Advanced Technology Workshop and Tabletop Exhibition on
Advances in Semiconductor Packaging

SUNY Polytechnic Institute - Kunsela Hall
Marcy, New York - USA
September 24, 2015

Presentations to take place in Kunsela Hall Auditorium
Tabletop exhibits to be set up in lobby.
Link to parking and campus map:

Early Registration Deadline Extended to: September 16, 2015

Tabletop Exhibits - SOLD OUT

Speaker Information

General Chair:
Andy Mackie, Indium Corporation


Thank you to our Premier Sponsors:
Indium Corp - Premier Presentations Sponsor
Universal Instruments - Premier Sponsor

From mobile device logic chips on coreless substrates, to 3D memory chip stacks in servers; from "jelly bean" QFN power management devices in automotive engine control modules, to MEMS gyroscopes in heads-up displays – the world of semiconductor packaging has never been more diverse or more complex. This ATW will bring together experts to discuss challenges in assembly processes, materials and packaging technologies, and the technology advances that are being made to overcome these challenges.


Thursday, September 24

Registration Open: 7:30 am – 5:00 pm
Coffee: 8:00 am – 8:30 am

8:00 am – 8:15 am:  Welcome (IMAPS) and Overview (SUNY Poly)
General Chair: Andy Mackie, Indium Corporation; and SUNY Poly Staff

8:15 am – 9:00 am:  Tour of SUNY Poly

Break & Exhibits: 9:00 am – 9:30 am

Keynote Presentation: 9:30 am – 10:15 am
The Future for Semiconductor Packaging: 2.5D, 3D and Beyond

John U. Knickerbocker, IBM Research Division, Thomas J. Watson Research Center
Dr. Knickerbocker is an IBM Distinguished Engineer. He is the executive manager of 3D Semiconductor Packaging Technology at IBM Research. He received his PhD degree in 1982 from the University of Illinois studying Materials Science & Engineering. He has over 32 years’ experience in IBM Microelectronics Research and Development driving new technologies into volume manufacturing products. He has authored or co-authored over 210 patents or patent applications and more than 75 technical papers and publications. He has 10 years of participation with the Advanced Packaging Technology Committee at Electronic Components and Technology Conference (IEEE).

More than Moore and Power Device Packaging
10:15 am – 11:00 am – Pierric Gueguen, Yole Developpment

Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields
11:00 am – 11:30 am -- Guan Tatt Yeoh, ZESTRON 
(Umut Tosun, Ravi Parthasarathy)  

Appropriate Curing Condition for Highly Thermal Resistant Temporary bonding Adhesive 
11:30 am – 12:00 pm -- Toru Okazawa, Toray Industries, Inc.
(James Castracane,Stephen Olson, SUNY Polytechnic Institute; Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa, Toray Industries, Inc.) 

Lunch Break & Exhibits: 12:00 pm - 1:30 pm

Ultra-Low Residue (ULR) Semiconductor Grade Fluxes for Flip-Chip and MEMs Applications 
1:30 pm – 2:00 pm – Derrick Herron, Indium Corporation 
(Maria Durham, Sze Pei Lim, Jason Chou, Andy Mackie)

Thermal Assessment of Proposed AFRL Stacked Memory Processor
2:00 pm – 2:30 pm -- Tyler Mannise, SUNY Polytechnic 
(Mike Allen, Dr. Douglas Holzhauer)

Bonding Si dice to Al with TPI and Bondfoil
2:30 pm – 3:00 pm -- Jim Fraivillig, Fraivillig Technologies 
(Richard Koba, Kent Hutchings, Materion Advanced Materials)

Break & Exhibits: 3:00 pm – 3:30 pm

Advancements in Through Glass Via (TGV) Technology
3:30 pm – 4:00 pm – Aric Shorey, Corning, Inc. 

Silicon Wafers to Flexible Glass: Manufacturing of Flexible Hybrid Electronics
4:00 pm – 4:30 pm -- Mark Poliks, Binghamton University

2.5D Packaging Integration Assembly Placement Challenges
4:30 pm – 5:00 pm -- James Wilcox, Universal Instruments Corporation 
(Michael Yingling, Ajay Bodade)

Closing Remarks: 5:00 pm



Thank you to our Premier Sponsors:
Indium Corp - Premier Presentations Sponsor
Universal Instruments - Premier Sponsor


Exhibitor Information:

The venue in 2015 tabletop space has SOLD OUT

Exhibit Hours:
Thursday, September 24 - During Breaks and Lunch - 9:00 am - 3:30 pm

Installation Hours:
Thursday, September 24 - Before Morning Break: 8:00 am - 9:00 am

Dismantle Hours:
Thursday, September 24 - Following Afternoon Break: 3:30 pm - 5:30pm

Tabletop Registration Fees:

Through 9/16/15
After 9/16/15
Tabletop Fee
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
$300 - SOLD OUT
$400 - SOLD OUT


2015 Exhibitors:

THANK YOU to the companies that have already reserved exhibit space:

2015 Exhibitors

AI Technology

AVID Associates

CWI Technial Sales

ElectroTech Sales

Finetech, Inc.

Indium Corporation (PREMIER SPONSOR)
Indium Corp - Premier Presentations Sponsor

Kintner Equipment Corporation

MRSI Systems

NTK Technologies, Inc.

Oneida Research Services

Palomar Technologies

Proton Onsite

Quik-Pak, a division of Promex Industries

Teikoku Taping System Inc.

Universal Instruments (PREMIER SPONSOR)
Universal Instruments - Premier Sponsor

Utz Technologies, Inc.

Zestron USA


Speaker Dates/Information:

  • Abstract Deadlin Extended To: July 10, 2015
  • Speaker Email Notification: July 15, 2015
  • Early Registration Deadline: August 21, 2015
  • Speaker 2-3 sentence biography due not later than: September 15, 2015
  • Powerpoint/Presentation file for DOWNLOAD due not later than: September 24, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Registration Information: (Early Registration Deadline: September 16, 2015)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 9/16/15
Advance/Onsite Fee
After 9/16/15
IMAPS Member
Session Chair
Chapter Officer
Tabletop Exhibit
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 1 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)



  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic