Monday, April 9th

Registration: 5:00 pm - 7:00 pm

Opening Reception: 6:00 pm - 7:00 pm

Tuesday, April 10th

Registration: 7:00 am - 8:00 pm

Continental Breakfast: 7:00 - 8:00 am

Session 1: Sensor Materials and Packaging
8:00 am - Noon
Session Chair: Gary Johnson, Wabash Technologies

Low Cost Packaging of Pressure Sensors for TPMS
Robert Hunter, Gary Casey, Calin Miclaus, Omar Abed, Vincentiu Grosu, Dan Rodriguez, Avag Avagyan, Kavlico

Small Leadless Packages for Sensors in Automotive Applications
Martin Holzmann, Christoph Gahn, Michael Knauß, Lutz Rauscher, Christian Solf, Robert Bosch GmbH

Miniaturization of Automotive Electronics via Wafer-Level Chip-Size Packaging
Yehudit Dagan, Jeff Demmin, Tessera Israel, Ltd.

Plate Level Packaging / Calibration Alternative for Silicon Based for Automotive MAP Sensor
Eddie R. Borzabadi, Steven P. Long, Delphi

Break: 10:00 am - 10:30 am

Development of an Aluminum Wirebondable Lead and Cadmium Free Thick Film Gold Conductor for Extreme Applications
David J. Malanga, Samson Shahbazi, Meg Tredinnick, Heraeus Inc. - TFD
 
A Load Cell Utilizing Novel Cermet Construction for Automotive Applications
Terry R. Bloom, CTS Automotive Products

Material Selection and Application for Contacting Based Encoders Submerged in Automatic Transmission Fluid
Richard Cooper, Tom Martin, Wabash Technologies

Lunch Speaker: 1:00 pm - 2:00 pm
Title: Trends in Automotive Technology: Combined Active & Passive Safety (CAPS)
Speaker: Mr. Rob Lyons, Robert Bosch LLC

Mr. Rob Lyons, Manager, is responsible for CAPS - Combined Active & Passive Safety in North America. In this role, he is responsible for advanced safety functions that are enabled through the integration of systems such as Electronic Stability Control (ESC), airbag crash and rollover sensing, driver assistance functions and telematics.

Session 2: LTCC Substrates and Packaging
2:15 pm - 5:30 pm
Session Chairs: M. Ray Fairchild, Delphi Electronics and Safety; Matthew Walsh, Delphi

LTCC Design Techniques for Microwave Integrated Circuits in Radar Sensor Applications
Timothy P. Mobley, Glenn Oliver, DuPont Electronic Technologies

20 to 90GHz Broadband Characterization of LTCC Materials for Transceiver Modules and Integrated Antennas
Matthew R. Walsh, David W. Zimmerman, Michael E. Miller, Deepukumar M. Nair, Bruce W. Butler, Charles I. Delheimer, Ben E. Haffke, Delphi

Packaging of Radar Sensors for Comfort and Safety Applications - Requirements and Challenges
Dieter Hoetzer, Juergen Hildebandt, Bernhard Lucas, Robert Bosch Corporation

Break: 3:45 pm - 4:00 pm

High Value Passive Component Integration and Mixed Material Systems for Multi Chip Module Design
Eric E. Hoppenjans, William J. Chappell, Purdue University

The Challenge of High Reliability Resistors for LTCC Circuits
Christina Modes, Quentin Reynolds, Michael Neidert, Frank Herbert, W.C. Heraeus GmbH

State-of-the-Art Test Procedures for Hybrid and LTCC Multilayers
Stefan Flick, W.C. Heraeus GmbH

Welcome Reception: 5:30 pm - 6:00 pm

Dinner Speaker: 7:00 pm - 8:00 pm
Title: Emerging Trends in Automotive Electronics
Speaker: Dr. Robert W. Schumacher, Delphi Electronics & Safety

Dr. Robert W. Schumacher is the general director, Advanced Product & Business Development for Delphi Electronics & Safety and has been in this position since September 2005.  He is a member of the division’s Executive Committee, and reports to Jeff Owens, president of Delphi Electronics & Safety.

Dr. Schumacher has more than 30 years experience in product development and business management in automotive and aerospace electronics at Delphi Corporation and the former Hughes Aircraft Company.  Most recently he was the Business Line Executive for the Delphi Integrated Media Systems (IMS) business.

Dr. Schumacher earned a Bachelor of Science degree in 1973, a Master of Science degree in 1974, and a Ph.D. in 1979, all in Physics, from UCLA. From 1977 to 1982 at UCLA, he developed the Dodecapole-Surmac plasma confinement facility at UCLA, which was sponsored by a research contract from the U.S. Department of Energy.

