|
IMAPS/ACerS
International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies (CICMT)
April
24-27, 2006
Grand Hyatt Hotel
Denver, Colorado USA
Early Registration Discount Ends: March
25, 2006
Hotel Cut-off: March 25, 2006
General
Co-Chairs: |
Technical
Program Co-Chairs: |
|
|
|
|
Monday,
April 24
Registration:
4:00 pm – 7:00 pm
Welcome
Reception: 6:00 pm – 7:00 pm
Tuesday, April 25
Registration:
7:00 am – 5:30 pm
Continental
Breakfast: 7:00 am – 8:00 am
Exhibit
Hours: 10:00 am – 7:00 pm
Opening
Remarks: 8:15 am – 8:30 am
Conference Chairs |
Keynote Presentations: 8:30 am – 9:00 am
Title: MEMS Technologies for Single-Chip RF Front Ends
Speaker: Clark Nguyen, University of Michigan
Keynote
Presentations: 9:00 am – 9:30 am
Title: New Applications in Implantable Medical Devices
Speaker: Joyce Yamamoto, Medtronic
Keynote
Presentations: 9:30 am – 10:00 am
Title: A Specialist Manufacturer's Outlook on the Future of Ceramics and Ceramic
Microsystems
Speaker: Franz Bechtold, Via Electronics |
| Break
in Exhibit Hall: 10:00 am – 10:30 am |
Session
TA1:
Materials and Processes for Microsystems
Chairs: Dan Krueger, Honeywell; Heiko
Thust, Technical University of Illmenau
10:30 am – 12:10 pm
|
Session
TA2:
Co-Firing Processes and Dimensional
Control in LTCC
Chair: Weiming Zhang, Heraeus Microcircuits
10:30 am – 12:10 pm
|
Computer-Aided Design and Processing
of 3D Microceramic Structures
Yoshinari Miyamoto, Soshu Kiriahra, Hideaki
Kanaoka, Keitarou Hino, Osaka University
Fabrication of a Three-Dimensional Terahertz
Wave Photonic Crystals by Assembling Monosized
Spherical Particles
Akira Kawasaki, Kenta Takagi, Tohoku University
Synthesis
of 10-µm-Thick Lead Zirconate
Titanate Films on 2 Inch Si Substrates
for Piezoelectric Film Devices
Takashi Iijima, Satoko Osone, Yoshiro Shimojo,
Hideki Nagai, National Institute of Advanced
Industrial Science and Technology (AIST)
MEMS Ultrasonic Sensor Array with Thick
Film PZT Transducers
Soeren Hirsch, University of Magdeburg
An Investigation of Piezoelectric Properties
of the Thick-Film PZT Actuators on Ceramic
Substrates
Darko Belavic, Marina Santo Zarnik, Janez
Holc, Marko Hrovat, Marija Kosec, Silvo
Drnovsek, Jena Cilensek, Srecko Macek,
Jozef Stefan Institute
|
Hot Embossing -
An Alternative Method to Produce Cavities
in Ceramic Multilayer
Torsten Rabe, Martin Schmidt, Petra Kuchenbecker,
Baerbel Schulz, Federal Institute for Materials
Research and Testing
Development of Self-Constrained LTCC Structures
Tom Hochheimer, Frans Lautzenhiser, Weiming
Zhang, Heraeus TFD
Factors Influencing the Shrinkage Tolerance
of LTCC Green Tapes
Georg Besendörfer, Andreas Roosen, University
of Erlangen-Nuremberg; Christina Modes, W.C.
Heraeus GmbH;Thomas Betz, Kerafol GmbH
Discontinuous Sinter-Forging of a Glass-Ceramic
Composite used in LTCC Technology
Jean-Baptiste Ollagnier, Jürgen Rödel,
Darmstadt University of Technology
Liquid
Phases in LTCC – Key to Tailored
Materials
Markus Eberstein, Torsten Rabe, Wolfgang.A.
Schiller, Federal Institute for Materials
Research and Testing (BAM)
|
Lunch
in Exhibit Hall: 12:10 pm – 1:20
pm
|
Session
TP1: Microsystems Applications I
Chairs: W. Kinzy Jones, Florida International
University; S. (Krish) Krishnamoorthy, CFD
Research Corporation
1:20 pm – 3:00 pm
|
Session
TP2: Processing
and Design of Integrated Passives in
LTCC I
Chair: Tim Mobley, DuPont
1:20 pm – 3:00 pm
|
Development
of an LTCC Based Small Combustor
Jorge J. Santiago-Avilés, Rogerio
Furlan, Patricio Espinoza-Vallejos, Miguel
Perez-Tolentino,
University of Pennsylvania
Development of a Multi-Channel Electron
Multiplier using a LTCC / Thick Silver Cofired
Structure
Feng Zhang, W. Kinzy Jones, Florida International
University
LTCC-Based Microthrusters for Nanosatellite
Propulsion
Kamlesh D. Patel, Kenneth A. Peterson, Robert
W. Crocker, Sandia National Laboratory
Fabrication of a Monopropellant Micro-Nozzle
using Low Temperature Co-Fired Ceramics
Matthew McCrink, D. G. Plumlee, A. J. Moll,
Boise State University; J. Steciak, University
of Idaho
High Power LED Package Based on LTCC
Byeung Gyu Chang, Ki Pyo Hong, Sung Yeol
Park, Seung Gyo Jeong , Jung Kyu Park,
Samsung Electro-Mechanics |
Increased Usage of Integrated
Passive Components in Low Temperature Co-Fired
Ceramic (LTCC) for the Microelectronic Industry
Steve Annas, Paul Alpers, Natel Engineering
Company, Inc.
