Members Only
Events Calendar
Online Store
Global Business Council
Industry News
IMAPS Microelectronics Foundation
Contact Us

Advance Program
download pdf

IMAPS/ACerS International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies

April 24-27, 2006
Grand Hyatt Hotel
Denver, Colorado USA

Early Registration Discount Ends: March 25, 2006
Hotel Cut-off: March 25, 2006

General Co-Chairs:
Technical Program Co-Chairs:

Kevin G. Ewsuk
Sandia National Laboratories

Michael Ehlert
Barry Industries, Inc.

Christian Hoffman

Michael Lanagan
Penn State University

Program At-A-Glance
Welcome Reception

Monday, April 24
Registration: 4:00 pm – 7:00 pm

Welcome Reception: 6:00 pm – 7:00 pm

Tuesday, April 25
Registration: 7:00 am – 5:30 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 7:00 pm

Opening Remarks: 8:15 am – 8:30 am
Conference Chairs

Keynote Presentations: 8:30 am – 9:00 am
Title: MEMS Technologies for Single-Chip RF Front Ends
Speaker: Clark Nguyen, University of Michigan

Keynote Presentations: 9:00 am – 9:30 am
Title: New Applications in Implantable Medical Devices
Speaker: Joyce Yamamoto, Medtronic

Keynote Presentations: 9:30 am – 10:00 am
Title: A Specialist Manufacturer's Outlook on the Future of Ceramics and Ceramic Microsystems
Speaker: Franz Bechtold, Via Electronics

Break in Exhibit Hall: 10:00 am – 10:30 am
Session TA1:
Materials and Processes for Microsystems
Chairs: Dan Krueger, Honeywell; Heiko Thust, Technical University of Illmenau
10:30 am – 12:10 pm

Session TA2:
Co-Firing Processes and Dimensional Control in LTCC
Chair: Weiming Zhang, Heraeus Microcircuits
10:30 am – 12:10 pm

Computer-Aided Design and Processing of 3D Microceramic Structures
Yoshinari Miyamoto, Soshu Kiriahra, Hideaki Kanaoka, Keitarou Hino, Osaka University

Fabrication of a Three-Dimensional Terahertz Wave Photonic Crystals by Assembling Monosized Spherical Particles
Akira Kawasaki, Kenta Takagi, Tohoku University

Synthesis of 10-µm-Thick Lead Zirconate Titanate Films on 2 Inch Si Substrates for Piezoelectric Film Devices
Takashi Iijima, Satoko Osone, Yoshiro Shimojo, Hideki Nagai, National Institute of Advanced Industrial Science and Technology (AIST)

MEMS Ultrasonic Sensor Array with Thick Film PZT Transducers
Soeren Hirsch, University of Magdeburg

An Investigation of Piezoelectric Properties of the Thick-Film PZT Actuators on Ceramic Substrates
Darko Belavic, Marina Santo Zarnik, Janez Holc, Marko Hrovat, Marija Kosec, Silvo Drnovsek, Jena Cilensek, Srecko Macek, Jozef Stefan Institute

Hot Embossing - An Alternative Method to Produce Cavities in Ceramic Multilayer
Torsten Rabe, Martin Schmidt, Petra Kuchenbecker, Baerbel Schulz, Federal Institute for Materials Research and Testing

Development of Self-Constrained LTCC Structures
Tom Hochheimer, Frans Lautzenhiser, Weiming Zhang, Heraeus TFD

Factors Influencing the Shrinkage Tolerance of LTCC Green Tapes
Georg Besendörfer, Andreas Roosen, University of Erlangen-Nuremberg; Christina Modes, W.C. Heraeus GmbH;Thomas Betz, Kerafol GmbH

Discontinuous Sinter-Forging of a Glass-Ceramic Composite used in LTCC Technology
Jean-Baptiste Ollagnier, Jürgen Rödel, Darmstadt University of Technology

