IMAPS Chicago/Milwaukee Chapter
Technical Meeting and Tour
Thursday, June 11, 2009
Begins at 11:30am
Connor-Winfield, Aurora, IL
Please join us for lunch, technical presentations and an optional tour.
Registration closed Monday, June 8 at 5pm EDT
11:30 Registration
12:00 Lunch and Registration
1:00 Opening Remarks by Rich Epich, Sales Manager at Connor-Winfield.
Self-Introductions
1:15 Greg Ballard, Senior Thickfilm Engineer at Connor-Winfield
“Printing of Silicon Wafers.”
1:45 Neil Kane, President of Advanced Diamond Technologies
“Machines Made of Diamond.”
2:15 Joe McCabe-Vice President & Rob Lindsey-Service Manager from Epoxy Technology.
“An Overview of Electrically and Thermally Conductive Adhesives.”
2:45 Event wrap-up.
Review.
Program for next event.
Propose Chapter Leadership
3:00 Optional Tour and Hybrid Circuit Works Overview by Rich Epich
Tours of an 85,000 S.F. Printed Circuit and Hybrid Assembly and/or a 35,000 S.F. Thick Film Facility will be offered. Printed Circuit and Hybrid Assembly facility includes wafer sawing, die attachment, wire bonding, Surface Mount Technology, and device packaging.
