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Ceramic Technologies for Microwave:
Handsets; Bluetooth; Broadband; LMDS

Adams Mark Hotel
Denver, Colorado
March 26 & 27, 2001

Sponsored by:

International Microelectronics And Packaging Society (IMAPS)
Ceramic Interconnect Initiative (CII)

General Chair:
Samuel Horowitz, DuPont Microcircuit Materials

Technical Chair:
Peter Barnwell, Heraeus Incorporated

Click here to register on-line and $ave $50


Monday, March 26

Continental Breakfast: 7:30 am – 8 am

Opening Remarks: 8 am – 8:30 am

Session I: Bluetooth and Portable Applications
Session Chair:
B. Webber, Lucent Technologies

8:30 am – 10 am

8:30 am – 9 am
Bluetooth Modules using Flip Chip and LTCC

Einar Martensson, Lars-Anders Olofsson, Johnny Widegren, Ericsson Microelectronics

9 am – 9:30 am
Why use Multi-Layer Ceramics for Bluetooth?
Mary Cramer, Lucent Technologies

9:30 am – 10 am
Miniaturization of Bluetooth Transceivers in LTCC
Fred Barlow, Minh Van and Aicha Elshabini, University of Arkansas (HiDEC)

Break: 10 am – 10:30 am

Session II: Bluetooth and Portable Applications
Session Chair: 
Richard Sigliano, Zecal

10:30 am - Noon

10:30 am – 11 am
Transceiver Design Methodologies for Ceramic-based RF Systems
A. Sutono, J. Laskar, Georgia Institute of Technology; R.L. Brown, W.R. Smith, M. Ehlert, K. Green, D. Cao, National Semiconductor Corporation

11 am – 11:30 am
RF Electrical Characteristics for a Pure Copper Metalization System over Low Loss Ceramic Materials
Jeff Kramer, Zecal

11:30 am – Noon
LTCC demonstrates distinct Advantages for High Volume Wireless Markets
Jeanne S. Pavio, Kristen Law, Steve Dai, Motorola Labs.

Lunch: Noon – 1 pm

|Session III: Bluetooth and Portable Applications
Session Chair:
M. Ehlert, National Semiconductor Corporation

1 pm – 2:30 pm

1 pm – 1:30 pm
Multilayer Integrated Passive Component Structures using Ultra-Low Fire Dielectric Ceramics
Mathew J. Creedon, Jullie B. Burton, Brian C. Foster, Ferro Electronic Materials; Thomas P. Smyth, Michelle K. Nelson, Mike Newton, Harris Corporation

1:30 pm – 2 pm
Development of a Side Interconnect for Low Temperature Co-Fired Multilayer Ceramic Integrated Circuits
Tom Wetteroth, Chia-Yu Fu, Motorola

2 pm – 2:30 pm
LTCC Systems for Low GHz Frequencies - the Critical Properties
Peter Barnwell, Weiming Zhang, Tom Hochheimer, Heraeus CMD

Break: 2:30 pm – 3 pm

Session IV: Design

Session Chair:
John Gipprich, Northrup Grumman
3 pm – 5 pm

3 pm – 3:30 pm
EM Modeling of Interconnects for a mmW Transmitter Multilayer Ceramic Substrate
Daniel Stevens, Northrup Grumman

3:30 pm – 4 pm
Modeling LTCC Structures using Field-Solvers
Daniel Swanson, Bartley RF Systems

4 pm – 4:30 pm
Advanced Design Methodologies for LTCC RF Modules
Ke-Li Wu, Rui Zhang, The Chinese University of Hong Kong; Michael Ehlert, Bob Miller, National Semiconductor Corporation

4:30 pm – 5 pm
A Synergistic RF Design Tools Process Applied to LTCC 3D Passive RF Circuits
Cindy Robinson, National Semiconductor; John Cofield, Mentor Graphics

Concluding Remarks: 5 pm – 5:30 pm

Reception: 6 pm – 6:30 pm

Dinner: 6:30 pm – 7:30 pm


Tuesday, March 27

Continental Breakfast: 8 am – 8:30 am  

Session V: Test and Measurement
Session Chair:
P. Barnwell, Heraeus

8:30 am – 10:30 am

8:30 am – 9 am
Test Methods for Materials Characterization to 77 GHz
Dan Amey, Rhonda Franklin Drayton, Michael Janezic, DuPont Microcircuit Materials, University of Minnesota, NIST

9 am – 9:30 am
Test Techniques for Microwave Ceramics and Microstrip Lines
Peter Barnwell, Heraeus CMD; Charles Free, Middlesex University

9:30 am – 10 am
Dielectric Properties of Materials for Packaging form 1 to 60 GHz
Pavel Kabos, et al, NIST

10 am – 10:30 am
Characterization of LTCC Material Systems at Microwave Frequencies
Liang Chai, Aziz Shaikh, and Vern Stygar, Ferro Electronic Materials
Richard Guyer and Mike Janezic, NIST

Break: 10:30 am – 11 am


Session VI: Power
Session Chair:
S. Trulli, Astex
11 am - Noon

11 am – 11:30 am
Active Thermal Management in LTCC
W. Kinzy Jones, Peng Wang, Yanquin Liu, Florida International University

11:30 am – Noon
Low Cost Housing for High Power MM Wave Radios
Stuart Weinshanker, Polese Company; Steve Cerenzio, Triton Network Systems

Lunch: 12:30 – 1:30 pm

Session VII: Broadband Applications

Session Chair:
P. Collander, Nokia

1:30 pm – 3:30 pm

1:30 pm – 2 pm
Design, Modeling, Materials and Manufacturing of Ceramic Packages for High Frequency Applications
Arne Knudsen, Paul Garland, Mark Patterson, Jerry Aguirre, Ben Velsher, Kyocera Americas

2 pm – 2:30 pm
Electrical Properties of Low Loss Green TapeTM at 77+ GHz
Dan Amey, Sam Horowitz, Tim Mobley, DuPont Microcircuit Materials; Mike Ehlert, National Semiconductor; Dietmar Kother, IMST

2:30 pm – 3 pm
Broadband Interconnection using Dupont 943 Low Loss LTCC
Keith Guinn, Kavita Goverdhanam, Youngmin Lee, Andrew Becker, Alan Lyons, Bell Labs - Lucent Technologies

3 pm  - 3:30 pm
Low Loss Interconnect Structure between a Package and a Board
M. Shiobara, Y. Tsukiyama, Sumitomo Metal Industries

Concluding Remarks: 3:30 pm – 4 pm 

Click here to register on-line and $ave $50


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Phone: 202-548-4001

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