Advanced Technology Workshop and Tabletop Exhibition on
Advances in Semiconductor Packaging

SUNY Polytechnic Institute
Marcy, New York - USA
September 22, 2016

General Chair:
Voya Markovich, Consultant

The world of semiconductor packaging is becoming increasingly diverse and more complex. Mobile devices and wearables are the near-term visible part of the IoT with wireless networking, servers, switches and networks the invisible backbone. This ATW will bring together experts from around the world to discuss challenges in assembly processes, materials, reliability and packaging technologies, and the technology advances and material developments that are being made to overcome them.

Thank you to our Premier Sponsors:
Premier Sponsor: SMART Microsystems

Premier Sponsor: Indium Corporation



7:00am-6:00pm Registration Open


EXHIBITS OPEN (when not in session)
Meet with these great sponsors and exhibitors!

Indium Corporation

Oneida Research Services
AI Technology
Finetech, Inc.
Quik-Pak, a division of Promex Industries
Panasonic Corporation
Quanterion Solutions Incorporated
Neutronix Quintel

7:30am-8:00am Coffee

8:00am-8:15am Welcome (IMAPS) and Overview (SUNY Poly)
Voya Markovich, General Chair & SUNY Poly Staff


Session Chair: Derrick Herron, Indium Corporation

8:15am-8:45am Analytical and Experimental Thermal Measurements of 3D ICs
Leila Choobineh, SUNY Polytechnic Institute (Ankur Jain, Jared Jones)
8:45am-9:15am Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors
Dave Saums, DS&A LLC (Tim Jensen, Indium Corporation)
9:15am-9:45am Inside the Black Box - Assembly Reflow as the Unseen Threat to Electronic Package Reliability
Kevin Knadle, i3 Electronics


Coffee Break in the Exhibit Area


AIM Photonics and the Future - Si Photonics and Packaging

Dr. Douglas Coolbaugh is the COO of AIM photonics and has 36 years in the electronics business in packaging and assembly development, RF semiconductors and passive elements, and logic development. In 2010, he retired from IBM Corporation after 30 years in the business. Doug started developing Si Photonics in 2011 with his partner Mike Watts from MIT at SUNY Polytechnic. In addition, his team has developed a fully functional 3D process to augment their Si Photonics offering. Doug presently leads the manufacturing centers of excellence for AIM photonics.

SESSION 1 Continued

Session Chair: Derrick Herron, Indium Corporation

11:00am-11:30am Microstructure Modeling and Reliability Analysis of TLPS Joining Technology for High Power Electronics
Ali Moeini, Center for Advanced Life Cycle Engineering (CALCE), University of Maryland (H. Greve, F.P. McCluskey)

11:30am-12:30pm Lunch in the Exhibit Area

12:30pm-1:15pm Tour of SUNY Polytechnic Institute QUAD-C
(Computer Chip Commercialization Center)
In support of the leadership and vision of the Governor of NY, and in partnership with the SUNY College of Nanoscale Science & Engineering (CNSE), the $125 million Computer Chip Commercialization Center (Quad-C) at SUNYIT opened in 2014. The 253,000 sq. ft. Quad-C facility, which will include 56,000 sq. ft. of Class 100 and Class 1000 capable cleanroom space, hosts phase one public-private partnerships as part of the Governor's $1.5 billion Nano Utica initiative, highlighted by a consortium spearheaded by CNSE and SUNYIT that includes leading technology companies such as Advanced Nanotechnology Solutions Incorporated (ANS), SEMATECH, Atotech and CNSE partners, including IBM, Lam Research and Tokyo Electron.


Advancing PCB Signal Integrity Capabilities with New Materials, New Processes and New Structures

James W. Fuller, Jr. is currently Vice President of Engineering and Technology Development for Sanmina’s PCB Division, responsible for product introduction, process implementation and manufacturing optimization. He previously worked for Endicott Interconnect where he held the positions of Vice President of Manufacturing Programs Management, Vice President and General Manager of Fabrication, Vice President of Engineering & Technology, and Vice President of Business Development and Marketing. Prior to his positions with EI, he was Senior Engineering Manager for IBM, with Manufacturing Engineering responsibility for all products manufactured in Endicott. Jim holds or co-holds 16 US patents, and has published several papers. Jim graduated from Lehigh University with a Bachelor of Science in Chemical Engineering.


Session Chair: Leila Choobineh, SUNY Polytechnic Institute

2:15pm-2:45pm Challenges for Next Generation Packaging
James Welsh, Atotech (Cassandra Melvin)
2:45pm-3:15pm Advanced Die Attach Materials for High Power Applications
Ken Araujo, NAMICS Technologies, Inc.
3:15pm-3:45pm Glass Substrates for Electronics Applications
Scott Pollard, Corning, Inc. (Sean Garner, Aric Shorey)


Coffee Break in the Exhibit Area

4:30pm-5:00pm Liquid Crystal Polymer Dielectric Material for High-Frequency and Medical Applications
Mark Schadt, i3 Electronics
5:00pm-5:30pm Mass Spectrometer Mobile Devices through Ceramic Additive Manufacturing (AM)
Patrick A Roman, Florida International University (Xudong "Donny" Chen, W. Kinzy Jones, Ali Karbasi, C. Mike Newton, Shekhar Bhansali)
5:30pm-6:00pm Meeting Solder Paste Printing Challenges for SiP in "Smart" IoT Devices
Maria Durham, Indium Corporation (SzePei Lim)
6:00pm-6:30pm Investigation of Acceptable Modulus of Elasticity for a Low Stress Die Attach Adhesive
Alvin Denoyo, ON Semiconductors (Tonton Pinili)

6:30pm Closing Remarks



Thank you to our Premier Sponsors:
Premier Sponsor: SMART Microsystems

Premier Sponsor: Indium Corporation


Speaker Dates/Information:

  • Abstract Deadline Extended To: July 1, 2016
  • Speaker Email Notification: July 15, 2016
  • Early Registration Deadline: August 31, 2016
  • Speaker 2-3 sentence biography due not later than: September 15, 2016
  • Powerpoint/Presentation file for DOWNLOAD due not later than: September 22, 2016
  • Powerpoint/Presentation file used during session:
    • Speaker's responsibility to bring to session on USB
    • Recommended to have back-up on personal laptop/usb/cloud or email to prior to event
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Presentation Time: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: August 31, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 8/31/16
Advance/Onsite Fee
After 8/31/16
IMAPS Member
Session Chair
Chapter Officer
Tabletop Exhibit
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 1 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic