IMAPS Chesapeake-area
Winter Technical Symposium
Wednesday, January 27, 2010
3:00 - 6:50 pm
Please join us for presentations, dinner, and newtorking
John Hopkins University, Applied Physics Laboratory
Laurel, Maryland
On-line Registration
Registration Closes: 12noon EST on January 25, 2010
3:00 Registration and networking
3:30 Mike Osterman, Senior Research Scientist of the University of Maryland’s CALCE
“Effect of Temperature Cycling Parameters (Dwell and Mean Temperature) on the Durability of Pb-free solders
Abstract: To assure reliability of electronic hardware, it is important to understand the reliability of solder joints under use conditions. The conversion to RoHS-compliant materials has raised concerns about the reliability of lead-free solders used in electronic products. One of the primary mechanisms of solder joint failure is fatigue due to fluctuations in temperature resulting from operational and environmental conditions. Fatigue of solder arises from cyclic strain within the solder joint due to different rates of temperature expansion in the solder and interconnected structures. To address the solder joint reliability concern of lead-free solder, a systematic set of experiments was conducted to examine the impact of dwell time and mean temperature on solder joint reliability. SAC305, SN100C, and SnPbAg solders were tested and compared with prior test results. The results indicated that lowering the mean cyclic temperature increased the thermal cycling durability of the solders dramatically. Results on the impact of cyclic mean temperature and dwell time revealed that dwell had a larger effect when the mean cyclic temperature was lower. Extended low temperature dwell for a temperature cycle of -25ºC to 75oC was found to be more damaging than expected, particularly for SnPbAg. For a maximum temperature of 125oC, a dwell-time increase from 15 to 75 minutes did not have much effect. Results indicated that SAC305 was slightly less durable than SAC379 but was more reliable than SN100C and SnPbAg solders. SnPbAg was less durable than SnPb solder.
4:00 Jay Brusse, Senior Components Engineer of NASA Goddard Space Center-Perot Systems
“Metal Whiskers: A Discussion of Risks and Mitigations”
4:30 Break
4:45 Craig Hillman, CEO and Managing Partner of DFR Solutions
“Manufacturing and Reliability Challenges With QFN.”
5:15 Harry Charles, Chief Engineer of the JHU/APL Milton Eisenhower Research Center
“Green Electronics: Solar Cells to Light Emitting Diodes.”
Abstract: Energy availability and its cost are major concerns to every person. Fossil fuels in general and oil in particular, are limited and the world’s reserves are depleting. In addition, the proliferation of electronic products and their manufacture now pose additional threats to the fragile balance in the Earth’s eco systems. While posing threats, electronics can be the solution to many of our current and future environmental and energy related problems. A brief discussion of “green” electronics is presented along with how solar cells and solid state lighting will impact the energy picture of the future.
5:45 Closing Comments (spring event planning and East Coast event in June)
5:50 Catered Dinner, Honey teriyaki chicken or penne pasta with marinara sauce.
