pitch Copper Wire Bonding: FAB Formation
John Foley, Bob Chylak, Ivy Qin, Tom Rockey, Kulicke and Soffa Industries, Inc.

Lunch: 12:00 pm - 1:00 pm

Session Chair: Charles Vath III, ComSol Consulting Pte. Ltd.
1:00 pm - 4:30 pm
Wedge bonding is a versatile process often used for heavy wire and ribbon applications but today, because of significant advancements in speed, placement accuracy, and process control it is finding more usage in fine pitch applications. This year’s program will cover both heavy and fine wire applications.

Why Wedge Bond?
Lee Levine, Process Solutions Consulting, Inc.

A New Look at Fine Wire Aluminum Bonding for Molded Packages
K. Pham, A. Prabhu, L. Nguyen, A. Poddar, National Semiconductor Corporation

The Effect of Force and Power Ramping of the Bonding of Large Packages for Heavy Aluminum Wire Bonds
Mario Marin, Delphi Automotive Systems

Evaluation of Al-Cu Intermetallic Growth at High Temperatures used in PowerClad Ribbon & Leadframe Bonding Applications
Mike McKeown, Barry Njoes, Robert Willis, Materion Technical Materials

Break: 3:00 pm - 3:30 pm

The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules
Mario Marin, Delphi Automotive Systems

Multifilament Tether for Electric Solar Wind Sail
Henri Seppänen, Sergiy Kiprich, Risto Kurppa, Jukka Ukkonen, Tuomo Ylitalo, Pekka Janhunen, Edward Hæggström, University of Helsinki

Round Table Discussion
Moderator: Lee Levine, Process Solutions Consulting, Inc.
4:30 pm - 5:30 pm
This year’s panel will discuss the future of wire bonding: materials, processes, devices.

Bob Chylak, Kulicke & Soffa Industries, Inc.
Leroy Christie, ASM Pacific Technology, Ltd.
Dan Evans, Palomar Technologies, Inc.
Bernd Appelt, ASE Group
Flynn Carson, STATS ChipPAC Ltd.

Closing Remarks: 5:30 pm

Housing:Hotel Cut-off is June 29, 2011

The IMAPS Topical Workshop is being run at the San Francisco Marriott Hotel, in conjunction with SEMICON West.

San Francisco Marriott Hotel
55 Fourth Street
San Francisco, CA 94103

Speaker Dates/Information:

  • Abstract(s) due to IMAPS: April 30, 2011
  • Speaker Notification/Confirmation emailed: May 10, 2011
  • Extended Abstract or Presentation Material due: June 18, 2011
  • Early Registration Deadline: June 29, 2011
  • Hotel Deadline: June 29, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: July 14, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


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Phone: 202-548-4001