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IMAPS/ACerS 1st International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
Co-located with the 107th Annual Meeting of the American Ceramic Society

April 10 - 13, 2005
Baltimore Marriott Waterfront Hotel
700 Aliceanna Street
Baltimore, MD USA 21202
Ph: 410-385-3000; Fax: 410-385-0330

When making reservations, please reference the American Ceramic Society.
Single $169

General Chairs:
Technical Program Chairs:
Samuel J. Horowitz, DuPont
Kevin G. Ewsuk, Sandia National Laboratories
David Wilcox, Consultant
Michael Ehlert, Barry Industries, Inc.

Register by Fax/Mail (pdf)
Message from the Chairs | Advisory Board | Program PDF

Tabletop Exhibit Application | Reserve Booth On-line

Program at a Glance: (Program Grid PDF)
Sunday: Rustum Roy Lecture
Monday: Keynote 1 | Keynote 2 | Orton Memorial Lecture | Keynote 3 | MP1 - Materials Solution... | MP2 - Cofiring | MP3 - Microsystem Materials... | MP4 - Dimensional Control...
Tuesday: Keynote 4 | TA1 - Ceramic Microsystems... | TA2 - Processing Integrated... | TA3 - Ceramic Microsystems... | TA4 - Materials Integration... | Global Business Council
Wednesday: Keynote 5 | WA1 - Design and Fabrication... | WA2 - Design, Simulation... | WA3 - Ceramic Microsystems... | WA4 - Characterizing Materials... | Keynote 6 | WP1 - Ceramics... | WP2 - Ink Jet Printing... | WP3 - Microsystem Materials...

Message from the General Co-Chairs
Under the joint sponsorship of the International Microelectronics And Packaging Society (IMAPS) and the American Ceramic Society (ACerS), the scope of the very successful Ceramic Interconnect Conference has expanded. The renamed International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) combines the complementary interests, strengths, and leadership of the constituencies of both IMAPS and ACerS to focus on and accelerate advances in both ceramic interconnect and ceramic microsystems. We believe this conference will be THE premier global forum on ceramic interconnect and ceramic microsystems, two of the fastest growing areas of ceramic technology.

We thank our 21-member international advisory board (see, Technical Co-Chairs, Kevin Ewsuk (Sandia National Laboratories) and Mike Ehlert (Barry Industries, Inc.), session organizers/leaders, and the IMAPS and ACerS staff for their support and leadership in putting this program together.

The participation of speakers from 13 different countries in Europe, Asia, and the Americas reflects the international scope of this three-day conference. Six invited keynote speakers will provide comprehensive overviews of current and future directions in key areas, including: ceramic microsystems, ceramic interconnect, materials and processing, automotive applications, and design and integration. Additionally, 57 contributed papers in 15 different sessions will address the latest advances in ceramic interconnect and ceramic microsystems.

As an added bonus, Mike O'Neill (Heraeus, Inc.) and Mike Lanagan (The Pennsylvania State University) have organized a special session entitled "Business of Emerging Microsystems" that will feature the perspectives of government, industry, and national laboratory speakers. Following this, David Wilcox will lead a panel discussion on opportunities and needs to accelerate the ceramic microsystems thrust. The special business session and panel discussion will address the infrastructure being developed to support the vital emerging ceramic microsystems market.

Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To facilitate networking, these exhibits will be located in the same room used for the breaks and meals. To reserve space, visit or contact Ann Bell (, 202-548-8717. Space is limited, so reserve yours as soon as possible.

To promote collaboration and interaction with industry, a limited number of tabletop exhibit spaces have been reserved for non-commercial organizations such as universities and national laboratories. This space will be made available, on a first come first served basis, to qualifying organizations. Contact Sam Horowitz or Dave Wilcox for more information.

The 1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies has all of the ingredients of a successful meeting; please join us in Baltimore, April 10-13, 2005.

Samuel J. Horowitz and David L. Wilcox
General Co-Chairs

Sunday, April 10

Registration: 4 pm – 7 pm

Frontier of Science and Society - Rustum Roy Lecture: 5 pm - 6 pm
Speaker: Dr. Arden L. Bement, Jr., National Institute of Standards and Technology

Welcome Reception: 6 pm - 7 pm

Monday, April 11

Registration: 7 am – 5 pm

Continental Breakfast: 7 am – 8 am

Opening Remarks: 8 am – 8:30 am
Conference Chairs

Keynote Presentations: 8:30 am – 9:30 am
Title: Future Challenges and Opportunities in Multilayer Ceramic Technology