Liquid Phases in LTCC – Key to Tailored Materials
Markus Eberstein, Torsten Rabe, Wolfgang.A. Schiller, Federal Institute for Materials Research and Testing (BAM)

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm
Session TP1: Microsystems Applications I
Chairs: W. Kinzy Jones, Florida International University; S. (Krish) Krishnamoorthy, CFD Research Corporation
1:20 pm – 3:00 pm

Session TP2: Processing and Design of Integrated Passives in LTCC I
Chair: Tim Mobley, DuPont
1:20 pm – 3:00 pm

Development of an LTCC Based Small Combustor
Jorge J. Santiago-Avilés, Rogerio Furlan, Patricio Espinoza-Vallejos, Miguel Perez-Tolentino, University of Pennsylvania

Development of a Multi-Channel Electron Multiplier using a LTCC / Thick Silver Cofired Structure
Feng Zhang, W. Kinzy Jones, Florida International University

LTCC-Based Microthrusters for Nanosatellite Propulsion
Kamlesh D. Patel, Kenneth A. Peterson, Robert W. Crocker, Sandia National Laboratory

Fabrication of a Monopropellant Micro-Nozzle using Low Temperature Co-Fired Ceramics
Matthew McCrink, D. G. Plumlee, A. J. Moll, Boise State University; J. Steciak, University of Idaho

High Power LED Package Based on LTCC
Byeung Gyu Chang, Ki Pyo Hong, Sung Yeol Park, Seung Gyo Jeong , Jung Kyu Park, Samsung Electro-Mechanics

Increased Usage of Integrated Passive Components in Low Temperature Co-Fired Ceramic (LTCC) for the Microelectronic Industry
Steve Annas, Paul Alpers, Natel Engineering Company, Inc.

Aerosol Deposition Process as Room-Temperature Fabrication Technology for Integrated RF Modules
Takaaki Tsurumi, Song-Min Nam, Mihoko Momotani, Hirofumi Kakemoto, Satoshi Wada, Tokyo Institute of Technology; Jun Akedo, National Institute of Advanced Industrial Science and Technology

Physical Model Based Design Optimization for LTCC RF Inductors
Jens Mueller, Rubén Perrone, Technical Univ. of Ilmenau, ZIK MacroNano

Soft Magnetic Properties of Fe/Ni-Zn-Cu-ferrite Film by Aerozol Deposition
Seiich Miyai, Kaoru Kobyashi, Satoshi Sugimoto, Jun Akedo, Sony Corporation

Novel Through-Ground Via Models for the Design of Multilayered Compact Passives
Raghu K. Settaluri, Oregon State University

Break in Exhibit: 3:00 pm – 3:30 pm
Session TP3: Novel Synthesis Technology for Multilayer Electronics I
Chairs: David Cann, Oregon State University; Jun Akedo, Advanced Manufacturing Research Institute
3:30 pm – 5:30 pm

Session TP4: Processing and Design of Integrated Passives in LTCC II
Chairs: Torsten Rabe, Federal Institute for Materials Research and Testing; Klaus-Dieter Lang, Fraunhofer IZM
3:30 pm – 5:30 pm

Micro-Patterning of PZT Thin Films with Oxide Electrode by using Self-Assembled Monolayer
Hisao Suzuki, Tatsuo Fujinami, Shizuoka University; Hidetoshi Miyazaki, Shimane University

Low Temperature Growth of Epitaxial Pb(Zi,Ti)O3 Film on Various Substrates by Excimer Laser-Assisted Metal Organic Deposition(ELAMOD)
Tetsuo Tsuchiya, K. Daoudi, T. Manabe, I. Yamabuchi, T. Kumagai, S. Mizuta, National Institute of Advanced Industrial Science and Technology (AIST)

Origin of Ultrahigh Dielectric Constants for Barium Titanate Nanoparticles
Satoshi Wada, Takuya Hoshina, Kayo Takizawa, Aki Yazawa, Masanori Ohishi, Hiroaki Yasuno, Hirofumi Kakemoto, Takaaki Tsurumi, Tokyo Institute of Technology