Dr. Schumacher holds 13 patents and has more than 40 publications in the areas of plasma science and automotive technology.

Wednesday, April 11th

Registration: 7:30 am - 5:15 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 3: Power Substrates and Packaging
8:30 am - Noon
Session Chair: Lizhi Zhu, Ballard Power Systems (now Siemens VDO)

FreedomCAR Plan, Requirements, and Technology Needs
Laura D. Marlino, Oak Ridge National Laboratory

Direct-Bond Copper Substrates with Zr Doped Alumina Ceramics for Use in Automotive Power Modules
Alexander Roth, Juergen Schulz-Harder, Electrovac Curamik

A New Alumina Multi-Layer Substrate for Power Control Unit
Masamitsu Onitani, Kyocera Corporation

Break: 10:00 am - 10:30 am

The Use of Thick Film Ceramic Hybrid Circuits in Automotive Power Modules
Ken Henderson, C-MAC Microtechnology

Die Casting of Microelectronic Packaging Components from Low-Cost Aluminum Metal Matrix Composites
Stephen P. Midson, David M. Schuster, Michael D. Skibo, The Midson Group, Inc.

Engineered Metal Matrix Composites and Fabrication Methods for Automotive Applications
Birol Sonuparlak, Mike St. Lawrence, Cliff Roseen, Murali Sethumadhavan, Rogers Corporation

Lunch Speaker: 1:00 pm - 1:45 pm
Title: Robustness Validation - Why Are We Here and What Do We Get Out of It?
Speaker: Mr. Roger Rickey, R. E. Rickey and Associates

Roger E. Rickey is President of R.E. Rickey & Associates, Inc. and has over 30 years experience in the automotive and electronics industries, including 4 years experience as Plant Manager, Chrysler Huntsville Electronics Division, a leading electronics manufacturer. He is currently an international Management Consultant and has several Fortune 500 clients, including major automotive OEMs.

Mr. Rickey began his career in engineering with Ford Motor Co., was Chief Engineer and Director of Engineering with United Technologies Automotive Products Division. He holds degrees from Eastern Michigan University and Southern Illinois University, and served as an Officer with the U.S. Army in Vietnam. He holds two Bronze Star Medals and an Army Commendation Medal.

Session 4: Interconnects and Materials
2:00 pm - 5:15 pm
Session Chair: Michael McKeown, Orthodyne Electronics

PowerRibbon™ Bonding - An Alternative Interconnect Process for Present & Future Automotive Electronics Applications
Michael McKeown, Siegbert Haumann, Christoph Luechinger, Orthodyne Electronics

Evaluation of Wire Bond Systems for Manufacturability
Lichun Leigh Chen, B. Njoes, P. F. Lynch, J. G. Kaiser, Technical Materials, Inc.; M. McKeown, Orthodyne Electronics; R. Wenkitaswmy, Farmingdale State University

Interconnect Solutions for High Performance Automotive Applications
Roger E. Weiss, Joel Urban, Paricon Technologies Corp.

Break: 3:30 pm - 3:45 pm

The Role of Natural Graphite in the Thermal Management of Automotive Packaging
Julian Norley, Andy Reynolds, Matt Getz, GrafTech International Ltd.

Electrically and Thermally Conductive Adhesives for Automotive Electronics
Gunther Dreezen, Michel Ruyters, Geert Luyckx, Scott Harry, Emerson & Cuming

Proper Application of Silicone Conformal Coatings will Eliminate Premature Device Failures in Harsh Automotive Environments
Jason D. Clark, Dow Corning Corporation

Registration: 7:15 am - 11:00 am

Continental Breakfast: 7:15 am - 8:15 am

Session 5: Packaging and Assembly
8:15 am - 11:00 am
Session Chair: Bill Hopfe, Visteon

Effects of Thermal Aging on the Reliability of Lead Free Solder Joints
Jeffrey C. Suhling, Hongtao Ma, Yifei Zhang, Pradeep Lall, Michael J. Bozack, Auburn University

Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints Under Severe Service Environments
Andre Lee, K. N. Subramanian, Michigan State University

Statistical Models for Area-Array Component Selection, Component Obsolescence, and Design Trade-Offs
Pradeep Lall, Ganesh Hariharan, Jeff Suhling, Mark Strickland, Jim Blanche, Auburn University

Break: 9:45 am - 10:00 am

The What, When and Why of Laser Reflow
John Vivari, EFD, Inc. Solder Paste Group

The Issues Connecting Pb-Free Solders, Microelectronic Device Moisture/Reflow Sensitivity, Tin Whiskers and False Exemptions
Steven R. Martell, Sonoscan, Inc.

Closing Remarks: 11:00 am

Register On-Line