Speakers: Clive A. Randall, G. Yang, E. Dickey, R. Eitel, K. Rajab, M. Iwaski, E. Semouchkina, G. Semouchkina, A. Baker, S. Rhee, K. Uchino, M. J. Lanagan, The Pennsylvania State University

Keynote Presentations: 9:30 am – 10:30 am
Title: Current and Future Directions for Ceramic Interconnect

Speakers: Christian Hoffmann, Sebastian Brunner, Markus Noren, EPCOS OHG

Break: 10:30 am – 11 am

Edward Orton, Jr. Memorial Lecture: 11 am – Noon
Speaker: Dr. Peter Barnwell, Custom Interconnect (CIL)
Title: An Innovative Ceramic Technology Success - LTCC from Laboratory to Electronics Applications in the Market Place

Lunch: Noon – 1 pm

Keynote Presentation: 1 pm – 1:55 pm
Title: Materials Process and Manufacturing: Current and Future Directions

Speaker: Andreas Roosen, University of Erlangen – Nuremberg

Session MP1: Materials Solution for Microsystems
Chair: Heiko Thust, Technical Univ. of Ilmenau
2 pm – 3:20 pm

On-Board Fiber Alignment in LTCC Optoelectronic Packages
Richard E. Eitel, Amanda Baker, Jose Agraz, Mike Lanagan, Kenji Uchino, Clive Randall, The Pennsylvania State University

Photosensitive Dielectric Paste for Micro-Patterning Technology in LTCC System
Hyo Tae Kim, Kui Won Kang, T. Masaki, Kwang Jin Kim, Jonghee Kim, Korea Institute of Ceramic Engineering & Technology

Micro Channel Fabrication in LTCC Substrate
W. Kinzy Jones, Surya Kappagantula, Jaing Wang, Florida International University

Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications
Jens Mueller, J. Pohlner, D. Schwanke, G. Reppe, H. Thust, R. Perrone, Micro Systems Engineering GmbH & Co.

Session MP2: Cofiring
Chairs: Fred Barlow, University of Arkansas; Martin Oppermann, EADS Deutschland GmbH
2 pm – 3:20 pm

Camber and Stress Development during the Cofiring of Bi-Layer Ceramic Dielectric Laminate
Jau-Ho Jean, R. T. Hsu, National Tsing Hua University

The Study of Graded Joining of Alumina and Zirconia Ceramics in Green State
Boran Tian, Jiachen Liu, Tianjin University

Direct Interconnecting of CePO4/ZrO2 Composites in Green State
Libin Liu, Jiachen Liu, Tianjin University

Break: 3:20 pm – 3:40 pm

Session MP3: Microsystem Materials & Integration
Chair: Bob Freer, University of Manchester/UMIST
3:40 pm – 5 pm

Integration Concepts for the Fabrication of LTCC Structures
Amanda Baker, Michael Lanagan, Clive Randall, Elena Semouchkina, George Semouchkin, Sayed-Khaled Rajab, Sorah Rhee, Peter Geggier, Guenter Fuhr, The Pennsylvania State University

Development and Processing of an Anodic Bondable LTCC Tape
Edda Müller, B. Pawlowski, P. Rothe, R. Ehrt, A. Heymel, E. Weiland, K. Kaschlik, VIA Electronic GmbH

Fabrication of LTCC Micro-Fluidic Devices using Sacrificial Carbon Layers
Hansu Birol, T. Maeder, C. Jacq, R. Passerini, Y. Fournier, S. Straessler, P. Ryser, Swiss Federal Institute of Technology

LTCC Phase Shifter Modules for RF-MEMS-Switch Integration
Thomas Bartnitzek, Edda Müller, VIA Electronic GmbH; Raymond van Dijk, TNO-FEL

Session MP4: Dimensional Control in LTCC Systems
Chairs: Adam Schubring, Visteon Corporation; Walter Rothlingshofer, Robert Bosch GmbH
3:40 pm – 5 pm

Zero Shrinkage of LTCC by Self-Constrained Sintering
Torsten Rabe, Wolfgang A. Schiller, Federal Institute for Materials Research and Testing; Thomas Hochheimer, Heraeus Inc. Circuit Materials Division, USA; Christina Modes, Annette Kipka, W.C. Heraeus GmbH, CMD, Germany

Self Constrained Sintering LTCC - A Reliable Solution for Automotive Electronic Application
Christina Modes, Annette Kipka, Quentin Reynolds, Michael Neidert, Stefan Malkmus, Frieder Gora, Heraeus Circuit Materials Division

