4th Advanced Technology Workshop and Tabletop Exhibition on
Automotive Microelectronics and Packaging

The Dearborn Inn, A Marriott Hotel
20301 Oakwood Boulevard
Dearborn, Michigan 48124 - USA
June 3-4, 2015

All photos courtesy of Heraeus
General Chair:
Adam Schubring
Kyocera America, Inc.
Technical Chair:
Andy Mackie
Indium Corporation
Technical Chair:
Mike McKeown
Hesse Mechatronics

Tabletop Exhibit Info

Thank you to our Premier Sponsors:

Automotive 2015 Premier Sponsor: Inventec
Automotive 2015 Premier Sponsor: Fastech
Automotive 2015 Premier Sponsor: Dow Corning


And Thanks to our Media Sponsor:
Automotive 2015 Media Sponsor: ChipScale Review

The value and complexity of electronic and sensor content in the transportation market is forecast to rise well above the growth rate of the semiconductor industry, especially in passenger vehicles, for at least the next five years. Microelectronic packaging is, as always, playing a critical role in overall systems functionality, just as the automobile industry strives for devices that are smaller, lower in cost, higher in functionality, and more reliable – especially in harsh environments. Legislation such as RoHS also threatens to place constraints on many materials important to system functionality. Even more critically, as passenger vehicles transition from gasoline to electric power, high power electronics, such as IGBT modules, are emerging as the ultimate engine control module – the primary means of controlling the motive energy itself.

This Advanced Technology Workshop (ATW) is focused on key developments in automotive electronic and sensor packaging. We are looking for presentations on advanced technologies that are pushing the envelope of packaging: especially in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology “gap” in your needs.


Wednesday, June 3

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Tabletop Exhibits: 9:30 am - 6:30 pm (During Session Breaks)

Welcome and Introduction: 8:00 - 8:15 am
Workshop Chairs

Keynote Presentation: 8:15 am - 9:00 am
Advanced Manufacturing in the Age of Open Innovation and Collaboration
Speaker: Jayson D. Pankin, Co-Founder, President and Chief Executive Officer, AutoHarvest Foundation

Abstract: At a time when tomorrow's car depends on increasingly smaller, more powerful and robust microelectronics to be safe, green, connect and autonomous, Open Innovation is an emerging philosophy that does help the engineer deliver on the cutting edge. The new automotive culture is opening up the value chain, increasing dynamic relationships with nontraditional suppliers and increasingly sourcing talent and innovation outside its more porous silos. Innovators are asking: what are the new tools I can use and how can I establish my presence in this bigger and more complex technology ecosystem.

Jayson D. Pankin is a founder, President, and CEO of the nonprofit AutoHarvest Foundation. Jayson and his partner, Dr. David E. Cole created a unique innovation ecosystem led by some of the most highly respected figures in the automotive and manufacturing industries. In 2012, was launched as the world’s only truly neutral and global on-line meeting place for innovators of all types with an interest in advanced manufacturing intellectual property. This system allows users of all types to showcase capabilities, technologies and needs system-wide and then privately connect with fellow inventors and commercializers to explore technology and business development opportunities. Partnered with the United States Patent and Trademark Office and the Departments of Defense and Homeland Security, AutoHarvest democratizes access across the innovation value chain—from grassroots entrepreneurs to corporate titans. From 2003-2010 he led Delphi Automotive’s commercialization activities targeting spin-outs of potentially disruptive technologies into start-up companies. For over thirty years, Jayson has been a venture partner specializing in early stage and turnaround situations. He was named by IAM Magazine for two years running as one of the World’s Leading IP Strategists and was the Small Business Foundation of Michigan’s “Intrapreneur Extraordinaire” for 2008. He is on the International Committee of China’s International Technology Transfer Network. He earned his BBA in Accounting and MBA in International Business at the George Washington University.


Keynote: Bob Knoell

Keynote Presentation: 9:00 am - 9:45 am
Automotive Electronics Council - History and Accomplishments
Speaker: Bob Knoell, NXP Semiconductors and AEC Coordinator

The Automotive Electronics Council was formed in 1994 to foster cooperation between semiconductor device (Tier 2) manufacturers and (Tier 1) users in developing mutually acceptable qualification test requirements. This presentation will go through the history of AEC and how we have migrated from a small user-only group dictating standards to an organization of 56 users, suppliers, support companies and those from other industries. Our current products and future directions will also be discussed.


