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Topical Workshop & Tabletop Exhibition on
Wire Bonding

January 22-23, 2013
Radisson Hotel San Jose Airport
San Jose, CA 95112

Early Registration/Hotel Deadline: December 21, 2012

Tabletop Exhibits SOLD OUT

General Chair:
Lee Levine
Process Solutions Consulting
Phone: 610-248-2002
levilr@ptd.net

Wire Bonding Workshop Organizing Committee:

Dana Baedke

Key Marketing

dana@keymarketing.biz

Joe Bubel

Hesse Mechatronics

joseph.bubel@hesse-mechatronics.us

Leroy Christie

ASM Pacific

leroy.christie@asmpt.com

Bob Chylak

Kulicke & Soffa         

bchylak@kns.com

Bud Crockett

Tanaka

w-crockett@ml.tanaka.co.jp

Doug Day

Shinkawa

d_day@shinkawausa.com

Daniel Evans

Palomar

devans@bonders.com

Mark Greenwell

CoorsTek Gaiser Tools

mgreenwell@coorstek.com

Amy Low

Heraeus

amy.low@heraeus.com

Mike McKeown

Materion Technical Materials

mike.mckeown@materion.com

Alon Menachel

RED Micro Wire

amenache@redmicrowire.com

Josef Sedlmair

F&K Delvotec

imaps@sedlmair.org

Vito Tanzi

Ametek

vito.tanzi@ametek.com

Uri Zaks

MicroPoint Tools

uriz@mpptools.com

Thank you to Corporate Sponsor:

Corporate Sponsor: F&K Delvotec




Wire Bonding Workshop Focus:
The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

Tuesday, January 22, 2013

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:15 am - 7:50 am

Exhibits Open: 10:30 am - 6:30 pm (Breaks, Lunch & Reception in the Exhibit area)

Opening Remarks: 7:50 am
Lee Levine - General Chair

Session 1: Metallurgy and Bond Pad Design
Session Chair: Mike McKeown, Materion Technical Materials
8:00 am - 10:30 am

The Metallurgy of Wire Bonding: Au, Cu, Al, Ag -- (60 Minutes)
Lee Levine, Process Solutions Consulting, Inc.

Use of Wire Bonding to Study Bond Pad Damage from Wafer Probe
Stevan Hunter, Idaho State University & ON Semiconductor

A Bond Pad's View of Wirebonding
Stevan Hunter, Idaho State University & ON Semiconductor (Rob Warnick, Ryan Gohnert, Alan Dutson, Brigham Young University)

Eless NiPd and NiPdAu OPM: A Low Cost, High Throughput Solution for Enhanced Gold and Copper Wire Bond Reliability
Richard McKee, Pac Tech USA (Dr. Thorsten Teutsch; Dr. Elke Zakel; Thomas Oppert; and Ghassem Azdasht)

Break in Exhibits: 10:30 am - 11:00 am

Session 2: Contamination
Session Chair: Stevan Hunter, Idaho State University & ON Semiconductor
11:00 am - 12:00 pm

CO2 Surface Preparation for Wire Bonding
David Jackson, CleanLogix LLC

Impact of Thin, Non-Visible Residues on Gold Wire Bond Reliability
Carlyn Smith, Harris Corporation

Lunch: 12:00 pm - 1:00 pm

Session 3: Overview
Session Chair: Lee Levine, Process Solutions Consulting
1:00 pm - 2:00 pm

Overview of Precious Metal Financing and Hedging (60 minutes)
Paul Angland, HSBC Bank USA, National Association

Session 4: Copper Ball Bonding
Session Chair: Leroy Christie, ASM Pacific Technology, Ltd.
2:00 pm - 5:30 pm

Critical Barriers in Fine Pitch Applications Associated with Copper Wire
William Crockett Jr., Tanaka Denshi

Cu Wire Package Reliability Failure Mechanism and Factors Including Molding Compounds
Hidenori Abe, Hitachi Chemical Co., Ltd. (Dongchul Kang, Takahiro Horie, Yoshinori Endo, Masahiko Osaka, Shinya Nakamura)

