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IMAPS
- Advanced
Technology Workshop on
Ceramic
Applications for
Microwave
and Photonic Packaging
The
Westin Providence
Providence, Rhode Island
May 2-3, 2002
General
Chair:
Dr. Peter Barnwell
Heraeus Incorporated
Salisbury, UK
P: 610-825-6050; F: 610-825-7061
E-mail: pbarnwell@4cmd.com
Technical
Chair:
Dr. Samuel J. Horowitz
DuPont Microcircuit Materials
RTP, NC 27709
P: 919-248-5752; F: 919-248-5717
E-mail: samuel.j.horowitz@usa.dupont.com
Co-sponsored
by:
International Microelectronics
And Packaging Society (IMAPS)
Ceramic
Interconnect Initiative (CII)
Register On-line
and $ave $50
Exhibit
Information/Reservations
View
List of Exhibiting Companies
View
Online Floorplan
Get
your FREE Exhibits Pass (PDF)
Wednesday,
May 1
Registration:
4:30 pm – 7 pm
Opening Reception: 6:30 pm – 7:30 pm
Thursday, May 2
Registration:
7 am – 5:30 pm
Continental Breakfast: 7:30 am – 8 am
Opening
Remarks: 8 am – 8:30 am
Peter Barnwell & Samuel J. Horowitz
Keynote
Speaker:
David L. Wilcox, Sr., Manny Oliver, Motorola, Inc.
8:30
am – 9 am
Title: LTCC, an Interconnect Technology Morphing into a
Strategic Microsystem Integration Technology
Session
1: Design
9 am – 10:30 am
Session Chair: John Gipprich, Northrup Grumman
Sharing
Experiences on Reducing Gaps between Simulation and Measurement
in a Design Process
Ali Nadir Arslan, Ilkka Kelander, Ville Hurskainen, Olli
Salmela, Nokia Research Center
Design
of LTCC Devices for RF Circuit Applications
J. H. Jean, W. T. Lo, Advanced Ceramic X (ACX) Corp.
The
Harmonic-suppressed Filter Fabricated by Low Temperature
Co-fired Ceramic Technology
Wen-Hsi Lee, C.W. Tang, C.T. Tseng, F.T. Shiao, C.H. Lin,
Phycomp Taiwan Ltd.
Break
in the Exhibit Hall: 10:30 am – 11 am
Session 2: Power and Thermal Management
11 am – 12:30 pm
Session Chair: Susan Trulli, Astex, Inc.
New
Thick Film System on AlN Substrates
Yueli Wang, A. F. Carroll, J.D. Smith, Y. Cho, R.J. Bacher,
D.K. Anderson, J.C. Crumpton, C.R.S. Needes, DuPont iTechnologies
Thin
Film Processing of Aluminum Nitride for Microwave Power
Applications
Theodore Datri, Steve Evangelista, John Roman, Film Microelectronics
Inc.
High
Density Thermal Vias in Low Temperature Cofire Ceramic (LTCC)
W. Kinzy Jones, Marc Zampino, Ravindra Kandukuri, Yanquin
Liu, Florida International University
Lunch:
12:30pm – 1:30pm
Session 3: RF & Wireless
1:30 pm – 3:30 pm
Session Chair: John Roman, Film Microelectronics
Inc.
LTCC
Based Front-End Receiver for U-NII Band Applications
Fred D. Barlow, Minh Van, Aicha Elshabini, University of
Arkansas
Optimized
LTCC Multi-Layer Stack-ups for RF and Microwave Modules
J.P. Lemonnier, O. Friquet, N. Gosselin, Thales Microsonics
LTCC
Based 2.4 GHz Power Amplifiers for Class 1 Bluetooth Applications
Fred D. Barlow, Istak Ahmmed, Aicha Elshabini, University
of Arkansas
Assessment
of Integrated Filters for Millimeter Waves
Olli Koistinen, Petri Nyberg, Kari Koivunen, Nokia Corporation
Break
in the Exhibit Hall: 3:30 pm – 4 pm
Session 4: Broadband & Photonics
4 pm – 5:30 pm
Session Chair: Alan Lyons, Lucent Bell Laboratories
RF
and Optical Circuits with Thick Film Technology offer Improved
Performance
Clark M. Steddom, Juan L. Sepulveda, Circuits Processing
Technology
Design
and Characterization of Broadband Transmission Lines on
Low Loss LTCC
S. Shih, A. Becker, Y. Lee, A. M. Lyons, Lucent Bell Laboratories
Embedded
Capacitors for LTCC Applications above 20 GHz
Jens Mueller, Daniel Josip, Micro Systems Engineering GmbH;
Thomas Mller, EADS Deutschland GmbH
Reception
in the Exhibit Hall: 5:30pm – 7:30pm
Friday, May 3
Registration:
7 am – 4:30 pm
Continental Breakfast: 7:30am – 8am
Session 5: LTCC
8 am – 10 am
Session Chair: Mike Ehlert, National Semiconductor
Advantages
of Photo Imageable LTCC for Fabricating Ceramic Packages
Barry E. Taylor, Larry Bidwell, Angela Lawrence, Tim Mobley,
Dan Amey, DuPont iTechnologies
Microwave
Properties of Low-Temperature Co-fired Ceramic (LTCC) Systems
Richard Geyer, NIST; Liang Chai, Aziz Shaikh, Vern Stygar,
Ferro
Designing
with HeraLockTM 2000 Self-constrained
LTCC Tape
Edmar Amaya, Peter Barnwell, Brent Smith, Frans Lautzenhiser,
Heraeus CMD
Low
Loss High Definition Conductor Line in LTCC
Laurent Boyer, J.P. Bertinet, J.P. Cazenave, H. Martino,
S. Denis, Thales Microelectronics S. A.
Break
in the Exhibit Hall: 10 am – 10:30 am
Session 6: Materials
10:30 am – Noon
Session Chair: Paul Collander, Nokia
Design
and Characterization of Microwave LTCC modified by High
Permittivity Glasses
Markus Eberstein, W. Schiller, Federal Institute for Materials
Research and Testing; K.-H. Dre, H. Thust, Technical University
of Ilmen
Modeling
of Anisotropic Shrinkage During Sintering of Low Temperature
Cofired Ceramic Tapes
John E. Blendell, Mark R. Locatelli, Jay S. Wallace, Bernard
J. Hockey, National Institute of Standards and Technology
Materials
and Process Concepts for Integrated Passive Components
Michael T. Lanagan, Dean Anderson, Amanda Baker, Tom Shrout,
Clive Randall, The Pennsylvania State University
Lunch:
Noon – 1 pm
Session
7: Test and Measurement Part I
1 pm – 2:30 pm
Session Chair: Mike Janezic, NIST
The
Design and Application of Finite Ground Coplanar Waveguide
(CPW) Resonators for Materials Characterization up to 50
GHz
Rhonda Franklin Drayton, Can Akgun, University of Minnesota;
Daniel Amey, Timothy Mobley, DuPont Microcircuit Materials
High
Frequency Materials Characterization using Split-Cylinder
and Split- Post Measurement Techniques
Timothy P. Mobley, Daniel I. Amey, DuPont Microcircuit Materials;
Michael D. Janezic, James Baker-Jarvis, National Institute
of Standards and Technology
Dielectric
Measurement Techniques and their Implications for the Microwave
Circuit Designer
Charles E. Free, Middlesex University; Zhengrong Tian, Peter
Barnwell, Heraeus CMD
Break
in the Exhibit Hall: 2:30 pm – 3 pm
Session
8: Test and Measurement Part II
3 pm – 4 pm
Session Chair: Mike Janezic, NIST
Nondestructive
Permittivity Measurements of Low-Loss Substrates
Jerzy Krupka, Instytut Mikroelektroniki i Optoelektroniki
Politechniki Warszawskiej; Michael Janezic,
Microstrip
Losses at Millimeter Wave Frequencies
Liang Chai, Aziz Shaikh, Vern Stygar, Ferro Electronic Materials;
Richard Geyer, NIST
Concluding
Remarks: 4 pm – 4:30 pm
Peter Barnwell & Samuel J. Horowitz
Register
On-line and $ave $50
Exhibit
Information/Reservations
View
List of Exhibiting Companies
View
Online Floorplan
Get
your FREE Exhibits Pass (PDF)
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