IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

3rd Advanced Technology Workshop and Tabletop Exhibition on
Automotive Microelectronics and Packaging

The Dearborn Inn, A Marriott Hotel
20301 Oakwood Boulevard
Dearborn, Michigan 48124 - USA
May 22-24, 2012

All photos courtesy of Heraeus
Program Chair:
Larry Rexing
Heraeus Inc. - Thick Film Division
larry.rexing@heraeus.com
Program Chair:
Adam Schubring
Kyocera America, Inc.
adam.schubring@kyocera.com


Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging.

Tuesday, May 22

Registration: 7:00 am - 6:30 pm

Continental Breakfast: 7:00 am - 8:00 am

Tabletop Exhibits: 10:00 am - 6:30 pm (During Session Breaks)

Welcome and Introduction: 8:00 - 8:30 am
Workshop Chairs

 

Keynote Presentation: 8:30 am – 9:00 am
Transitioning from FreedomCAR to U.S. DRIVE

Speaker: Laura Marlino, Deputy Director | Oak Ridge National Laboratory
Laura Marlino currently holds the position of Director of Vehicle Electrification Partnerships at Oak Ridge National Laboratory. She has been at the laboratory for 20 years working as both a Research Staff Engineer and in Program Management. As part of her current duties she manages the technical aspects of the Power Electronics and Electric Machinery efforts for the Department of Energy’s USDRIVE efforts. Her responsibilities include developing and overseeing projects consistent with DOE’s mission and objectives for hybrid, plug in hybrid and fuel cell vehicle technology development. Ms Marlino received her BS in electronics engineering from the University of New Mexico in Albuquerque, New Mexico and her MSEE from the University of Tennessee in Knoxville, Tennessee. During her engineering career she has been employed with Teledyne Camera Systems in California doing analog video design and Honeywell Aerospace and Marine in New Mexico as both a test and design engineer involved with cockpit displays and processors for military aircraft. She also has worked as a front end IC design engineer with ASIC International in Oak Ridge, Tennessee. For the past ten years she has been heavily involved performing program and project management duties under DOEs Office of Vehicle Technologies Program. She is also a member of the Electrical and Electronics Technical Team within the United States Council for Automotive Research. She currently holds multiple patents and has authored numerous technical publications.


Keynote - Grosu

Keynote Presentation: 9:00 am – 9:30 am
Thermal Challenges and Solutions in GM's Hybrid and Electrical Advanced Propulsion Systems

Speaker: Vicentiu Grosu, Sr. Project Engineer | General Motors
Vicentiu Grosu is a Senior Project Engineer at the Advanced Technology Center of General Motors in Torrance, CA. In 2005, he earned a PhD degree in the Department of Mechanical Engineering from Southern Methodist University, Dallas, TX. After graduation, he worked for 2 years for Schneider Electric as Senior MEMS design engineer developing MEMS devices for automotives and medical applications. For the past 4 years, he had been employed by General Motors and worked on design and analysis of the next generation of power electronics and electrical motors. He participated as a presenter in various conferences and workshops and his work is published in several scientific journals. While working at GM he was involved in 2 patents.

Break in Exhibits Area: 9:30 am – 10:00 am

Session 1: Thermal Reliability
Session Chair: Guangyin Lei, Ford Motor Company
10:00 am - Noon

Power Module Reliability Requirement for Automotive Application
Guangyin Lei, Ford Motor Company

Reliability Concerns - Pitfalls and Issues (and How to Avoid them) 
Tina Barcley, TAS Consulting   

Efficient Cooling of High Density Power Module Solutions for Automotive Applications
Siegbert Haumann, Danfoss Silicon Power GmbH ( Klaus Olesen, Jorgen Holst, Danfoss A/S)

Classifying and Understanding Thermal Interface Materials for Automotive Applications
David Saums, DS&A LLC

Lunch Break, Keynote Presentation & Exhibits: 12:00 pm - 1:15 pm

Keynote - Sharpe

Keynote Presentation:
Counterfeiters' Techniques are Constantly Improving to Avoid Detection - Our National Security and the Well-Being of the US Industrial Base is Dependent on Us to Keep Up With Them

