Micross

Advanced Technology Workshop on
Additive Manufacturing

September 13-14, 2017
Jackson Center
6001 Moquin Dr, Huntsville, AL 35806


General Chair
Tracy Hudson, U. S. Army AMRDEC

Technical Chair
Robert Dean, Auburn University

Technical Committee:
Janice Booth (AMRDEC); Jeffrey Gaddes (AMRDEC), Phillip Farrington (UAHuntsville), Mike Kranz (EngeniusMicro LLC), Paul Ruffin (Alabama A&M Univ), Mohamed A. Seif (AAMU), Judith Schneider (UAHuntsville), Nima Shamsaei (Auburn Univ), Michael Whitley (EngeniusMicro LLC)


Early Registration Deadline: August 23, 2017

HOTEL | REGISTRATION | SPEAKER INFO | STUDENT COMPETITION


Workshop Focus:

The International Microelectronics Assembly and Packaging Society (IMAPS) and the IMAPS Huntsville Chapter will host an Advanced Technical Workshop on ADDITIVE MANUFACTURING. Printing technology is expected to enable the evolution of electronics from rigid boards and complex mechanical support structures to products that are flexible, conformal or wearable. The workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and unique mechanical packaging techniques and tooling and will exploit additive approaches to advance microelectronic mechanical system packaging. Sessions will cover the development of printable electronic materials, the options for manufacturing/printing, and the presentation topics you see outlined below.

 



 

WEDNESDAY, SEPTEMBER 13, 2017


8:00am - 5:00pm

Registration Open


8:00am - 8:45am

Coffee


8:45am - 9:00am

Workshop Opening Remarks
General Chair: Tracy Hudson, U. S. Army AMRDEC


9:00am - 9:45am

Keynote - Eric Macdonald

KEYNOTE: 3D Printing of Multi-Functional Structures
In the last decade, research has focused on 3D printing for not only creating conceptual models but functional end-use products as well. As patents for 3D printing expire, new low cost desktop systems are being adopted more widely. This trend is leading to products being fabricated locally and improving supply chain logistics. However, currently low cost 3D printing is limited in the number of materials used simultaneously in fabrication and consequently is confined to fabricating enclosures and conceptual models. For additively manufactured end-use products to be economically meaningful, additional functionalities will need to be incorporated in terms of electronic, electromechanical, electromagnetic, thermodynamic, and optical content. Research has recently focused on embedding electronic components and electrical interconnect into 3D printed structures either by interrupting the process or by inserting the additional content after the structure has been built. However, only until recently and with an investment from the national initiative on Additive Manufacturing – America Makes – has there been a concentrated research focus on developing technology that provides multi-functionality. This presentation will review work in multi-process 3D printing for creating structures with electromechanical actuation and electro-propulsion.

Eric MacDonald, Ph.D. is a professor of electrical and computer engineering – with a joint appointment in manufacturing program and is the Friedman Chair for Manufacturing at Youngstown State University. Dr. MacDonald received his B.S. (1992), M.S. (1997) and Ph.D. (2002) degree in Electrical Engineering from the University of Texas at Austin. He worked in industry for 12 years at IBM and Motorola and subsequently co-founded a start-up - Pleiades Technologies, Inc. - specializing in self-test circuitry and CAD software and the startup was acquired by Magma Inc. (San Jose, CA). Dr. MacDonald spent 2003 to 2016 at the University of Texas at El Paso as the associate director of the W. M. Keck Center for 3D Innovation and held faculty fellowships at NASA’s Jet Propulsion Laboratory, SPAWAR Navy Research (San Diego) and a State Department Fulbright Fellowship in South America. His research interests include 3D printed multi-functional applications and closed-loop control in additive manufacturing with instrumentation and computer vision for improved quality and yield. Recent projects include 3D printing of structures such as nano satellites with electronics in the structure (one of which was launched into Low Earth Orbit in 2013 and a replica of which is on display at the London Museum of Science). He has over 50 refereed publications, several patents (one of which was licensed by Sony and Toshiba from IBM). He is a member of ASEE, senior member of IEEE and a registered Professional Engineer in Texas.


