Advanced Technology Workshop & Tabletop Exhibits on
Additive Manufacturing &
Printed Electronics

June 28-29, 2016
UMass Lowell Inn and Conference Center
Lowell, MA 01852

General Chair
Craig Armiento
Professor, Electrical and Computer Engineering
University of Massachusetts Lowell
Director, Printed Electronics Research Collaborative (PERC)
Co-Director, Raytheon-U Mass Lowell Research Institute (RURI)


Technical Committee:
Michael Renn, Optomec
Daniel Hines, Laboratory for Physical Sciences
James Zunino, Army US Army RDAR-MEE-M

Local Arrangements Chair:
Diana Locey, University of Massachusetts Lowell


Thank you to our Premier Sponsors!


Creative Materials


Workshop Focus:

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop on ADDITIVE MANUFACTURING and PRINTED ELECTRONICS on June 28-29, 2016. Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable.  The workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and will exploit additive approaches to advance microelectronic packaging.  Conference sessions will cover the development of printable electronic materials (inks), the options for manufacturing/printing and the applications of printed and flexible electronics.


7:30am-6:00pm Registration Open

7:30am-8:30am Continental Breakfast


Exhibits Open

Creative Materials
Utz Technologies
Henkel Electronic Materials
CadQal Development, Inc.
American Beryllia Inc.
Riv Precision Printing Screens
Chromaline Screen Printing
Advantech US, Inc.
Xenon Technology
University of Massachusetts Lowell
Geib Refining
Novarials Corporation

8:30am-8:40am Welcome & Opening Remarks: Craig Armiento - General Chair


NextFlex: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics

As America's Flexible Hybrid Electronics Manufacturing Innovation Institute, NextFlex is a public-private partnership launched by the Department of Defense to establish a manufacturing ecosystem for flexible hybrid electronics in the U.S. By bringing together resources and personnel from the federal government, state and local governments, companies, universities, and non-profit entities NextFlex will develop manufacturing technology that will enable applications including wearable human monitoring systems, integrated antennas, asset monitoring systems, and soft robotics. This talk will provide an overview of NextFlex, including technical working groups, manufacturing roadmaps, technical projects, workforce development, and membership structure.

Ben Leever

Ben Leever, Next Flex, AFRL
Benjamin Leever is currently a Senior Materials Engineer in the Air Force Research Laboratory (AFRL) Soft Matter Materials Branch. His primary roles are Portfolio Lead for Airman Performance Monitoring and Government Chief Technology Officer of NextFlex, a $170M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. In support of AFRL’s investments in Airman Performance Monitoring & Aeromedicine, Dr. Leever determines technical strategy, manages AFRL contracts, and establishes industrial, academic, and governmental collaborations. He also leads the directorate’s Energy Integrated Product Team and respresents the directorate on numerous domestic and international power & energy and additive manufacturing working groups.

Prior to assuming his current duties, Dr. Leever led a research team focused on the development and modeling of multifunctional materials for structural power applications. Dr. Leever began his career at AFRL in the Manufacturing Technology Division, where he managed programs related to electro-optics systems. He earned a B.S. in Chemical Engineering from the University of Cincinnati and a Ph.D. in Materials Science & Engineering from Northwestern University.


Session Chair: Michael Renn, Optomec

9:30am-10:00am Aerosol Jet Printing of Electrically Conducting Inks of Flexible Substrates
Himal Khatri, Yan Zhou, Aziz Shaikh, Todd Williams (Henkel); Michael Renn, David Sessoms, Kelly McDonald (Optomec)
10:00am-10:30am Micrometer-Scale 3D Printed Electronics
Kurt Christenson (Optomec)


Coffee Break

Sponsored by:

11:00am-11:30am Development and Characterization of Conductive and Wetable Inks
Michael Carr (NJIT)
11:30am-12:00pm Manufacturing of Polymeric Substrates and Materials for Roll to Roll and Additive Processes
Joey Mead, Carol Barry, Alkim Akyurtlu (University of Massachuetts Lowell); Mary Herndon (Raytheon)
12:00pm-12:30pm Microstructured Multifunctional Monofilament
L.J. Holmes (ARL)

12:30pm-1:30pm Lunch


Session Chair: Daniel Hines, Laboratory for Physical Sciences


Digital 3D Printing Processes for the Fabrication of Flexible Wearable Electronics at ARL
Harvey Tsang (ARL)

Enabling Nanoinks for Direct Write and Additive Manufacturing
Adam Cook (Sandia National Labs.)