Speaker: Tom Sharpe, Vice President | SMT Corporation
Tom Sharpe is the Vice President of SMT Corporation located in Sandy Hook Connecticut. SMT is an Independent Stocking Distributor of electronic components to the Defense and Aerospace industry and is a recognized leader among Independent Distribution in cutting-edge anti-counterfeit inspection technologies. Tom serves on multiple government & law enforcement anti-counterfeit task force committees as well as the Aerospace Industry Association’s Counterfeit Parts IPT. He is a member of SAE International’s G-19 committee that is currently developing the new Independent Distributor AS6081 certification standard. In addition to being a long-time member of ERAI, Tom has served 2 terms as Vice President of IDEA where he has served continuously on the Board of Directors since the year of its formation in 2003. In November of 2011 Tom provided key testimony before the Senate Armed Services Committee during their formal investigation into the counterfeit threat from China into DoD & the US Industrial supply chains. Tom is active both nationally and internationally on the Electronics Industry speaking tour and has become a leading voice from the Independent sector in the fight against counterfeit components in the electronics industry. Tom’s presentations serve to educate all sectors of the electronics industry about the growing dangers of counterfeits in today’s market, and best practices to detect and mitigate those dangers.

Session 2: Die Attach
Session Chair: Andy Mackie, Indium Corporation
1:15 pm – 5:15 pm

Advances in Pressure-less Sintering for High Temperature Electronic Applications
Paul Gleeson, Henkel Electronics (Jenny England, Richard Kuder, Julissa Eckenrode, Javier Gutierrez)

Thermal Performance and Reliability of Bonded Interfaces
Douglas DeVoto, National Renewable Energy Laboratory (Sreekant Narumanchi, Mark Mihalic)

Lead-free Nanosilver Die-attach Material for Making High-temperature Double-side Cooled Power Modules
G-Q. Lu, Virginia Tech (L. Jiang, D. Berry, H. Zheng, C. Xiao, K. Ngo, Virginia Tech; G. Lei, Ford Motor Company; S. Luo, NBE Technologies)

Break in Exhibits Area: 2:45 pm - 3:15 pm

Advanced Bonding Technology for High Temperature Operational Electrified Vehicles
Sang Won Yoon, Toyota Research Institute of North America

IGBT's from the Top Down; Electrical & Thermal Connectivity from Die Attach to Heat Sink
Mario Scalzo, Indium Corporation

Thermal Cycle Resistant Lead Free Alloys
Derek Daily, Senju Comtek Corp (Satoru Akita, Rafael Padilla, Masato Shimamura, Tokoru Yamaki)

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, SST International (Paul Barnes)

Exhibit Hall Reception: 5:15 pm - 6:30 pm


Wednesday, May 23

Registration: 7:00 am – 5:15 pm

Continental Breakfast: 7:00 am - 8:00 am

Tabletop Exhibits: 10:00 am - 5:15 pm (During Session Breaks)

Session 3: Wirebonding and Interconnects
Session Chair: Mike McKeown, Materion Technical Materials
8:00 am - Noon

Physics of Failure of Ribbon Bonds
Douglas DeVoto, National Renewable Energy Laboratory (Mark Mihalic)

Meeting the Challenges of High Reliability for ICs with Thin Pad Al
Stevan Hunter, ON Semiconductor

How to Double CPK in Wirebonding by Just Doing It Right
Josef Sedlmair, F&K Delvotec Semiconductor

Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications
Lee Levine, Hesse & Knipps (Joe Bubel)

Break in Exhibits Area: 10:00 am - 10:30 am

Leveraging Solderless Press-Fit Interconnects in Automotive Micro Electronic Power Modules and Power Applications to Improve Assembly Efficiency and Design Flexibility
Joseph Lynch, Interplex Engineered Products (Jeff Parrish)

A Very Large Area Wirebonder for Bonding Battery Modules in a Single Pass
Josef Sedlmair, F&K Delvotec Bondtechnik (Farhad Farassat)

Aluminum Inlay Design Requirements for Automotive Electronics Leadframes
Mike McKeown, Materion Technical Materials

Lunch Break, Keynote Presentation & Exhibits: 12:00 pm - 1:15 pm

Keynote Presentation:
Qualification of Semiconductor and Passive Device Packages to Automotive Environments

Speaker: Bob Knoell, Quality Manager - Americas
NXP Semiconductors and AEC Coordinator
BIO TBD. 

