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2nd Advanced Technology Workshop on
Automotive Microelectronics and Packaging

Doubletree Hotel
Dearborn, Michigan - USA
April 27-28, 2010

All photos courtesy of Heraeus
Program Chair:
Larry Rexing
Heraeus Inc. - Thick Film Division
larry.rexing@heraeus.com
Program Chair:
Adam Schubring
Kyocera America, Inc.
adam.schubring@kyocera.com
Program Chair:
Dave Saums
DS&A LLC
dsaums@dsa-thermal.com

Hotel Cut-off: March 26, 2010
Early Registration Deadline: April 9, 2010



Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.

Tuesday, April 27th

Registration: 7:00 am - 4:45 pm

Continental Breakfast: 7:00 am - 8:00 am

Opening Remarks: 8:00 - 8:15 am
Workshop Chairs

Keynote Presentation: 8:15 am – 9:00 am
Title: Power Electronics Application and Requirements for Hybrid Vehicle Traction Inverter - An Overview

Speaker: Shahram Zarei, Ford Motor Company
Mr. Zarei joined the automotive industry and specifically GM Research Lab in 1985 after graduating with his MSEE from Purdue. He joined Ford Research lab in 1993, and transferred to SMT which is responsible for Ford global hybrid programs in 2004. Since then, my team has been responsible for D&R of E-Drive and Traction Inverter systems for our hybrid programs.

Keynote Presentation: 9:00 am – 9:45 am
Title: Power Electronics within the FreedomCAR Partnership

Speaker: Laura Marlino, Deputy Director,
Power Electronics and Electric Power Systems Research Center, Oak Ridge National Laboratory

Session 1a: Thermal Management
9:45 am - Noon

Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies 
Kevin Bennion, Gilbert Moreno, Jason Lustbader, National Renewable Energy Laboratory   

Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors
Dave Saums, DS&A LLC

Break: 10:45 am - 11:00 am

Micro-Channel Variation within Liquid Cold Plate Design and Impact on Thermal Performance
Matt Reeves, Sy-Jenq Loong, Peter Beucher, Wolverine Tube Inc. 

Thermal Interface Material for Automotive Applications: Basics and Selected Examples
Sanjay Misra, John Timmerman, Bergquist Company  

Lunch: Noon - 1:00 pm

Keynote Presentation: 1:15 pm - 2:00 pm
Title: AlSiC Pin Fin Power Module Coolers and IGBT Baseplates for Hybrid Electric Vehicles (HEV)

Speaker: Bo Sullivan, Senior Account Manager, CPS Technologies

Session 1b: Thermal Management
Session Chair: Kevin Martin, AI Technology
2:00 pm – 4:45 pm

Effect of Compression Behavior of Thermal Interface Materials on Component Operating Temperature
Chris Severance, Parker Chomerics

Development of Double-Side Cooled Power Modules Joined by Low-Temperature Sintering of Nanosilver Paste for Electric Vehicles
Guo-Quan Lu, Xiao Cao, Tao Wang, Zheyuan Tan, Khai Ngo, Susan Luo, Virginia Tech.

Anisotropic Conductive Adhesives (ACA) Technology
William Chappell, Purdue University

Break: 3:30 pm - 3:45 pm

Silver Sintering
Frank Murch, Heraeus Circuit Materials Division

Thermoplastic-Polyimide Bondlines in Harsh Environments...From Particle Accelerators to Automotive Electronics
Jim Fraivillig, Fraivillig Technologies

Wednesday, April 28th

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
Title: Concept to Component Fabrication Challenges with Innovative Materials

Speaker: Professor Pravansu S. Mohanty, University of Michigan

Session 2: Power Substrate Packaging / Packaging Materials
Session Chair: Mark Challingsworth, Heraeus Materials Technology LLC
8:45 am - Noon

High Performance Substrate Technology for Automotive Applications Utilizing DPC and SuperMCPCB Substrates
Charles Lin, Nick Wang, Allen Hsu, Andy Lim, Jerry Tan, Bridge Semiconductor Corporation and Tong Hsing Electronic Industries Ltd.; Heinz Ru, Thompson Jiang, David Liao, Tong Hsing Electronic Industries Ltd.