Via Fill for Zero X-Y Shrink LTCC Tapes
Weiming Zhang, Tom Hochheimer, Peter Bokalo, Heraeus Incorporated-Circuit Materials Division

Novel Self-Constrained Sintered Composites of Dielectric and Ferrite LTCC Tapes for Microwave Applications
Marcel Hagymasi, Andreas Roosen, University of Erlangen-Nuremberg; Roman Karmazin, Steffen Walter, Siemens AG

Tuesday, April 12

Registration: 7 am – 8 pm

Continental Breakfast: 7 am – 8 am

Exhibit Hours: 5 pm – 8 pm

Keynote Presentation: 8 am – 8:55 am
Title: Ceramic Microsystems for Automotive Applications

Speaker: Gerhard Schneider, Robert Bosch GmbH

Session TA1: Ceramic Microsystems and Applications I
Chair: Leszek Golonka, Wroclaw University of Technology
9 am – 10:20 am

Progress in MEMS and Micro Systems Research
Chang Liu, University of Illinois at Urbana

Microfabrication of Highly Piezoelectric Microcantilevers for Sensor Applications
Wei-Heng Shih, Zuyan Shen, Wan Y. Shih, Drexel University

Miniaturized Sensor Elements based on LTCC Technology for Automotive and Airborne Applications
Ulrich Schmid, Helmut Seidel, Thomas Becker, Saarland University

LTCC Sensors for Environmental Monitoring System
Mario R. Gongora Rubio, Patrick B. Verdonck, Sergio Takeo Kofuji, Antonio C. Seabra, Emilio Del Moral Hernandez, Eliphas W. Simões, Marcelo Bariatto A. Fontes, Instituto de Pesquisas Tecnolgica (IPT)

Session TA2: Processing Integrated Passives in LTCC
Chair: Raghu Settaluri, Oregon State University
9 am – 10:20 am

Post-Thermal Heat Treatment for Adjusting Buried Resistor Values in DuPont 943 LTCC
Daniel S. Krueger, Elizabeth Parker, Gregg Barner, Honeywell FM&T; Fernando Uribe, Scott Reed, Sandia National Laboratories

Thin Film Technologies for Integrated Passives
Kyung-Ku Choi, Shigeki Satou, TDK Corporation

Characterization of Dried Thick-Film Resistors
Klaus Krueger, Helmut-Schmidt University

Methods to Improve Yield and Efficiency in Laser Trim of Embedded Components
Donald M. Hague, Alf Holtz, W. M. Hague Company, Inc.

Break: 10:20 am – 10:40 am

Session TA3: Ceramic Microsystems and Applications II
Chair: Amy Moll, Boise State University
10:40 am – Noon

Novel Microsystem Applications with New Techniques in LTCC
Ken A. Peterson, Kamlesh Patel, Clifford Ho, Steve Rohde, Chris Nordquist, Charles Walker, Brian Wroblewski, Sandia National Laboratories

Real-Time, in SITU, Biodetection and Quantification using Piezoelectric Microcantilevers
John-Paul McGovern, Wei-Heng Shih, Wan Y. Shih, Drexel University

Nerve-Gas Simulant, Dimethyl Methylphosphonate (DMMP) Detection using Array Piezoelectric Microcantilevers
Wei-Heng Shih, Qing Zhu, Wan Y. Shih, Drexel University

Preparation of Polymeric Microspheres by an Emulsification/Solvent Diffusion Process Employing LTCC Microfluidic Structures
Mário Ricardo Gongora-Rubio, Márcio Rodrigues da Cunha, Alcione Penido de Oliveira Costa, Maria Inês Ré, Instituto de Pesquisas Tecnológicas

Session TA4: Materials Integration in LTCC
Chair: Larry Zawicki, Honeywell Federal Manufacturing and Technologies, LLC
10:40 am – Noon

Low Sintering Ni-Cu-Zn-Ferrite Tapes for LTCC Integrated Inductors
Stefan Barth, F. Bechtold, E. Müller, VIA Electronic GmbH; J. Mürbe, J. Töpfer, Fachhochschule Jena, Hermsdorfer Institut für Technische Keramik

Micron Scale Conductors and Integrated Passives in LTCCs by Electrophoretic Deposition
Jonathan Van Tassel, Clive A. Randall, The Pennsylvania State University

Bulk Materials in LTCC Multilayers
Michael Hintz, Technical University of Ilmenau

Miniaturizing the Size of Microwave Filters by using LTCC Technology with Hybrid Dielectrics
W. S. Lee, Y. C. Lee, Y. Z. Chung, National Cheng Kung University