SESSION 1

MATERIALS FOR ADDITIVE MANUFACTURING
Session Chair: Charles Wu, Harding University

9:45am - 10:15am

Metal Powders for Additive Manufacturing in the Microelectronic Industry
Arslane Bouchemit, 5N Plus Micro Powders Inc. (Sylvain St-Laurent, Amir Nobari, Gilles L’Espérance)

10:15am - 10:45am

Overview of a Collaborative Research Project on Additive Manufacturing
Sherri Messimer, The University of Alabama in Huntsville (Phillip Farrington, Judy Schneider, The University of Alabama in Huntsville; Tony Overfelt, Lewis Payton, Auburn University; Jeffrey Gaddes, U.S. Army Aviation and Missile Research, Development, and Engineering Center)


10:45am - 11:30am

Coffee Break


11:30am - 12:00pm

Additive Manufacturing and Printed Electronics for Space Missions
Ian Small, NASA MSFC (Furman Thompson, Dong-il Moon, Myeonglok Seol, Jinwoo Han, Ram Gandhiraman, Jessica Koehne, M. Meyyappan, Niki Werkheiser)

12:00pm - 12:30pm

Laser Sintering for 3D Processing of Metal Nanoparticle Inks
James Feng, Optomec (Matt Schrandt, Jaxon Renn, Michael Renn)


12:30pm-2:00pm

Lunch Break & Networking


SESSION 2

ELECTRONIC DEVICES FROM ADDITIVE MANUFACTURING
Session Chair: Robert Dean, Auburn University

2:00pm - 2:30pm

PRESENTATION CANCELLED - WEATHER/TRAVEL ISSUES
Additive Manufacturing of Custom Magnetic Components for Power Electronics Systems
Guo-Quan Lu, Virginia Tech

2:30pm - 3:00pm

Additive Manufacturing for Antenna and RF Elements
Michael Kranz, EngeniusMicro (Michael Whitley, Carl Rudd, Janice Booth)

3:00pm - 3:30pm

Additive Manufacturing of an RF Connector
Carl Rudd, EngeniusMicro (Michael Kranz, Michael Whitley, Janice Booth)

3:30pm - 4:00pm

Additive Manufacturing of Phased Array Antenna Systems  
Erik Handy, SI2 Technologies, Inc.


4:00pm - 5:00pm

Networking "Happy Hour"


 

 



 

THURSDAY, SEPTEBMER 14, 2017


8:00am - 5:00pm

Registration Open


8:00am - 8:45am

Coffee


8:45am - 9:30am

James Zunino

KEYNOTE: Integration of Printed Electronics & Additive Manufacturing to Support Warfighters and Strengthen the Defense Industrial Base
Within the US Army and its strategic partners, printing technologies are allowing the design and manufacturing communities to realize the massive benefits and advantages now achievable. Additive Manufacturing, including printed and hybrid flex electronics, are changing the way military systems are designed, fabricated, tested, monitored, and manufactured. The ability to “print” designs that currently cannot be manufactured while removing component integration and geometry barriers is resulting in new enhanced functionality and allowing the DOD to revolutionize the defense industrial base. Recent advances in materials, process, and equipment will directly benefit current and future systems. By integrating printed electronics, polymers, metals, and energetics into/onto 3D structures, new solutions and applications can be realized to enhance our Warfighters’ capabilities. These technologies have allowed revolutionary changes in design, materials, and fabrication of components and sub-systems for numerous military applications. These capabilities are helping the DOD and its strategic partners to capitalize on these technological breakthroughs and to develop systems that are “smarter,” more rapidly deployable, lighter and smaller. Total Life-Cycle benefits from design to de-mil are being realized through the advancement of printed electronics and additive manufacturing. Unique military considerations, current technology barriers, and recent applications for military and the Defense Industrial Base will be discussed.

Mr. James Zunino is a Materials Engineer within the Armaments Engineering Analysis & Manufacturing Directorate, located at the U.S Army Research, Development and Engineering Center (ARDEC), Picatinny Arsenal, NJ. He serves as the subject matter expert on additive manufacturing, smart coatings, flexible electronics, materials printing, and novel ink development at ARDEC. He helped established the Army Additive Manufacturing Community of Practice and coordinates AM efforts across the DOD and its strategic partners. Mr. Zunino provides technical support to ARDEC's broad mission and is responsible for designing, testing, and overseeing AM related technologies. Mr. Zunino works with customers and end users to develop systems and provide solutions to help meet their requirements and needs. He holds a Master's of Business Administration and a B.S in Chemical Engineering from New Jersey Institute of Technology. He has received numerous awards including: Thomas Alva Edison Patent Award, Department of the Army Research and Development Achievement Award, IDTechEx Academic R&D, as well as other DoD and Industry awards.