Lead Lanthanum Zirconate Titanate Thin Films on Low Cost Cu Foil Substrates for Dielectric and Ferroelectric Applications
Taeyun Kim, Angus I. Kingon, North Carolina State University

Atomic Layer Deposition-Based Ceramic Coating for Wafer-Level MEMS Packaging
Y. C. Lee, Markus Groner, University of Colorado

Centrifugal Sintering of Thick Film on Substrate
Koji Watari, Yoshiaki Kinemuchi, National Institute of Advanced Industrial Science and Technology; Hirohide Ishiguro, Sinto V-Cerax

Cofiring of Integrated Ferrite/Dielectric Ceramic Passives
Jau-Ho Jean, Te-Ming Peng, Rung-Tsung Hsu, National Tsing Hua University; S.C. Lin, ACX Corp.

Soft Ferrite Materials for Multilayer Inductors
Jörg Töpfer, J. Mürbe, A. Angermann. S. Barth, E. Müller, F. Bechtold, FH Jena

A Front End Module and a Filter using LTCC Technology with Heterogeneous Dielectrics
Jun Chul Kim, Dongsu Kim, Hyun Min Cho, Nam kee Kang, Jong Chul Park, Korea Electronics Technology Institute

Cofiring Behavior of Low-Temperature Sintering Composite Multilayer Ceramic Devices
Zhilun Gui, Hong Cai, Longtu Li, Tsinghua University

Study on Densification Behavior of Low-Temperature Co-Firing Ceramics
Longtu Li, Zhenxing Yue, Ruzhong Zuo, Zhilun Gui, Tsinghua University

Factors Influencing the Conductivity of Inkjet Printed Silver Lines
Ulrike Currle, Klaus Krueger, Helmut-Schmidt-University

Reception in Exhibit Hall: 5:30 pm – 7:00 pm

Wednesday, April 26
Registration: 7 am – 5 pm

Continental Breakfast: 7 am – 8 am

Exhibit Hours: 10:00 am – 4:00 pm

Session WA1: International Session on Microsystems
Chair: Dean Anderson, Penn State University
8:30 am – 10:00 am

Novel LTCC System of Co-Fired Low-e /High-e Materials for Wireless Communications
Yukio Sakabe, Jun Harada, Yasutaka Sugimoto, Yukio Higuchi, Murata Manufacturing Co. Ltd.

Is LTCC a Good Choice for RF Modules?
Neal Mellen, TDK R&D Corporation

New LTCC Technology with Integrated Components - 'Developments and Future Trends’ - Module Miniaturization for Wireless Network Applications
Chihiro Makihara, Kyocera Corporation

Break in Exhibit Hall: 10:00 am – 10:30 am
Session WA2: Microsystem Applications II
Chairs: Amy Moll, Boise State University; Jens Mueller, Technical Univ. of Ilmenau, ZIK MacroNano
10:30 am – 12:10 pm

Session WA3: Direct Write Technology
Chair: Paul Clem, Sandia National Laboratories
10:30 am – 12:10 pm

Three-Dimensional Fluidic Microsystem Fabricated in Low Temperature Cofire Ceramic Technology
Leszek J. Golonka, T. Zawada, H. Roguszczak, K. Malecha, M. Chudy, D. Stadnik, A. Dybko, Wroclaw University of Technology

LTCC Packaging for Bio-Application's Demands
Lars Rebenklau, G. Schlottig, J. Uhlemann, G. Vollmer, K.-J. Wolter, Dresden University of Technology

Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow Sensing
Clifford K. Ho, Kenneth A. Peterson, Lucas K. McGrath, Timothy S. Turner, Sandia National Laboratories

Miniature Multi-Electrode Electrochemical Cell in LTCC
John Youngsman, Scott Wolter, Jeff Glass, Amy Moll, Boise State University

LTCC Microsystems and Microsystem Packaging and Integration Applications
Ken A. Peterson, K. D. Patel, C. K. Ho, B. R. Rohrer, C. D. Nordquist, B. D. Wroblewski, K. B. Pfeifer, Sandia National Laboratories

Fabrication of Conductors and Inductors by Nano-Particle Deposition through Direct Write Technology
James W. Sears, Jacob Colvin, Michael Carter, South Dakota School of Mines & Technology

Direct Thick Film Writing for Advanced Microsystem Applications
William J. Grande, OhmCraft Inc.