Global Business Council: 1:30 pm - 4:30 pm
Business of Emerging Microsystems
Chairs: Michael O'Neill, Heraeus Incorporated-Circuit Materials Division; Michael Lanagan, The Pennsylvania State University

Plenary Session: 1:30 pm - 3 p.m.
Session Coordinators: Mike Lanagan and Mike O’Neill
Overview of Research, Development, and Commercialization of Microsystems

Commercializing Research
Michael Kane and John. P. Riganati, Office of Technology, Innovation and Acquisition, Sarnoff Corporation
(click to view the plenary abstract)
Michael Kane, a Distinguished member of Sarnoff's Office of Technology Strategy, Innovation and Acquisition will be making the presentation as John Riganati is unable to attend.

MEMS Commercialization
Carl Freidhoff, Northrop Grumman Corp. and Ellen M. McDevitt, MEMS Industry Group
(click to view the plenary abstract)
Carl Freidhoff will be making the presentation with Ellen McDevitt.

Biochips and BioMEMS for Analytics and Medical Diagnostics
Frank F. Bier, Fraunhofer IBMT
(click to view the plenary abstract)

Panel Discussion: 3 pm – 4 pm (click to view the panel agenda)
Ceramic Microsystems: The Path Forward
Moderator: Dr. D. L. Wilcox, Consultant

Panel Members:

Mr. Dan Amey, E. I. DuPont
Mr. Jonathan Bost, JRB Consulting, LLC
Dr. Art Chait, Eoplex Technologies, Inc.
Mr. Walter Roethlingshoefer, Robert Bosch GmbH
Prof. Dr. Andreas Roosen, University of Erlangen-Nuremberg 


Reception/Dinner in the Exhibit Hall: 5 pm – 8 pm

Wednesday, April 13

Registration: 7 am – 5 pm

Continental Breakfast: 7 am – 8 am

Exhibit Hours: 10 am – 2 pm

Keynote Presentation: 8 am – 8:55 am
Title: Integrated Design and Simulation Tools for Microsystems Packaging:
Current Capabilities and Future Needs
Speaker: Marc Desmulliez, Heriot Watt University

Session WA1: Design and Fabrication of Ceramic Microsystems and Devices
Chair: Torsten Rabe, Federal Institute for Materials Research and Testing
9 am – 10:20 am

Modular Micro Reaction System including Ceramic Components
Tassilo Moritz, Reinhard Lenk, Jörg Adler, Michael Zins, Fraunhofer Institute for Ceramic Technologies and Sintered Materials

Ceramics in Microtechnology - Materials, Processing, Design
Hans-Joachim Ritzhaupt-Kleissl, Jürgen Haußelt, Robert Ruprecht, Forschungszentrum Karlsruhe, Institut für Materialforschung III

Integrated Design and Simulation of Microfluidic Devices
S. Krish Krishnamoorthy, Jerry Feng, Aditya S. Bedekar, Shankar Sundaram, CFD Research Corporation

Fabrication of Microfluidic Oscillators by Laser Milling in Sintered LTCC and Quartz Substrates
Rogerio Furlan, Miguel Perez Tolentino, Idalia Ramos, Jorge J. Santiago-Aviles, University of Puerto Rico at Humacao

Session WA2: Design, Simulation and Modeling
Chair: Daniel Amey, DuPont Microcircuit Materials
9 am – 10:20 am

Material Selection for Ceramic T/R Module Packages
Reiichi Yamada, Andrew Piloto, Ed Graddy, Gerardo Aguirre, Mark Eblen, Arne Knudsen, Kyocera America, Inc.

Designing with LTCC in High Frequency Applications
Timothy P. Mobley, Daniel Amey, DuPont Microcircuit Materials

High-Performance Co-Planar Ferrite Inductors for RF Applications
Michael D. Phillips, Raghu K. Settaluri, Chih-Hung Chang, Oregon State University

Novel Crosstalk Suppression Schemes Employing Magnetic Thin Films
Arien Sligar, Raghu K. Settaluri, Chih-Hung Chang, Oregon State University

Break: 10:20 am – 10:40 am

Session WA3: Ceramic Microsystems and Devices
Chair: Klaus-Dieter Lang, Fraunhofer IZM
10:40 am - Noon

LTCC Microfluidic System
Leszek J. Golonka, J. Radojewski, H. Roguszczak, M. Stefanow, T. Zawada, Wroclaw University of Technology

Meso-Scale Remote Plasma Generator using LTCC Technology
Roberto Katsuhiro Yamamoto, FATEC-SP/CEETEPS and LSI/PSI/USP, Patrick Bernard Verdonck - LSI/PSI/USP; Mário Ricardo Gongora-Rubio – IPT