Evaluation of an Electrically Insulating Glaze on Aluminum for Thermal Substrates in High Power LEDs
Michael Creamer, Mark Challingsworth, Samson Shahbazi, Heraeus Materials Technology LLC

Alumina Multilayer Substrate for Small Module Unit
Kouichi Hirayama, Hiroshi Matsumoto, Adam Schubring, Kyocera Corporation

Break: 10:15 am - 10:30 am

Development of a Fatigue Resistant Lead-Free Alloy For High Reliability Under Hood Applications
Mitch Holtzer, Anna Lifton, Paul Koep, Cookson Electronics Assembly Materials

Lead Free Thick Film Pastes for Fuel Level Sender Application
Bob Hodges, Christina Modes, Stefan Flick, Annette Kipka, W. C. Heraeus GmbH, TFD-TH

LCP Properties Ideal for Miniaturization Trend in Electronic Industry
Edson Ito, Ticona Engineering Polymers

Lunch: Noon - 1:00 pm

Keynote Presentation: 1:15 pm – 2:00 pm
Title: Electronic Packaging Challenges for Safe, Green and Connected Vehicles

Speaker: D.H.R. Sarma, Delphi Electronics and Safety
Dr. D.H. R. Sarma is a Principal Technical Fellow and Engineering Group Manager in Advanced Engineering and Business Development at Delphi Electronics and Safety, Kokomo, Indiana.  Prior to joining Delphi, his work experience included a one and a half-year stint at CTS Microelectronics in West Lafayette, Indiana.  He has over 30 years of experience in electronic materials technologies. He received his B.S. degree from the Indian Institute of Science, Bangalore, India and his M.S. and Ph.D. degree from Purdue University.  Currently, he supervises the development of key technologies for future Delphi product portfolio. 

Keynote Presentation: 2:00 pm – 2:45 pm
Title: Establishing a Microelectronics Packaging Facility in Western Michigan

Speaker: Matt McInnis, Gentex
Matt McInnis began working in the automotive microelectronics industry with Gentex Corporation in 2005, upon graduating from Michigan Technological University with a B.S. in Electrical Engineering. Matt currently works as a Process Engineer in the Microelectronics Assembly Department at Gentex, where his primary focus is on developing and refining the production processes for the assembly of automotive vision systems.

Session 3: Assembly, Material Processing
Session Chair: Mike McKeown, Orthodyne Electronics
2:45 pm - 4:15 pm

Surface Wettability Improvement for High Volume Automotive Manufacturing by Atmospheric Plasma Treatment 
Gene Dunn, Panasonic Factory Solutions of America

Dispensing Solutions for Advanced Automotive Electronics
Dan Ashley, Asymtek

Adapting Press-Fit Connection Technology for Automotive Modular Electronic Units
Joseph J. Lynch, Jeff Parrish, Interplex Industries

Closing Remarks: 4:15 pm

Register On-Line



Speaker Dates/Information:

  • Hotel Cut-off: March 26, 2010
  • Extended Abstract or Presentation Material due: March 19, 2010
  • Early Registration Deadline: April 9, 2010
  • Speaker 2-3 sentence biography due not later than: April 19, 2010
  • Powerpoint/Presentation file for CD-Rom due not later than: April 29, 2010
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations (Hotel Deadline: March 26, 2010)
Reservations must be made directly with the:

Doubletree Hotel Dearborn
5801 Southfield Expressway
Detroit, MI 48228

$128 single/double

Reservations: (313) 336-3340 - reference IMAPS when making reservation

 

 

Corporate Sponsor:

CPS Technologies


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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