Registration: 5 pm - 7:30 pm
Opening
Reception: 6:30 pm – 7:30
pm
Tuesday, April 27
Registration: 7 am - 6:30 pm
Continental
Breakfast:
7 am - 8 am
Exhibit
Hours: 10 am - 7:30 pm
Opening Remarks: 8:15 am - 8:30 am
Dr. Samuel Horowitz, Mike Ehlert and Dr. Duane Dimos,
Conference Chairs
Keynote Presentations
8:30 am - 10 am
Title: Materials and Process Control Technology for
LTCC Microelectronic Packaging
Speakers: Kevin G. Ewsuk, Christopher B. DiAntonio, Fernando
Uribe, Saundra L. Monroe, Sandia National Laboratories
Title: Sensors, Actuators and other Non-Packaging Applications
of LTCC Tapes
Speakers: Jorge J. Santiago-Avilés, University
of Pennsylvania; Mario Gongora-Rubio, IPT; Patricio
Espinoza-Vallejos, AGERE; L. Sola-Laguna, DuPont Electronic
Materials
Break: 10 am - 10:30 am
Session TA1
Portable Wireless and Bluetooth
10:30 am - Noon
Chair: Fred Barlow, University of Arkansas
LTCC Based Front-End Receiver for 5 GHz WLAN Applications
Minh Van, Fred Barlow, Victor Wang, Aicha Elshabini,
University of Arkansas
Microsystem Integration with New Techniques in LTCC
Ken A. Peterson, Steve B. Rohde, Charles A. Walker, Timothy
S. Turner, Sandia National Laboratories
Design of LTCC devices for WLAN (802.11a/b/g)
Wen-Teng Lo, Jau-Ho Jean, Advanced Ceramic X (ACX) Corp.
Session TA2
Automotive Applications
10:30 am - Noon
Chair: Adam Schubring, Visteon
LTCC Technology for High Volume and Low Cost Production
of Automotive Circuits
Nicolas Gosselin, Jean-Pierre Cazenave, Magali Renoult,
Jacky Cerisier, DT Mircrocircuits
Utilizing an LTCC Substrate in an Under-hood Engine
Control Application
M. Ray Fairchild, David W. Zimmerman, Kevin W. Brunner,
Carl W. Berlin, Delphi Corp.
Meeting Environmental Challenges for Advanced Automotive
Mechatronic Applications
James R. Thompson, Mark C. Christopher, DaimlerChrysler
- Huntsville Electronics; John L. Evans, R. Wayne Johnson
Auburn University
Lunch: Noon - 1 pm
Session TP1
Broad Band & Base Stations
1 pm - 2 pm
Chair: Martin Oppermann, EADS Deutschland GmbH
A High-Selective,
Double-Dielectric E-Plane Bandpass Filter for Millimeter-Wave
Applications
Raghu K. Settaluri, Oregon State University
Broadband
High Frequency Package Design using Closed Air-Filled
Sealed Cavities
Jerry Aguirre, Paul Garland, Adele Karmouche, Derek
Mrazek, Joseph Tallo, Kyocera America Inc.
Session TP2
Advanced Assembly Topics
1 pm - 2:30 pm
Chair: Paul Collander, Poltronic
A Comparative Study of Ceramic and Organic Substrate
Technologies for a High Performance Flip Chip Processor
Application
Linda Bal, Andrew Mawer, Thomas Koschmieder, Motorola
Applicability of Active Solder Joining Technology to
LTCC Packaging
Ronald W. Smith, Randall Redd, S-Bond Technologies LLC
Improvements in the Thermal-Cycled Adhesion of Soldered
Conductors on LTCC Substrates
Patricia J. Ollivier, Yueli Wang, Christopher R. Needes,
DuPont Microcircuit Materials
Break: 2:30 pm - 3 pm
Session TP3
Power and Thermal Management
3 pm - 4:30 pm
Chair: Alan Lyons, Lucent
Precision Alignment and Cooling Structures for Photonic
Packaging on LTCC
Kari Kautio, Kimmo Keränen, Pentti Karioja, VTT
Electronics
A Microjet Array Air Impingement Cooling Package Fabricated
using Low Temperature Co-fired Ceramic
Kuldeep Saxena, Fred Barlow, Ganggiang Wang, Simon Ang,
Aicha Elshabini, University of Arkansas
Thermal Performance of 943 Low Loss Green TapeTM LTCC
with Thermal Via and Internal Metallization Enhancements
Daniel I. Amey, DuPont Microcircuit Materials; MiMi
Keating, DuPont Central Research & Development
Session TP4
Design Simulation and Modeling
3 pm - 5 pm
Chair: John Gipprich, Northrop Grumman Corporation
Simulation and Modeling Techniques for Compact LTCC
Packages
Ted Mirraco, Lloyd Nakamura, Malcolm Edwards, Applied
Wave Research
Design and Verification of Embedded Passive Circuits
in LTCC Substrates for High Performance, Low Cost RF
SiP Modules
W. R. Smith, Matthew Hoppe, Ditrans Corporation
A Design Methodology for Embedded Filters
Cheri A. Anaclerio, Northrop Grumman Corp.
New Toroidal Inductor Configurations for LTCC Applications
Michael Phillips, Raghu K. Settaluri, Oregon State University
Reception:
5:30 pm - 6:30 pm
Session TP5
Advanced Topic – Poster Session
5:30 pm - 6:30 pm
Chair: Samuel J. Horowitz, DuPont Electronic and
Communications Technology
Effects of Firing Conditions on Thick-film
PTC Thermistor Characteristics in LTCC Technology
Hansu Birol, T. Maeder, C. Jacq, P. Ryser, EPFL - Ecole
Polytechnique Fédérale de Lausanne
A Compact Ultrasonic Transducer using the Active Piezoceramic
Material as Electronics Carrier
Jonny Johansson, Jerker Delsing, Lulea University of
Technology
Deployment of a Monopropellant Micro-Nozzel
and Ion Mobility Spectrometer in LTCC
Donald Plumlee,
Judi Steciak, University of Idaho; Amy Moll,
Boise State
University
Wednesday, April 28
Registration: 7:30 am - 5 pm
Exhibit Hours: 10 am - 2 pm
Session WA1
MEMS
8 am - 10 am
Chair: Jonathan Custer, Sandia National Laboratories
MEMS and Chip-Scale Atomic Clocks
Y.C. Lee, Victor M. Bright, Zoya Popovic, Yuan-jen.Chang,
Simone Lee, Alexander Laws, Alan Brannon, Jason Breitbarth,
University of Colorado
A Micromachined Ceramic Vertical Leaf Spring Actuator
using LTCC Materials System
Craig H. Newborn II, Jennifer M. English, The University
of Alabama in Huntsville
Advanced Surface Characterization of MEMS Devices: From
Release to Packaging
James A. Ohlhausen, Kevin R. Zavadil, Diane E. Peebles,
Steve M. Thornberg, Sandia National Laboratories
Development of Micromolds and Application with LTCC
Substrates to obtain Microfluidic Devices
Roberto Castillo Colon, Eliphas Wagner Simões,
Rogerio Furlan, Roberto Eduardo Bruzetti Leminski, Mário
Ricardo Gongora-Rubioc, University of Puerto Rico at
Humacao; Jorge J. Santiago-Aviles, University of Pennsylvania
Session WA2
Integrated Passives in LTCC
8 am - 10 am
Chair: Raghu Settaluri, Oregon State University
Multi-Layer Circuit Design with Embedded Passives
Sheng Mou Lin, Li-Qun Yang, Hong-Yang Chang, Shyh-Tirng
Fang, Industrial Technology Research Institute
Performance of Buried and Surface Resistors in 943 LTCC
Low Loss System
Mike F. Barker, Daniel I. Amey, Kenneth E. Souders, Latasha
Y. Joyner, Timothy P. Mobley, DuPont Microcircuit Materials
Glass Phase Immiscibility of Thick-Film Resistors Embedded
in Low Temperature Co-Fireable Ceramic Substrates
Chi-Shiung Hsi, Fang-Min Shieh, Hua-Pin Chen, I-Shou
University
RF Response of DuPont 943 and Ferro A6 from 2.7 to 14.2
GHz
Howard A. Morgenstern, Honeywell Federal Manufacturing & Technology
Break: 10 am - 10:30 am
Session WA3
Materials Integration
10:30 am - Noon
Chair: Daniel Amey, DuPont Microcircuit Materials
Comparative Methods for Achieving Fine Line Features
Daniel C. Hughes, Hybrid Screen Technologies, Inc.; Randy
Klein - Heraeus, Inc.
Incorporation of Thick Film Multilayer Dielectric and
Resistor onto Thin Film Copper Metallization
David Lin, Taichaun Ding, Ford Wei, Tong Hsing Electronics;
Ray Petit, Pacific Rim Technology
High Dielectric Constant Materials for Low Temperature
Co-fired Ceramics
Michael T. Lanagan, Ching-Tai Cheng,Tom Shrout, Elena
Semouchkina, Clive Randall, The Pennsylvania State University
Session WA4
Challenges in Integrated Passives
10:30 am - Noon
Chair: Duane Dimos, Sandia National Laboratory
A Ceramic Sealed
Cavity with Screen Printed Ceramic Diaphragm
C.B. Sippola, CMC Electronics Cincinnati; C.H. Ahn,
University of Cincinnati
Investigation of LTCC Resistors during Firing and Subsequent
Re-Firings
Michail Moroz, Ferro Electronic Material Systems
Prototyping Challenges using Low Temperature Cofired
Ceramic Materials
Amanda Baker, Elena Semouchkina, George Semouchkin, Jaun
Nino, Takaki Murata, Michael Lanagan, Clive Randall,
The Pennsylvania State University
Lunch: Noon - 1 pm
Session WP1
New Materials
1 pm - 2:30 pm
Chair: Michael Lanagan, The Pennsylvania State University
Investigation of Nano Oxide Crystallites in Internal
Electrodes for Multilayer Ceramic Circuits
Chi-Jen Shih, Industrial Technology Research Institute
Integrated High Zirconia Content Plzt Dielectrics for
High Energy Pulse Discharge Applications
David Williams, Bruce A. Tuttle, Paul G. Clem, Sandia
National Laboratories
Low Temperature and Pressure Lamination
of LTCC Tapes for Meso-Systems
Mário Ricardo Gongora-Rubio, Instituto de Pesquisas
Tecnológicas; Zaira Mendes da Rocha, Nara Andréa
de Oliveira, Jivaldo do Rosário Matos, Universidade
de São Paulo; Núria Ibañez Garcia,
Universidad Autónoma de Barcelona
Session WP2
Test and Measurement
1 pm - 2:30 pm
Chair: Michael Janezic, National Institute of Standards
and Technology (NIST)
Characterization of Low-Loss Dielectric Materials using
a Novel Rutile Dielectric Resonator Technique
Paul A. Smith, J. E. Holmes, T. W. Button, University
of Birmingham
Design Considerations for Uniplanar Test Structures
for High Frequency Material Characterization
Daniel I. Amey, Tim P. Mobley, DuPont Microcircuit Materials;
Ethan Miller, Can Akgun, Rhonda Franklin Drayton, University
of Minnesota
Dielectric
Measurement Methods at Millimeter Wave
Frequencies
Michael Janezic, National Institute of Standards and
Technology (NIST)
Break: 2:30 pm - 3 pm
Session WP3
LTCC Systems & Processing
3 pm - 5 pm
Chair: Larry Zawicki, Kansas City Plant
New Pb free LTCC System for Automotive and Telecommunication
Applications
Yong S. Cho, Kenneth W. Hang, Mike F. Barker, Patricia
J. Ollivier, Carl B. Wang, Daniel I. Amey, Kenneth Souders, Christopher R. Needes, DuPont Electronic
Technologies
LTCC (LFC)
Material Systems and Its Application for Automotive
ECU's
Susumu Nishigaki, Ulrich Goebel, Walter Roethlingshoefer,
Robert Bosch GmbH
The Role of the Adhesive Rheology on the Cold Low Pressure
Lamination of Green Ceramic Tapes
D. Couto, L. Schwegler, Robert Bosch GmbH; A. Roosen,
University of Erlangen-Nuremberg
Stress Development
During Constrained Sintering of LTCC
Jau-Ho Jean, Jui-Chuan Chang, Cheng-Dao Lei, Chiao-Chan
Huang, National Tsing Hua University
Session WP4
Process Modeling
3 pm - 5 pm
Chair: Veena Tikare, Sandia National Laboratories
Microstructural Simulation of Solid State Sintering
Michael Braginsky, Veena Tikare, Sandia National Laboratories
Micromechanical Behavior of Cohesive Particle Networks
Kelly T. Miller, Sarunya Promkotra, Graham Mustoe, Colorado
School of Mines
Characterization of the Shrinkage Behavior of Pure,
Screen Printed Thick Film Pastes and LTCC Green Tapes
Andreas Roosen, Dirk Pohle, Matthias Wagner, University
of Erlangen - Nuremberg
Hybrid Thick-Film Dimming Ballasts for Fluorescent Lamps
Janusz J. Gondek, Slawomir Kordowiak, Wojciech Mysinski,
J. Kocol, Private Institute of Electronic Engineering
Concluding Remarks: 5 pm - 5:15 pm
