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Ceramic Interconnect Technology:
The Next Generation
& Tabletop Exhibition


April 7-9, 2003

The Westin Tabor Center Hotel
1672 Lawrence Street
Denver, CO 80202
Phone: 303-572-9100
Fax: 303-572-7288
http://www.starwood.com/westin/index.html 

Sponsored by:
IMAPS –International Microelectronics And Packaging Society
&
Ceramic Interconnect Initiative

Endorsed by:
The American Ceramics Society (ACerS)


General Chair:

Dr. Samuel J. Horowitz
DuPont Electronic & Communications Technology
samuel.j.horowitz@usa.dupont.com
 
Technical Program Chairs:

Mike Ehlert
National Semiconductor
michael.ehlert@nsc.com
 



Dr. Duane Dimos
Sandia National Laboratory
dbdimos@sandia.gov
 


View Program By Day: Monday (Day 1) | Tuesday (Day 2) | Wednesday (Day 3)
View Program By Session: Keynotes | TA1 | TA2 | TP1 | TP2 | TP3 | TP4 | WA1 | WA2 | WA3 | WA4 | WP1 | WP2 | WP3
Download a PDF of Program

Monday, April 7

Registration: 5 pm – 7:30 pm 

Opening Reception: 6:30 pm – 7:30 pm


Tuesday, April 8

Registration: 6:45 am – 7:30 pm

Continental Breakfast: 7 am – 8 am

Exhibit Hours: 10 am – 7:30 pm

Opening Remarks: 8:15 am – 8:30 am
Dr. Samuel Horowitz, Mike Ehlert & Dr. Duane Dimos

Keynote Presentations
8:30 am - 10am

Title: Innovative Applications with LTCC for Automotive ECUs
Speaker:
Walter Rothlinghofer & Ulrich Goebel, Robert Bosch GMBH

Title: Embedded Components and Functions in LTCC - Review and Prospect
Speaker:
Heiko Thust, Torsten Thelemann, Waleed Ehrhardt, Karl-Heinz Dre, Technical University of Ilmenau; Jens Mller, MSE GmbH Berg

Break: 10 am – 10:30 am

TA1: Portable Wireless and Bluetooth Applications
Chair: Fred Barlow, University of Arkansas
10:30 am – 12:30 pm

Dual Mode Switch Duplexer Modules Packaged in LTCC with 3D FEM
Tosho Nishikawa, Toyo Corporation; Harufumi Mandai, Murata Mfg.Co., Ltd.

Development of High-Frequency Products for Manufacturing Using a System-in-Package Approach
Andrew Cervin-Lawry, Paul Woo, Sukhi Binapal, Lisa Woodward, Tom Bernacki, Atin Patel, Kamal Ali, Cristian Miortescu, Gennum Corporation

Design Considerations for Hybrid LTCC-RF-Filters
Jens Mueller, Micro Systems Engineering GmbH & Co.

LTCC Based Slow Wave Filters for Wireless and Handheld Products
Fred D. Barlow, F. Magableh, A. Elshabini, University of Arkansas

TA2: Assembly
Chair: Paul Collander, Nokia Networks
10:30 am – 12:30 pm

Interconnection Reliability Studies of Some Ceramic Components and the Introduction of the Results into MTBF Calculations
Olli Salmela, Klas Andersson, Jussi Srkk, Markku Tammenmaa, Nokia Networks

Thermomechanical Responses and Reliability of LTCC Solder Attachments for Wireless Applications
Chia-Yu Fu, Peter Vo, Motorola Labs.

Side-Fill Underfill for RF SAW Packaging
Michael Chang, Brian Lu, Ken Wu, Tong Hsing Electronic Industries, Ltd.

Overmolded LTCC RF Modules
Jicheng "Jeff" Yang, Robert Darveaux, Adrian Federigan, Tony Arellano, Amkor Technology

Lunch: 12:30 pm – 1:30 pm

TP1: Fiber Optic Applications
Chair: Alan Lyons, Lucent Corporation
1:30 pm – 3:30 pm

Ultra Wide Frequency Band Ceramic Package and Assembly Technology
Yoshio Tsukiyama, Masato Shiobara, Masaya Hashimoto, Sumitomo Metal Industries Ltd.

Broadband Electrical Design and Modeling of Packages Integrated in LTCC-Substrates
Martin Nisznansky, Ch. Ziegler, L.-P. Schmidt, R. Hocke, O. Wohlgemuth, University of Erlangen

Telecom MEMS Packaging in Ceramics
David A. Ramsey, Nagesh R. Basavanhally, Yee L. Low, Lucent Technologies / Bell Laboratories

TP2: Automotive Applications
Chairs: D. H. R. Sarma & Carl Berlin, Delphi-Delco Electronics Systems
1:30 pm – 3:30 pm

Screen Printed Feature Size Capabilities
Daniel C. Hughes, Steve E. Ernster, Hybrid Screen Technologies, Inc.

A High Density Flip-Chip Interconnect Technology on Multilayer Ceramic Substrates for Automotive Controller Applications
Carl Berlin, D.H.R. Sarma, Wayne A. Sozansky, Delphi-Delco Electonics Systems

New Advancements in High Power Substrates for Automotive Applications
Keith Easler, Kyocera America Inc.

Break: 3 pm – 3:30 pm

TP3: Broadband & Base Station Applications
Chairs: Jens Mueller, Micro Systems Engineering GmbH & Co.; George Passiopoulos, Nokia
3:30 pm – 5:30 pm

Packaging and Interconnect for RF and Microwave
Paul Collander, George Passiopoulos, Nokia Networks

Integrated Multilayer Modules using Multi-Mix and Green Tape™ LTCC Materials
James Logothetis, Merrimac Industries, Inc.; Daniel I. Amey, Timothy P. Mobley, DuPont Microcircuit Materials

LTCC Technology for High Performance Low Power Base Station Applications
George Passiopoulos, Le Quang Dung, Kevin Lamacraft, Nokia Networks

Ceramic Triple-Mode Delay Filter for Cellular Base Station Applications
William Wilber, Weili Wang, William Engst, Ricardo Espina, Radio Frequency Systems

TP4: Test and Measurement
Chair: Mike Janezic, NIST
3:30 pm - 5:30 pm

The Measurement and Practical Significance of Complex Permittivity at mm-wave Frequencies
Charles E. Free, University of Surrey

Broadband Permittivity and Loss Tangent Measurements using a Split-Cylinder Resonator
Michael Janezic, Christopher Holloway, Dylan Williams, NIST

Four-Port On-Wafer Measurement of Coupled Transmission Lines on LTCC
Ch. Ziegler, M. Nisznansky, L.-P. Schmidt, R. Hocke, O. Wohlgemuth, Universitaet Erlangen-Nuernberg

Using Defect Information to Manage LTCC Yield and Manufacturing Costs
Benjamin Arnold, Midas Vision Systems

Reception: 6 pm – 6:30 pm

Dinner: 6:30 pm – 7:30 pm


Wednesday, April 9

Registration: 7 am – 5 pm 

Continental Breakfast: 7 am – 8 am

Exhibit Hours: 10 am – 4 pm

WA1: Materials
Chair: Daniel Amey, DuPont Electronic Technologies
8 am – 10 am

Factors Affecting Characteristics of Thick Film Voltage Tunable Dielectric Materials
Marion Ed. Ellis, Fredrick Duvall, Barry Treadway, Shawn Tang, Elijah Underhill, Paratek Microwave

Dielectric Material and Waveguide Development for Low Temperature Co-fired Ceramics
Michael T. Lanagan, Chiping Wang, Sayed-Khaled Rajab, Clive Randall, Hsin-Cheng Chen, Kuen-Fwu Fuh, The Pennsylvania State University

Constrained Sintered LTCC Material Systems for Interconnects and Packages
Christopher R. Needes, Carl B.Wang, Michael F. Barker, Patricia T. Ollivier, Kenneth W. Hang, Yong Cho, Kenneth E. Souders, DuPont Company

Development of Integrated High Value Resistors on Novel Substrates
Bruce A. Tuttle, David P. Williams, Walter Olson, Paul Clem, Sandia National Laboratories; Bruce King, Michael Renn, Optomec, Inc.

WA2: Design Simulation and Modeling
Chair: John Gipprich, Northrop Grumman Corporation
8 am – 10 am

Compact Stacked Tandem Coupler in LTCC
Michael J. Lee, John W. Gipprich, Northrop Grumman Corporation

Design of Compact Multi-Level Via-Less Bandpass Filters with Higher Harmonic Suppression
Kala Gururajan, Raghu K. Settaluri, Oregon State University

Miniaturized High Performance Low-pass and Bandstop Filters for Wireless Applications
Harish Peddibhotla, Raghu K. Settaluri, Oregon State University

Design of Miniaturised RF Filters in LTCC
Sarmad Al-Taei, University College London; George Passiopoulos, Nokia Networks

Break: 10 am – 10:30 am

WA3: LTCC
Chair: Michael Lanagan, The Pennsylvania State University
10:30 am – 12:30 pm

Characterization and Control of Low Temperature Co-Fire Ceramic (LTCC) Sintering
Christopher B. DiAntonio, Kevin Ewsuk, Sandia National Laboratories

Trends in LTCC Processing
Dean Anderson, The Pennsylvania State University

The Co-sintering of LTCC Materials
Terry J. Garino, Sandia National Laboratories

A Model System for Interfacial Reactions in LTCC Materials
Lawrence Cook, Winnie Wong-Ng, Levin Levin, Peter Schenck, Mark Vaudin, Julia Suh, NIST

WA4: Integrated Passives
Chair: William Borland, DuPont Electronic Technologies
10:30 am – 12:30 pm

Manufacturability and Reliability of Trimmed Buried Resistors in LTCC
Waleed Ehrhardt, Heiko Thust, Technical University of Ilmenau; Jens Mller, Micro Systems Engineering GmbH & Co.

Dielectric and Magnetic Materials for Integrated Passives
Alvin H. Feingold, Merrill Heinz, Richard Wahlers, Electro-Science Labs, Inc.

High k LTCC System for High Frequency Applications
Yong S. Cho, Kenneth W. Hang, Carl B. Wang, Kenneth E. Souders, Diptarka Majumdar, Daniel Amey, Christopher R. Needes, DuPont

Performance of Low-Ohmic Co-Fired Buried Resistors in A6S Tape
Michail Moroz, Ferro Corporation

Lunch: 12:30 pm – 1:30 pm

WP1: Power and Thermal Management
Chair: W. Kinzy Jones, Florida International University
1:30 pm – 3 pm

Micro Heat Exchanger in LTCC Ceramic Substrates
Hari Adrulu, W. Kinzy Jones, Marc Zampino, Yanqiug Liu, Florida International University

LTCC Based MEMS Impingement Coolers
Fred D. Barlow, Kuldeep Saxena, Victor Wang, Simon Ang, Aicha Elshabini, University of Arkansas

Localized Chip Cooling using LTCC-Embedded Miniaturized Fluid Circuit
Michael Newton, Carol Gamlen, Brian Smith, Harris Corporation

WP2: MEMS
Chair: Robert Poole, Sandia National Laboratories
1:30 pm – 3 pm

Novel Structures in Ceramic Interconnect Technology
Ken A. Peterson, Steve Rohde, Tim Turner, Bob Stokes, Adrian Casias, Sandia National Laboratories

Ceramic Packaging for MEMS-Based Microsystems
Jonathan S. Custer, Sandia National Laboratories

Joining Small Components with Reactive Multilayer Foils
Timothy P. Weihs, Omar M. Knio, Reactive NanoTechnologies

Break: 3 pm – 3:30 pm

WP3: New Applications
Chair: Steve Dai, Motorola
3:30 pm – 5 pm

Ion Mobility Spectrometers fabricated in Low Temperature Co-Fired Ceramic Materials
Donald Plumlee, A.J. Moll, Boise State University; M. Tam, H. H. Hill, Washington State University - Chemistry Department

Ceramic-MEMS: Science and Technology
Rishi Raj, L.-A. Liew, University of Colorado

Microdischarge Arrays in Ceramics and Semiconductors: A New Family of Photonic Devices
J. Gary Eden, University of Illinois

Concluding Remarks: 5 pm – 5:15 pm

 



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611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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