Direct Writing of Multimaterial Three Dimensional Structures
Jim Smay, Oklahoma State University

Direct-Write Approaches to Fabrication and Precision Printing at Sandia National Laboratories
Joe Cesarano, Sandia National Laboratories

Impact of Conductor Cross-Sectional Shape on Component Performance and Total Losses in a Microsystem
Michele H. Lim, J. D. van Wyk, Zhenxian Liang, Virginia Polytechnic Institute and State University

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm
WP1: Microsystem Materials and Processes
Chairs: Ken Peterson, Sandia National Laboratories; Larry Zawicki, Honeywell
1:20 pm – 3:00 pm

Session WP2: High Frequency Characterization
Chairs: Michael Janezic, NIST – Boulder; Raghu Settaluri, Oregon State University
1:20 pm – 3:00 pm

Dielectric Characterization of Dielectric Ceramic Materials using Terahertz Time-Domain Spectroscopy
Khalid Z. Rajab, Steve Perini, Joe Dougherty, Michael Lanagan, The Pennsylvania State University; Matsato Iwasaki, NGK Spark Plug Co., Ltd.

Design of a Dissolved Oxygen Microsensor using Low Temperature Co-fired Ceramics (LTCC)
Marcos Aparecido Chaves Ferreira, Antonio Carlos Seabra, Zaira Mendes da Rocha, LSI-PSI-EPUSP - University of São Paulo

Blood Flow System Fabricated using Low Temperature Co-Fired Ceramics (LTCC)
Eliphas Wagner Simões, Roberto Eduardo Bruzetti Leminski, Mário Ricardo Gongora-Rubio, Francisco Garcia Soriano, Lúcio Angnes, Rogerio Furlan, Marcelo Bariatto Andrade Fontes, Escola Politécnica da Universidade de São Paulo

LTCC Post Load Cell
Mário Ricardo Gongora-Rubio, Franco M. Roberti, Liliana Fraigi, Instituto de Pesquisas Tecnolgica (IPT); Zaira M. da Rocha, Instituto de Tecnologia Industrial (INTI) & CITEI

Fabrication of Reference Electrodes for LTCC Miniaturized Chemical Sensors
Zaira Mendes da Rocha, Marcos Aparecido Chaves Ferreira, Mario Ricardo Gongora Rubio, Antonio Carlos Seabra, LSI-PSI-EPUSP - University of São Paulo

Development of High Density Ceramic Substrate Tester
Bruce C. Kim, University of Alabama

3D Interconnection Technology for LTCC RF Modules up to 60 GHz
Rubén Perrone, Jens Müeller, Heiko Thust, Technical University of Ilmenau

Temperature-Dependent Permittivity Measurements of Low-Loss Dielectric Substrates using a Split-Cylinder Resonator
Michael D. Janezic, National Institute of Standards and Technology (NIST); B. Riddle, D. Amey, T. Mobley, DuPont

Full-Wave Analysis and Characterization of Via Grounding Techniques used To Isolate Striplines for Embedded Passive Interconnects
Jerry Aguirre, Paul Garland, Kyocera America, Inc.; Tim Mobley, DuPont Electronic Technologies; Marcos Vargas, Paula Lucchini, Nathan Roberts, Mikaya Lumori, Ernie Kim, University of San Diego

20 to 90GHz Broadband Characterization of LTCC Materials for Transceiver Modules and Integrated Antennas
Timothy P. Mobley, Michael Smith, DuPont Electronic Technologies; David Zimmerman, Michael Miller, Deepukumar Nair, Matthew Walsh, Delphi