Micro-Channel Device in LTCC
Amy J. Moll, John M. Youngsman, Donald G. Plumlee, Boise State University

Processing of Ceramic Microparts via Low-Pressure Injection Molding
Marcus Müller, Werner Bauer, Hans-Joachim Ritzhaupt-Kleissl, Forschungszentrum Karlsruhe, Institut für Materialforschung III

Session WA4: Characterizing Materials Integration Effects
Chair: Daniel Krueger, Honeywell FM&T
10:40 am – Noon

Characterization of Dielectrics and Conductors for Ceramic Microsystems at Microwave Frequency
Michael T. Lanagan, L. Haney, S. Perini, K. Rajab, E. Semouchkina, The Pennsylvania State University

Materials Compatibility issues in LTCC Technology and their Effects on Structure and Electrical Properties
Hansu Birol, T. Maeder, C. Jacq, P. Ryser, Swiss Federal Institute of Technology

Sintering Behavior of LTCC and Influence of Silver on the Sintering Behavior
Dragan Tramosljika, Joerg Schaefer, Robert Bosch GmbH (AE/WZK); Georg Rixecker, Fritz Aldinger, Max Planck Institute

Study on the Interfacial Reaction between Silver Electrode and La-Si-B-O-mullite Glass Ceramics
Yu Ju Wang, Wen-Cheng J. Wei, National Taiwan University

Lunch in Exhibit Hall: Noon – 1 pm

Keynote Presentation: 1 pm – 1:55 pm
Title: Next-Generation Microsystems: Integration Technologies and Opportunities for Ceramics
Speaker: Duane Dimos, Sandia National Laboratories

Session WP1: Ceramics: The Microsystem Device Enabler
Chair: Paul Clem, Sandia National Laboratories
2 pm – 3:20 pm

LTCC Wet Chemical Analysis Meso-Systems
Núria Ibáñez-García, Alonso Chamarro, Julián Mendes da Rocha, Mario Zaira Gongora-Rubio, University Autonomous of Barcelona

Development of Microfluidic Devices using LTCC Substrates
Roberto Eduardo Bruzetti Leminski, Eliphas Wagner Simões, Rogerio Furlan, Idalia Ramos, Mário Ricardo Gongora-Rubio, Nilton Itiro Morimoto, J. J. Santiago-Aviles, Universidade de São Paulo

Hot-Plate Gas Sensors - Are Ceramics Better?
Kita Jaroslaw, Frank Rettig, Ralf Moos, University of Bayreuth; Karl-Heinz Drüe, Heiko Thust, Technical University of Ilmenau

A Comparative Study of Technology and Architecture for Actuators realized with PZT Layers in LTCC Structures
Darko Belavic, Marko Hrovat, Janez Holc, Marija Kosec, Barbara Malic, Marina Santo Zarnik, Sivo Drnovšek, Jena Cilensek , HIPOT-R&D and Jozef Stefan Institute

Session WP2: Ink Jet Printing Technology
Chairs: Veena Tikare, Sandia National Laboratories; Tom Swiler, Sandia National Laboratories
2 pm – 3:20 pm

Ink Jet Printing and Sintering PZT
Brian Derby, Tianming Wang, University of Manchester

DoD-Printing of Conductive Silver Tracks
Dominik Cibis, Klaus Krueger, Prof. Dr.-Ing., Helmut-Schmidt University

Break: 3:20 pm – 3:40 pm

Session WP3: Microsystem Materials and Fabrication
Chair: Dean Anderson, TRS Ceramics, Inc. and The Pennsylvania State University
3:40 pm – 5 pm

Via Formation in LTCC Tape: A Comparison of Technologies
Klaus-Jurgen Wolter, Dresden University of Technology; Gunter Hagen, KMS Kemmer Technology Center - Dresden

Direct-Write Laser Exposure of Photosensitive Conductive Inks using Shaped-Beam Optics
Scott S. Corbett, Jeff Strole, Wilson Lu, MicroConnex; Edward Swenson, ElectroScientific Industries

High-Volume Print Forming, HVPF™ - A New Method for Manufacturing Large Volumes of ComplexMetal-Ceramic and Hybrid Components
Arthur L. Chait, EoPlex Technologies, Inc.

Cold Low Pressure Lamination of Structured Ceramic Green Tapes
Andreas Roosen, Karin Schindler, University of Erlangen – Nuremberg

Closing Remarks: 5 pm – 5:10 pm


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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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