SESSION 3

METROLOGY & MATERIAL CHARACTERIZATION
Session Chair: Janice Booth, U. S. Army AMRDEC

9:30am - 10:00am

In-Situ Monitoring of Melt Pool Images for Porosity Prediction in Laser-Based Additive Manufacturing Processes
Linkan Bian, Mississippi State University (Mojtaba Khanzadeh, Mark Tschopp)

10:00am - 10:30am

Prediction and Control of Metal Microsctructure Produced by Selective Laser Melting
J. Vernon Cole, CFD Research Corporation (Paul W. C. Northrop)

10:30am - 11:00am

A Comparative Study between 3D Printing and Extrusion/Forming Sheet Processes Using In-Plane and Out-of-Plane Shear Strength Testing of ABS, HIPS and PLA Plastics
Mohamed Seif, Alabama A&M University (Janice Booth, Michael Whitley, Michael Kranz, Paul Ruffin)


11:00am - 12:30pm

Coffee Break &
STUDENT POSTER COMPETITION

Session Chair: Sherri Messimer, University of Alabama in Huntsville


 

Material Property Gradients in Additive Manufacturing of Multifunctional Structures
Ryan Anderson, University of Alabama in Huntsville (Chris Hill, Judy Schneider)

Modeling of the Global Thermal Temperature in Free Form 3D Printing
Tom Stockman, University of Alabama in Huntsville (Judy Schneider)

Embedded Electronics in 3D Printing of Nanocomposite Polymers
Jamel Alexander, Mississippi State University (Zack Myers, Judy Schneider, University of Alabama in Huntsville)

Strain Rate Effect on the Tension and Compression Stress-State Asymmetry for Electron Beam Additive Manufactured Ti6Al4V
Omar Rodriguez, The University of Alabama (Paul Allison, Wilburn Whittington, Haitham El Kadiri)

Strain Rate and Temperature Dependence of Solid-State AM IN625
Omar Rodriguez, The University of Alabama (Paul Allison, Mark Barkey, Wilburn Whittington, Haitham El Kadiri)

 

Analysis of Conformal Wideband Microstrip Patch Antennas
Tanzeela Mitha, University of Alabama in Huntsville (Maria Pour)

A Statistical Approach to Porosity Characterization of Additively Manufactured Parts based on XCT Data
Behnam Rasoolian, Auburn University (Daniel Silva, Nima Shamsaei, Scott Thompson, Shuai Shao)

A Comparison of Sierpinski Patch Antennas Operating at Wi-Fi Frequencies Manufactured Using Different Fabrication Techniques
Thomas Garner, University of Mississippi (W. Elliott Hutchcraft, Richard Gordon, Ellen Lackey, Janice Booth, Michael Whitley, Carl Rudd)

Application of High-Temperature Thermoplastic to 3D Printed Hydroponics Growth Systems, Adding Sustainable Food Production Capabilities to Human Spaceflight and Manned Mars Missions
Mauricio Henriquez Schott, Auburn University (David Blersch, Gregory Harris)


12:30pm

Closing Remarks
General Chair: Tracy Hudson, U. S. Army AMRDEC


 

 

 



 

Student Paper/Poster Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award cash prizes to the winning student(s). Additionally, out of town students will be considered for $125 travel grants, based on the quality of their abstracts. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

 



Registration Information: (Early Registration Deadline: August 23, 2017)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 8/23/2017
Advance/Onsite Fee
After 8/23/2017
IMAPS Member
$550
$650
Non-Member
$650
$750
Speaker
$400
$500
Chair
$400
$500
Student
$100
$150
Premier Sponsorship
Includes 1 6-ft tabletopspace, 1 session badge, 1 exhibit badges w/meals, & advertisements
$1000
$1000



Speaker Dates/Information:

  • Abstracts Deadline Extended to:JULY 12, 2017
  • Speaker Notifications Sent: August 4, 2017
  • Early Registration Deadline: August 23, 2017
  • Speaker BIO Due: September 1, 2017
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: September 14, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions (Keynotes: 40 minutes + 5 Q/A)
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

 


Hotel Reservations:

THERE IS NO "HOST HOTEL" with this event.

We recommend you search online for Huntsville Hotels near the Jackson Center. IMAPS has no relationship with the following hotels, nor can we speak to or be responsible for the quality/service, but here are some options that we found in a simple google search:

Element Huntsville
Home2 Suites Huntsville
Hampton Inn and Suites Huntsville/Research Park
Candlewood Suites
Holiday Inn Huntsville Research Park
Fairfield Inn Huntsville Research Park

 

 

 


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