WP3: Interactive Forum (Poster Session)
One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.
Chairs: Martin Oppermann, EADS Deutschland GmbH; Walter Rothlingshofer, Robert Bosch GmbH
3:00 pm – 5:00 pm

A Prototype Continuous Flow Polymerase Chain Reaction LTCC Device
Korey Moeller, J. Besecker, J. M. Hampikian, A. Moll, D. Plumlee, J. Youngsman, G. Hampikian, Boise State University

Magnetic Properties of Bi Substituted Garnet Thin Film on GGG(100) and (110) Substrate for MO Indicator
Daisuke Uematsu, N. Adachi,T.Ota,T. Okuda, T.Machi, N. Koshizuka, Nagoya Institute of Technology

Electrospun Hydroxyapatite Fibers Via Sol-Gel Routine using PVA as Precursor
Xiaoshu Dai, Satya Shivkumar, Worcester Polytechnic Institute

A New Approach to Zero Shrinkage LTCC
Yong Jun Seo, Yong S. Cho, Yonsei University

LTCC Technology - An Integration Solution for Power Electronics
Michele H. Lim, J. D. van Wyk, Zhenxian Liang, Virginia Polytechnic Institute and State University

Mechanical Properties and Morphology of Polyimide Films Filled with Barium Titanate
Jin-Hyun Hwang, Hiroki Maie, Burtrand I. Lee, Clemson University

Study of Laser Milling of Sintered LTCC, Quartz, and Pyrex Substrates for Meso and Micro Fluidic Applications
Rogerio Furlan, Jose Manuel Castillo Colon, Idalia Ramos, Jorge J. Santiago-Aviles, University of Puerto Rico at Humacao

Energy Scavenging Device in Low Temperature Co-Fired Ceramics
Sarah Scherrer, Boise State University

Fabrication of Microstructure in Transparent Materials using Femtosecond Laser Irradiation
Shingo Kanehira, J. Si, K. Miura, K. Fujita, K. Hirao, Kyoto University

High Temperature Raman Study of CVD Diamond Films
Jui-Chen Pu, Sea-Fue Wang and James C. Sung, National Taipei University of Technology

Effect of Re-Oxidation Firing on PTCR Properties of SM-Doped Barium Titanate Ceramics
Myoung-Pyo Chun, Jung-Ho Cho, Byung-Ik Kim, Korea Institute of Ceramics Engineering and Technology (KICET)

A Novel Process to Synthesize Hollow ZnO Particles using Bubbles as Templates
Yong Sheng Han, Li Wei Lin, Masayoshi Fuji, Minoru Takahashi, Hiroaki Takegami, Nagoya Institute of Technology

The Application of Artificial Neural Network to CalibrateMicro-Actuator
Y. B. Zhang, J. G. He, G. M. Liu, Z. M. Pan, T. Yang, Y. K. Fang, Institute of Machinery Manufacturing Technology

Effect of CuO on the Sintering Behavior and Dielectric Characteristics of Titanium Dioxide
Yeong-Kyeun Paek, Chang-Keun Shin, Andong National University – Korea

Fabrication of Micro Tubular SOFCs and their SOFC Performance in the Intermediate Temperature
Toshio Suzuki, National Institute of Advanced Industrial Science and Technology

Microstructure and Electrical Properties of Sputtered Ba(Sr)TiO3 Films: Dopant and Crystal Structure Effects
C. H. Wu, Jinn P. Chu, S. F. Wang, National Taiwan Ocean University

Advanced Fabrication Techniques for an Ion Mobility Spectrometer in Low Temperature Co-Fired Ceramics
Brian Jaques, H. Weston, D. G. Plumlee, A. J. Moll, Boise State University

Magnetic Domain Structure of NdFeB Thin Film on Si Substrate
Nobuyasu Adachi, Y. Isa, T. Yoshimura, T. Ota, I. Sakamoto, T. Okuda, Nagoya Institute of Technology

