IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

IMAPS Chicago/Milwaukee Chapter

Technical Meeting and Tour

Thursday, June 11, 2009
Begins at 11:30am
Connor-Winfield, Aurora, IL

Please join us for lunch, technical presentations and an optional tour.

Registration closed Monday, June 8 at 5pm EDT


Program:

11:30 Registration

12:00 Lunch and Registration

1:00 Opening Remarks by Rich Epich, Sales Manager at Connor-Winfield.
Self-Introductions

1:15 Greg Ballard, Senior Thickfilm Engineer at Connor-Winfield
“Printing of Silicon Wafers.”

1:45 Neil Kane, President of Advanced Diamond Technologies
“Machines Made of Diamond.”

2:15 Joe McCabe-Vice President & Rob Lindsey-Service Manager from Epoxy Technology.
“An Overview of Electrically and Thermally Conductive Adhesives.”

2:45 Event wrap-up.
Review.
Program for next event.
Propose Chapter Leadership

3:00 Optional Tour and Hybrid Circuit Works Overview by Rich Epich
Tours of an 85,000 S.F. Printed Circuit and Hybrid Assembly and/or a 35,000 S.F. Thick Film Facility will be offered. Printed Circuit and Hybrid Assembly facility includes wafer sawing, die attachment, wire bonding, Surface Mount Technology, and device packaging.


Registration:

RSVP before Monday, June 8 at 5pm EDT
Cost: IMAPS members - $ 15.00.  Non-members - $ 25.00.  Students – $ 5.00

Event Location:

Connor – Winfield
2359 Diehl Road
Aurora, Illinois 60502
Phone: 630-499-2150





© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001