Session 4: Ceramic Substrates
Session Chair: Ray Fairchild, Delphi Electronics & Safety
1:15 pm - 5:15 pm

Silicon Nitride Substrates for Power Electronics
Manfred Goetz, Rogers Corporation (Bernd Lehmeier, Nico Kuhn, Andreas Meyer, Curamik Electronics GmbH)

Examination and Comparison of Pb-free Thick Film Products for Automotive Applications
Mark Challingsworth, Heraeus Precious Metals North America Conshohocken, LLC (Christina Modes, Jochen Langer)

High Frequency (77 GHz) MMIC Die Stabilization on Organic Substrates
David Ihms, Delphi Electronics & Safety (David Zimmerman)

Characterization of Fuel Resistant Fluorosilicones
Vincent Malave, NuSil Technology LLC (Michelle Velderrain)

Break in Exhibits Area: 3:15 pm - 3:45 pm

Development of New Adhesion Test Methodology for Harsh Environment Microelectronics Applications
Lyndon Larson, Dow Corning

Silicone Multifunctional Potting & Encapsulation for ICE and Electrified Automotive Electronic Module Applications
E. Stanley Jang, Momentive Performance Materials

Cooling from Down Under - Thermally Conductive Underfill
Larry Wang, LORD Corporation (Paul Hough)


Thursday, May 24

Registration: 7:00 am – 11:00 am

Continental Breakfast: 7:00 am - 8:00 am

Session 5: Packaging and Processing
Session Chair: Guangyin Lei, Ford Motor Company
8:00 am - 10:45 am

Integrated Passive Devices into Silicon for New Automotive Challenges
Guillaume Raimbault, IPDiA (Charlotte Jennequin)

LightForm - Laminated LED Lighting
Tim Brooks, Grote Industries

Plastics for MEMS and Sensors in Automotive
Tamim Peter Sidiki, DSM Engineering Plastics B.V. (Jimmy Kong, Paul Potters, Siang-Hock Quah, Hiromi Iribe, Jason Lee, Greg Costantino)

Break in Foyer: 9:30 am - 9:45 am

Low Pressure Molding
Lawrence Butts, BGM Engineering (Scott Lowes, Lighthouse Molding)

RoHS impact on Advanced Interconnects in Automotive
Tamim P. Sidiki, DSM Engineering Plastics B.V. (Rui Zhang, Marco Moll, Jacques Loosdrecht, Ian White, Greg Costantino)

Closing Remarks: 10:45 am - 11:00 am

 


Registration Information: (Early Registration Deadline: April 27, 2012)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 4/27/12
Advance/Onsite Fee
After 4/27/12
IMAPS Member
$550
$650
Non-Member
$675
$775
Speaker
$400
$500
Chair
$400
$500
Student
$150
$150
Chapter Officer
$400
$500
Tabletop Exhibit (Member)
$675
$750
Tabletop Exhibit (Non-Member)
$775
$850
Premier Sponsorship (Includes Tabletop)
$1200
$1200
Event Sponsorship (Tabletop not included)
$500
$500

Register On-line



Speaker Dates/Information:

  • Abstract Deadline Extended: March 16, 2012
  • Speaker Email Notification: March 30, 2012
  • Extended Abstract or Presentation Material due: April 20, 2012
  • Early Registration Deadline: April 27, 2012
  • Hotel Cut-off: April 27, 2012
  • Speaker 2-3 sentence biography due not later than: May 18, 2012
  • Powerpoint/Presentation file for CD-Rom due not later than: May 23, 2012
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations
Reservations must be made directly with the:

The Dearborn Inn, A Marriott Hotel
20301 Oakwood Boulevard
Dearborn, Michigan 48124 - USA

 

 

 


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>