Fabrication of Barium Strontium Titanate Films Directly on Copper Electrodes by Aerosol Deposition Method for Multilayer Dielectric Devices
Jae-Hyuk Park, Sewoong Oh, Masakazu Mori, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

Ceramic Substrate with Hidden Heat Sources for Soldering of Electrical Components
Eli Meroz, Jacob David, Dan Har-Even, soreq NRC

Fabrication of a Multilayered Ceramic Micro-Plasma Generating Device
Amanda Baker, Clive Randall, The Pennsylvania State University; Randall Stewart, Richard Fantazier, R D imagetech, Inc.; Fred Wise, Wise Electronic Systems, Inc.

Thursday, April 27
Registration: 7:30 am – Noon

Continental Breakfast: 7:30 am – 8:20 am

Session THA1: International Session on Microsystems
Chairs: Dave Wilcox, Consultant; Leszek Golonka, Wroclaw University
8:20 am – 9:50 am

An Overview of LTCC-Related Technologies in Korea
Yong S. Cho, Yonsei University; Jun Chul Kim, Nam Kee Kang, Korea Electronics Technology Institute

LTCC an Enabling Technology for RF-, Microwave, Bio- and Chemical Systems
Jens Mueller, Rubén Perrone, Sven Rentsch, Torsten Thelemann, Michael Hinz, Andreas Schober, Thomas Friedrich, Technical Univ. of Ilmenau, ZIK MacroNano; Dieter Schwanke, Thomas Haas, MSE GmbH & Co.; Lars Rebenklau, TU Dresden

LTCC Toolbox for Photonic Integration
Pentti Karioja, Kimmo Keränen, Kari Kautio, Jyrki Ollila, Jukka-Tapani Mäkinen, Kari Kataja, Pentti Korhonen, Mikko Karppinen, Veli Heikkinen, Teemu Alajoki, Antti Tanskanen, Juhani Heilala, VTT (Technical Research Center of Finland)

Break: 9:50 am – 10:20 am
Session THA2: Novel Synthesis Technology for Multilayer Electronics II - Aerosol Deposition
Chair: Yong Cho, Yonsei University
10:20 am - Noon

Room Temperature Impact Consolidation (R.T.I.C.) of Ceramic Fine Powder on Aerosol Deposition
Jun Akedo, Hisato Ogiso, National Institute of Advanced Industrial Science & Technology

Embedded Capacitor Technology on Printed Wiring Board using Aerosol Deposition
Yoshihiko Imanaka, Nobuyuki Hayashi, Masatoshi Takenouchi, Jun Akedo, Fujitsu Limited

Aerosol Deposition Fabrication of Transparent Electro-Optic Films for Optical Modulator
Masafumi Nakada, Keishi Ohashia, Hiroki Tsudab, Jun Akedo, NEC

Preparation of Thick Magnetic Garnet Films with Aerozol Deposition Method and their Magnetic Properties
Mitsuteru Inoue, Masahiko Mizoguchi, Pan Boey Lim, Hironaga Uchida, Toyohashi University of Technology

Multilayer Construction with Various Ceramic Films for Electronic Devices Fabricated by Aerosol Deposition
Hironori Hatono, Tomokazu Ito, Kengo Iwata, Toto Ltd.; Jun Akedo, Advanced Manufacturing Research Institute

Closing Remarks: Noon

Housing (Hotel Cut-off is March 25, 2006)
Housing Accommodations must be made directly to:

Grand Hyatt Denver Hotel
1750 Welton Street
Denver, Colorado 80202
Phone: 303-295-1234 or 800-233-1234
When making reservation by phone, please reference IMAPS.


Single/Double $179
A deposit for the first night's room and tax is required to hold your room. Deposit
refunded if reservation is cancelled more than 72 hours prior to arrival.

Super Shuttle Coupon

Register On-Line


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>