Break in Exhibits Area: 9:45 am – 10:30 am

Session Chair: Ray Fairchild, Delphi Electronics & Safety
10:30 am - 12:30 pm

AMB Substrates
Masaaki Minami, Kyocera America

BD-HDI: New Substrate technology for integrated Transmission Control Units 
Jürgen Sauerbier, Conti Temic microelectronic GmbH (Wolfgang Gruebl)

Thick Film Solutions to HOT Problems in Electronics
Catherine Munoz, Heraeus Electronics (Ryan Persons)

Doubling LED Headlight Output with Thermal Pyrolytic Graphite Assisted Cooling
Wei Fan, Momentive Performance Materials Inc. (Eelco Galestien, Creighton Tomek, Manjunath S)

Lunch Break & Exhibits: 12:30 pm - 2:00 pm

Session Chair: Adam Schubring, Kyocera America, Inc.
2:00 pm - 5:00 pm

Automotive Grade Silicon Capacitors for 'Under the Hood' Applications
Ajaz Hussain, IPDiA (Michael Heise, Laurent Lengignon)

Thin-film High Voltage Capacitors for Electric Drive Vehicle Inverter Applications
M. Ray Fairchild, Delphi (Ralph Taylor, Carl Berlin)

Break in Exhibits Area: 3:00 pm - 3:30 pm

Enabling PoP Technology for Automotive ADAS Applications
Jaimal Williamson, Texas Instruments

Image Sensor Package
Masaaki Minami, Kyocera America

A New Automotive Packaging Platform Technology
Vanessa Smet, Georgia Institute of Technology 3DPRC (Pulugurtha Markondeya Raj, Venky Sundaram, Klaus Wolter, Rao Tummala)

Exhibit Hall Reception: 5:00 pm - 6:00 pm

Thursday, June 4

Registration: 7:00 am - 5:15 pm

Continental Breakfast: 7:00 am - 8:00 am

Tabletop Exhibits: 9:30 am - 4:00 pm (During Session Breaks)

iNEMI / Delphi Industry Project Presentation: 8:00 am - 8:30 am
iNEMI Project on Automotive Electronic Material Challenges

Anitha Sinkfield, Delphi Electronics and Safety (Mark Schaffer, iNEMI; Anil Kurella, Intel)

Session Chair: Ray Fairchild, Delphi Electronics & Safety
8:30 am - 9:30 am

Breaking Barriers: New Silicone Adhesive Expands Your Design Toolbox
Kate Johnson, Dow Corning Corporation (Cameron Kadlack)

Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages
Ken Araujo, NAMICS Technologies, Inc. (Brian Schmaltz)

Break in Exhibits Area: 9:30 am - 10:15 am

Session Chair: Mike McKeown, Hesse Mechatronics
10:15 am - 2:30 pm

Improved Properties and Reduced Metal Content Conductive Powders for High Temperature Sensor Applications
Richard Stephenson, Silicon Valley Materials Technology Corp (Howard Imhof)

Low Temperature Sintering Silver Paste Using MO Technology
Kevin McLaughlin, NAMICS Technologies, Inc. (Ken Araujo)

Critical Barriers of Copper Bonding Wire
William Crockett, Tanaka Kikinzoku International

Kyocera Pressureless Silver Sinter Technology
Adam Schubring, Kyocera America (Masakazu Fujiwara, Kyocera Chemical)

Advances in Reliable Lead-free Assembly for Automotive Electronics
Eric Bastow, Indium Corporation (Ed Briggs, Andy Mackie, Ning-Cheng Lee)

Lunch Break & Exhibits: 12:45 pm - 2:00 pm

Session Chair: Eric Bastow, Indium Corporation
2:00 pm - 3:30 pm

HTCC Multi-layer Ceramic Packages for Automotive Sensor
Bruce McClung, Kyocera America

Improved QFN Reliability by Flank Tin Plating Process after Singulation
John Ganjei, MACDERMID INC (Dan Hart, Gu Hong)

Microstructural Effects on Constitutive and Fatigue Fracture Behavior of SnAgCu Solders
Jonathon Tucker, Microsoft (D.K. Chan, G. Subbarayan, C.A. Handwerker)

Solder Paste Residue Corrosivity Assessment: Bono Test
Rodrigo Aguilar, Inventec Performance Chemicals (Emmanuel Guene, Anne Marie Laugt, Celine Puechagut)

Closing Remarks: 3:30 pm


Speaker Dates/Information:

  • Abstract Deadline Extended: March 13, 2015
  • Speaker Email Notification: March 20, 2015
  • Early Registration Deadline: May 14, 2015
  • Hotel Cut-off: May 14, 2015
  • Speaker 2-3 sentence biography due not later than: May 22, 2015
  • Powerpoint/Presentation file for CD-Rom due not later than: June 3, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Registration Information: (Early Registration Deadline: May 14, 2015)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 5/14/15
Advance/Onsite Fee
After 5/14/15
IMAPS Member
Chapter Officer
Tabletop Exhibit (Member)
Tabletop Exhibit (Non-Member)
Premier Sponsorship
Includes: 1 Tabletop; 1 booth attendee registration; 1 full registration (meals, exhibit access, and sessions); logo listing on the printed program covers, website, and emails; and 1 flyer distributed to all workshop attendees
Event Sponsorship (Tabletop not included)


Hotel Reservations (Hotel Deadline: May 14, 2015)

Reservations must be made directly with the:

The Dearborn Inn, A Marriott Hotel
20301 Oakwood Boulevard
Dearborn, Michigan 48124 - USA

$159 single/double + tax/fees
(includes complimentary internet in your room)


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic