IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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IMAPS Chesapeake-area Technical Meeting

Packaging Challenges in Defense Applications 

Thursday, September 25, 2008  

Please join us for presentations, dinner and tour
Center for Advanced Life Cycle Engineering
University of Maryland, College Park

Register on-line


Agenda and Fees:

5:00  Registration and Introductions

5:30  Catered Dinner

6:30  CALCE Tour – Dr. Patrick McCluskey

7:20  First Presentation: Michael Deeds, Navy Research Labs
“SOI in High G Environments”

7:50  Second Presentation: Bruce Geil, Army Research Labs
“Power and Thermal Challenges for Advanced Army Land Systems”

8:20 Wrap-up and suggestions for the next local program


RSVP before 5pm Eastern on September 22
Register on-line   
Cost: IMAPS members - $ 10.00.  Non-members - $ 20.00.  Students – $ 5.00

Event Location:
CALCE, 1103 Engineering Lab Building, 301-405-5323
Map, Directions, and Metro-Parking





 


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 | E-mail: imaps@imaps.org

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