Break in Exhibits: 3:00 pm - 3:30 pm

Gold to Copper Wire Process Adaptive Capillary Changes
Cesar Alfaro, CoorsTek Gaiser Products (Mark Greenwell)

Microelectronics Interconnection Using Alloyed Copper Wire with Homogeneous Structure
S. Murali, Heraeus Materials Singapore Pte Ltd (Ei Phyu, Phyu Thient, Hoo Siew Mei, Johnny Yeung, Roman Perez)

Meeting the Next Level of Challenges in HVM on Copper Wire Bonding - A Capillary Perspective
Jason Tan, SPT/Small Precision Tools

Wirebond Interconnect: Will it Stand the Test of Time in Era of Shrinking Technology Nodes and Increasing Technology Complexity?
Rich Rice, ASE US, Inc.

Networking & Exhibitor Reception: 5:30 pm - 6:30 pm


Wednesday, January 23, 2013

Registration: 7:00 am - 12:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibits Open: 8:00 am - 10:30 am (Break in the Exhibit area)

Session 5: Alternative Wires and Bonds
Session Chair: Bud Crockett, Tanaka
8:00 am - 9:30 am

The Future of Ag Alloy Wire for Wire Bonding on Al Pad & IC Applications
Leroy Christie, ASM Pacific Technology, Ltd.

Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
Dan Evans, Palomar Technologies (David Rasmussen)

1 km Micro Wire Space Tether Production
Timo Rauhala, Finnish Meteorological Institute (Henri Seppanen, Edward Haggstram)

Break: 9:30 am - 10:00 am

Session 6: Wedge Bonding
Session Chair: Jamin Ling, Kulicke & Soffa Industries
10:00 am - 12:30 pm

Electrical Current Capabilities & Characteristics of Al Inlay Leadframes for Power Modules
Mike McKeown, Materion Technical Materials (Barry Njoes)

Pitfalls in Wirebonding: How to Deal with Resonances
Josef Sedlmair, F&K Delvotec GmbH

Ultra Fine Pitch Wedge Bonding
Uri Zaks, Micro Point Pro Ltd.

The Advantages of Wedge Bonding
Lee Levine, Hesse Mechatronics

Large Cu Wire Wedge Bonding
Jamin Ling, Kulicke & Soffa Industries (Tao Xu, Raymond Chen, Orlando Valentine, Christoph Luechinger)

Closing Remarks: 12:30 pm



Registration Information:(Early Registration Deadline: December 21, 2012)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 12/21/12
Advance/Onsite Fee
After 12/21/12
IMAPS Member
$375
$475
Non-Member
$475
$575
Speaker
$275
$325
Chair
$275
$325
Student
$100
$150
Chapter Officer
$275
$325
Tabletop Exhibit (Member)
$450
$500
Tabletop Exhibit (Non-Member)
$500
$550
Corporate Sponsorship (Includes Tabletop & 1 Attendee)
$1000
$1000



Housing: Hotel Cut-off is December 21, 2012

The IMAPS Topical Workshop is being run at the Radisson Hotel San Jose Airport. Rooms must be booked directly with the hotel:

Radisson Hotel San Jose Airport
1471 N. Fourth Street
San Jose, California, 95112
Telephone: 408-452-0200

Room Rate: $119 + taxes

Telephone Reservations: mention IMAPS Wire Bonding Workshop to receive the discounted room rates.

 



Speaker Dates/Information:

  • Abstract(s) due to IMAPS: October 16, 2012
  • Speaker Notification/Confirmation emailed: November 30, 2012
  • Extended Abstract or Presentation Material due: December 14, 2012
  • Early Registration Deadline: December 21, 2012
  • Hotel Deadline: December 21, 2012
  • Powerpoint/Presentation file for CD-Rom due not later than: January 23, 2013
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - unless otherwise noted

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.
The presentation file you load on the laptop will be used on the post-event CD-Rom.
If you have changes or omissions from the CD, please speak with Brian Schieman before leaving the event.
.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

 


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