2:00pm-2:30pm Multi3D Manufacturing for Multi-Functional Applications
Eric MacDonald (University of Texas El Paso - UTEP)
2:30pm-3:00pm Aerosol Jet Deposited Conductors and Dielectrics for Rapid Fabrication of Heterogeneous Electronic Systems
Brian Smith (Draper Labs.); Peter Lewis, Robert White (Tufts University)


Coffee Break in the Exhibit Area

Sponsored by:

3:30pm-4:00pm Additive Manufacturing of 3-D Nanoscale Interconnects for Printed Electronics and Flexible Electronics
Cihan Yilmaz, Ahmed Businina (Northeastern University)
4:00pm-4:30pm Direct – Write Printing Methods for the Fabrication of Printed Hybrid Electronics
Dan Hines (Laboratory for Physical Sciences)

Reception & Tour:
Emerging Technologies and Innovation Center (ETIC)
The ETIC houses cutting-edge programs in nanomedicine, nanomanufacturing, plastics and elastomers, clean-room technologies, biomaterials develoment and more. These are fast-developing fields with growing career prospects and promising industry partnership opportunities.

Transportation will leave the conference center after sessions (4:30pm). There will be a light reception followed by a tour of ETIC.

Student Poster Session TBD
Poster Session Chairs: Prof. Joey Mead and Prof. Carol Barry, UMass Lowell



Thank you to our Premier Sponsors!


Creative Materials




7:30am-12:00pm Registration Open

7:30am-8:30am Continental Breakfast


Session Chair: James Zunino, Army US Army RDAR-MEE-M

8:30am-9:00am Additive Manufacturing of RF and Power Systems
Jonathan Dixon, Erik Handy, Joseph Kunze (SI2 Technologies)
9:00am-9:30am Digital Manufacturing and Performance Testing for Application Specific Electronic Packaging (ASEP)
Mike Newton (Sciperio)
9:30am-10:00am Additive Manufacturing at Raytheon: Rapid Prototyping, Multi-Functional Design, and Implementation Challenges for DoD Applications
Mary Herndon, Jeff Shubrooks, Gregory Beninati (Raytheon)


Coffee Break

Sponsored by:

10:15am-10:45am Integration of Printed Electronics, Energetics, Materials and Sensors for US Army Applications
James Zunino, G.L. Benedetto, D.H. Sabanosh, D.P. Schmidt, K.J. Duncan (US Army RDECOM-ARDEC)
10:45am-11:15am Tunable, Printed RF Electronics
Craig Armiento and Alkim Akyurtlu (University of Massachusetts Lowell)
11:15am-11:45am Manufacturing of Wearable Sensors for Human Health and Performance Monitoring
Azar Alizadeh (GE Global Research)
11:45am-12:15pm Multi-material 3D Printing for Electrical and Wearable Applications
Michael Bell (Voxel8)

12:15pm Closing Remarks



Registration Information: (Early Registration Deadline: June 6, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 6/6/2016
Advance/Onsite Fee
After 6/6/2016
IMAPS Member
Tabletop Exhibit (Member)
Includes 1 6-ft tabletop space, 1 attendee registration w/meals included.
Tabletop Exhibit (Non-Member)
Includes 1 6-ft tabletop space, 1 attendee registration w/meals included.
Premier Sponsorship
Includes 1 6-ft tabletopspace, 3 attendee registrations w/meals, & program advertisement

Speaker Dates/Information:

  • Speaker Notifications Sent: May 13, 2016
  • Early Registration Deadline: June 6, 2016
  • Lodging Deadline: June 8, 2016
  • Speaker BIO & Photo Due: June 20, 2016
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: June 29, 2016
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Hotel Reservations: (Hotel Deadline: now JUNE 8, 2016 at 5pm EASTERN)

Reservation must be made directly with the:

UMass Lowell Inn and Conference Center
50 Warren Street
Lowell MA 01852



  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic