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Ceramic Interconnect Technology:
The Next Generation II
& Tabletop Exhibition

April 26 - 28, 2004

Hyatt Regency
1750 Welton Street
Denver, CO 80202
Phone: 800-223-1234; 303-295-5860
Single/Double $179
Reference Ceramic Interconnect Conference when making reservation

Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
The Ceramic Interconnect Initiative (CII)

Endorsed by:
The American Ceramics Society (ACerS)

General Chair:

Dr. Samuel J. Horowitz
DuPont Electronic & Communications Technology
Technical Program Chairs:

Mike Ehlert
National Semiconductor

Dr. Duane Dimos
Sandia National Laboratory

Monday, April 26

Registration: 5 pm - 7:30 pm

Opening Reception: 6:30 pm – 7:30 pm

Tuesday, April 27

Registration: 7 am - 6:30 pm

Continental Breakfast: 7 am - 8 am

Exhibit Hours: 10 am - 7:30 pm

Opening Remarks: 8:15 am - 8:30 am
Dr. Samuel Horowitz, Mike Ehlert and Dr. Duane Dimos, Conference Chairs

Keynote Presentations
8:30 am - 10 am

Title: Materials and Process Control Technology for LTCC Microelectronic Packaging
Speakers: Kevin G. Ewsuk, Christopher B. DiAntonio, Fernando Uribe, Saundra L. Monroe, Sandia National Laboratories

Title: Sensors, Actuators and other Non-Packaging Applications of LTCC Tapes
Speakers: Jorge J. Santiago-Avilés, University of Pennsylvania; Mario Gongora-Rubio, IPT; Patricio Espinoza-Vallejos, AGERE; L. Sola-Laguna, DuPont Electronic Materials

Break: 10 am - 10:30 am

Session TA1
Portable Wireless and Bluetooth
10:30 am - Noon
Chair: Fred Barlow, University of Arkansas

LTCC Based Front-End Receiver for 5 GHz WLAN Applications
Minh Van, Fred Barlow, Victor Wang, Aicha Elshabini, University of Arkansas

Microsystem Integration with New Techniques in LTCC
Ken A. Peterson, Steve B. Rohde, Charles A. Walker, Timothy S. Turner, Sandia National Laboratories

Design of LTCC devices for WLAN (802.11a/b/g)
Wen-Teng Lo, Jau-Ho Jean, Advanced Ceramic X (ACX) Corp.

Session TA2
Automotive Applications
10:30 am - Noon
Chair: Adam Schubring, Visteon

LTCC Technology for High Volume and Low Cost Production of Automotive Circuits
Nicolas Gosselin, Jean-Pierre Cazenave, Magali Renoult, Jacky Cerisier, DT Mircrocircuits

Utilizing an LTCC Substrate in an Under-hood Engine Control Application
M. Ray Fairchild, David W. Zimmerman, Kevin W. Brunner, Carl W. Berlin, Delphi Corp.

Meeting Environmental Challenges for Advanced Automotive Mechatronic Applications
James R. Thompson, Mark C. Christopher, DaimlerChrysler - Huntsville Electronics; John L. Evans, R. Wayne Johnson Auburn University

Lunch: Noon - 1 pm

Session TP1
Broad Band & Base Stations
1 pm - 2 pm
Chair: Martin Oppermann, EADS Deutschland GmbH

A High-Selective, Double-Dielectric E-Plane Bandpass Filter for Millimeter-Wave Applications
Raghu K. Settaluri, Oregon State University

Broadband High Frequency Package Design using Closed Air-Filled Sealed Cavities
Jerry Aguirre, Paul Garland, Adele Karmouche, Derek Mrazek, Joseph Tallo, Kyocera America Inc.

Session TP2
Advanced Assembly Topics

1 pm - 2:30 pm
Chair: Paul Collander, Poltronic

A Comparative Study of Ceramic and Organic Substrate Technologies for a High Performance Flip Chip Processor Application
Linda Bal, Andrew Mawer, Thomas Koschmieder, Motorola

Applicability of Active Solder Joining Technology to LTCC Packaging
Ronald W. Smith, Randall Redd, S-Bond Technologies LLC

Improvements in the Thermal-Cycled Adhesion of Soldered Conductors on LTCC Substrates
Patricia J. Ollivier, Yueli Wang, Christopher R. Needes, DuPont Microcircuit Materials

Break: 2:30 pm - 3 pm

Session TP3
Power and Thermal Management
3 pm - 4:30 pm
Chair: Alan Lyons, Lucent

Precision Alignment and Cooling Structures for Photonic Packaging on LTCC
Kari Kautio, Kimmo Keränen, Pentti Karioja, VTT Electronics

A Microjet Array Air Impingement Cooling Package Fabricated using Low Temperature Co-fired Ceramic
Kuldeep Saxena, Fred Barlow, Ganggiang Wang, Simon Ang, Aicha Elshabini, University of Arkansas

Thermal Performance of 943 Low Loss Green TapeTM LTCC with Thermal Via and Internal Metallization Enhancements
Daniel I. Amey, DuPont Microcircuit Materials; MiMi Keating, DuPont Central Research & Development

Session TP4
Design Simulation and Modeling

3 pm - 5 pm
Chair: John Gipprich, Northrop Grumman Corporation

Simulation and Modeling Techniques for Compact LTCC Packages
Ted Mirraco, Lloyd Nakamura, Malcolm Edwards, Applied Wave Research

Design and Verification of Embedded Passive Circuits in LTCC Substrates for High Performance, Low Cost RF SiP Modules
W. R. Smith, Matthew Hoppe, Ditrans Corporation

A Design Methodology for Embedded Filters
Cheri A. Anaclerio, Northrop Grumman Corp.

New Toroidal Inductor Configurations for LTCC Applications
Michael Phillips, Raghu K. Settaluri, Oregon State University

Reception: 5:30 pm - 6:30 pm

Session TP5
Advanced Topic – Poster Session
5:30 pm - 6:30 pm
Chair: Samuel J. Horowitz, DuPont Electronic and Communications Technology

Effects of Firing Conditions on Thick-film PTC Thermistor Characteristics in LTCC Technology
Hansu Birol, T. Maeder, C. Jacq, P. Ryser, EPFL - Ecole Polytechnique Fédérale de Lausanne

A Compact Ultrasonic Transducer using the Active Piezoceramic Material as Electronics Carrier
Jonny Johansson, Jerker Delsing, Lulea University of Technology

Deployment of a Monopropellant Micro-Nozzel and Ion Mobility Spectrometer in LTCC
Donald Plumlee, Judi Steciak, University of Idaho; Amy Moll, Boise State University

Wednesday, April 28

Registration: 7:30 am - 5 pm

Exhibit Hours: 10 am - 2 pm

Session WA1
8 am - 10 am
Chair: Jonathan Custer, Sandia National Laboratories

MEMS and Chip-Scale Atomic Clocks
Y.C. Lee, Victor M. Bright, Zoya Popovic, Yuan-jen.Chang, Simone Lee, Alexander Laws, Alan Brannon, Jason Breitbarth, University of Colorado

A Micromachined Ceramic Vertical Leaf Spring Actuator using LTCC Materials System
Craig H. Newborn II, Jennifer M. English, The University of Alabama in Huntsville

Advanced Surface Characterization of MEMS Devices: From Release to Packaging
James A. Ohlhausen, Kevin R. Zavadil, Diane E. Peebles, Steve M. Thornberg, Sandia National Laboratories

Development of Micromolds and Application with LTCC Substrates to obtain Microfluidic Devices
Roberto Castillo Colon, Eliphas Wagner Simões, Rogerio Furlan, Roberto Eduardo Bruzetti Leminski, Mário Ricardo Gongora-Rubioc, University of Puerto Rico at Humacao; Jorge J. Santiago-Aviles, University of Pennsylvania

Session WA2
Integrated Passives in LTCC
8 am - 10 am
Chair: Raghu Settaluri, Oregon State University

Multi-Layer Circuit Design with Embedded Passives
Sheng Mou Lin, Li-Qun Yang, Hong-Yang Chang, Shyh-Tirng Fang, Industrial Technology Research Institute

Performance of Buried and Surface Resistors in 943 LTCC Low Loss System
Mike F. Barker, Daniel I. Amey, Kenneth E. Souders, Latasha Y. Joyner, Timothy P. Mobley, DuPont Microcircuit Materials

Glass Phase Immiscibility of Thick-Film Resistors Embedded in Low Temperature Co-Fireable Ceramic Substrates
Chi-Shiung Hsi, Fang-Min Shieh, Hua-Pin Chen, I-Shou University

RF Response of DuPont 943 and Ferro A6 from 2.7 to 14.2 GHz
Howard A. Morgenstern, Honeywell Federal Manufacturing & Technology

Break: 10 am - 10:30 am

Session WA3
Materials Integration
10:30 am - Noon
Chair: Daniel Amey, DuPont Microcircuit Materials

Comparative Methods for Achieving Fine Line Features
Daniel C. Hughes, Hybrid Screen Technologies, Inc.; Randy Klein - Heraeus, Inc.

Incorporation of Thick Film Multilayer Dielectric and Resistor onto Thin Film Copper Metallization
David Lin, Taichaun Ding, Ford Wei, Tong Hsing Electronics; Ray Petit, Pacific Rim Technology

High Dielectric Constant Materials for Low Temperature Co-fired Ceramics
Michael T. Lanagan, Ching-Tai Cheng,Tom Shrout, Elena Semouchkina, Clive Randall, The Pennsylvania State University

Session WA4
Challenges in Integrated Passives
10:30 am - Noon
Chair: Duane Dimos, Sandia National Laboratory

A Ceramic Sealed Cavity with Screen Printed Ceramic Diaphragm
C.B. Sippola, CMC Electronics Cincinnati; C.H. Ahn, University of Cincinnati

Investigation of LTCC Resistors during Firing and Subsequent Re-Firings
Michail Moroz, Ferro Electronic Material Systems

Prototyping Challenges using Low Temperature Cofired Ceramic Materials
Amanda Baker, Elena Semouchkina, George Semouchkin, Jaun Nino, Takaki Murata, Michael Lanagan, Clive Randall, The Pennsylvania State University

Lunch: Noon - 1 pm

Session WP1
New Materials
1 pm - 2:30 pm
Chair: Michael Lanagan, The Pennsylvania State University

Investigation of Nano Oxide Crystallites in Internal Electrodes for Multilayer Ceramic Circuits
Chi-Jen Shih, Industrial Technology Research Institute

Integrated High Zirconia Content Plzt Dielectrics for High Energy Pulse Discharge Applications
David Williams, Bruce A. Tuttle, Paul G. Clem, Sandia National Laboratories

Low Temperature and Pressure Lamination of LTCC Tapes for Meso-Systems
Mário Ricardo Gongora-Rubio, Instituto de Pesquisas Tecnológicas; Zaira Mendes da Rocha, Nara Andréa de Oliveira, Jivaldo do Rosário Matos, Universidade de São Paulo; Núria Ibañez Garcia, Universidad Autónoma de Barcelona

Session WP2
Test and Measurement
1 pm - 2:30 pm
Chair: Michael Janezic, National Institute of Standards and Technology (NIST)

Characterization of Low-Loss Dielectric Materials using a Novel Rutile Dielectric Resonator Technique
Paul A. Smith, J. E. Holmes, T. W. Button, University of Birmingham

Design Considerations for Uniplanar Test Structures for High Frequency Material Characterization
Daniel I. Amey, Tim P. Mobley, DuPont Microcircuit Materials; Ethan Miller, Can Akgun, Rhonda Franklin Drayton, University of Minnesota

Dielectric Measurement Methods at Millimeter Wave Frequencies
Michael Janezic, National Institute of Standards and Technology (NIST)

Break: 2:30 pm - 3 pm

Session WP3
LTCC Systems & Processing

3 pm - 5 pm
Chair: Larry Zawicki, Kansas City Plant

New Pb free LTCC System for Automotive and Telecommunication Applications
Yong S. Cho, Kenneth W. Hang, Mike F. Barker, Patricia J. Ollivier, Carl B. Wang, Daniel I. Amey, Kenneth Souders, Christopher R. Needes, DuPont Electronic Technologies

LTCC (LFC) Material Systems and Its Application for Automotive ECU's
Susumu Nishigaki, Ulrich Goebel, Walter Roethlingshoefer, Robert Bosch GmbH

The Role of the Adhesive Rheology on the Cold Low Pressure Lamination of Green Ceramic Tapes
D. Couto, L. Schwegler, Robert Bosch GmbH; A. Roosen, University of Erlangen-Nuremberg

Stress Development During Constrained Sintering of LTCC
Jau-Ho Jean, Jui-Chuan Chang, Cheng-Dao Lei, Chiao-Chan Huang, National Tsing Hua University

Session WP4
Process Modeling
3 pm - 5 pm
Chair: Veena Tikare, Sandia National Laboratories

Microstructural Simulation of Solid State Sintering
Michael Braginsky, Veena Tikare, Sandia National Laboratories

Micromechanical Behavior of Cohesive Particle Networks
Kelly T. Miller, Sarunya Promkotra, Graham Mustoe, Colorado School of Mines

Characterization of the Shrinkage Behavior of Pure, Screen Printed Thick Film Pastes and LTCC Green Tapes
Andreas Roosen, Dirk Pohle, Matthias Wagner, University of Erlangen - Nuremberg

Hybrid Thick-Film Dimming Ballasts for Fluorescent Lamps
Janusz J. Gondek, Slawomir Kordowiak, Wojciech Mysinski, J. Kocol, Private Institute of Electronic Engineering

Concluding Remarks: 5 pm - 5:15 pm


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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