Aerosol Deposition Process as Room-Temperature
Fabrication Technology for Integrated RF
Modules
Takaaki Tsurumi, Song-Min Nam, Mihoko Momotani,
Hirofumi Kakemoto, Satoshi Wada, Tokyo
Institute of Technology; Jun Akedo, National
Institute of Advanced Industrial Science
and Technology
Physical Model Based Design Optimization
for LTCC RF Inductors
Jens Mueller, Rubén Perrone, Technical
Univ. of Ilmenau, ZIK MacroNano
Soft Magnetic Properties of Fe/Ni-Zn-Cu-ferrite
Film by Aerozol Deposition
Seiich Miyai, Kaoru Kobyashi, Satoshi Sugimoto,
Jun Akedo, Sony Corporation
Novel Through-Ground Via Models for the
Design of Multilayered Compact Passives
Raghu K. Settaluri, Oregon State University
|
Break
in Exhibit: 3:00 pm – 3:30 pm
|
Session
TP3: Novel Synthesis Technology for Multilayer
Electronics I
Chairs: David Cann, Oregon State University;
Jun Akedo, Advanced Manufacturing Research
Institute
3:30 pm – 5:30 pm
|
Session
TP4: Processing and Design of Integrated
Passives in LTCC II
Chairs: Torsten Rabe, Federal Institute for
Materials Research and Testing; Klaus-Dieter
Lang, Fraunhofer IZM
3:30 pm – 5:30 pm
|
Micro-Patterning of PZT Thin Films with Oxide
Electrode by using Self-Assembled Monolayer
Hisao Suzuki, Tatsuo Fujinami, Shizuoka University;
Hidetoshi Miyazaki, Shimane University
Low Temperature Growth of Epitaxial Pb(Zi,Ti)O3
Film on Various Substrates by Excimer Laser-Assisted
Metal Organic Deposition(ELAMOD)
Tetsuo Tsuchiya, K. Daoudi, T. Manabe,
I. Yamabuchi, T. Kumagai, S. Mizuta, National
Institute of Advanced Industrial Science
and Technology (AIST)
Origin of Ultrahigh Dielectric Constants
for Barium Titanate Nanoparticles
Satoshi Wada, Takuya Hoshina, Kayo Takizawa,
Aki Yazawa, Masanori Ohishi, Hiroaki Yasuno,
Hirofumi Kakemoto, Takaaki Tsurumi, Tokyo
Institute of Technology
Lead Lanthanum Zirconate Titanate Thin
Films on Low Cost Cu Foil Substrates for
Dielectric and Ferroelectric Applications
Taeyun Kim, Angus I. Kingon, North Carolina
State University
Atomic Layer Deposition-Based Ceramic
Coating for Wafer-Level MEMS Packaging
Y. C. Lee, Markus Groner, University of
Colorado
Centrifugal Sintering of Thick Film on
Substrate
Koji Watari, Yoshiaki Kinemuchi, National
Institute of Advanced Industrial Science
and Technology; Hirohide Ishiguro, Sinto
V-Cerax
|
Cofiring
of Integrated Ferrite/Dielectric Ceramic
Passives
Jau-Ho Jean, Te-Ming Peng, Rung-Tsung Hsu,
National Tsing Hua University; S.C. Lin, ACX
Corp.
Soft Ferrite Materials for Multilayer Inductors
Jörg Töpfer, J. Mürbe, A.
Angermann. S. Barth, E. Müller, F. Bechtold,
FH Jena
A Front End Module and a Filter using LTCC
Technology with Heterogeneous Dielectrics
Jun Chul Kim, Dongsu Kim, Hyun Min Cho, Nam
kee Kang, Jong Chul Park, Korea Electronics
Technology Institute
Cofiring Behavior of Low-Temperature Sintering
Composite Multilayer Ceramic Devices
Zhilun Gui, Hong Cai, Longtu Li, Tsinghua
University
Study on Densification Behavior of Low-Temperature
Co-Firing Ceramics
Longtu Li, Zhenxing Yue, Ruzhong Zuo, Zhilun
Gui, Tsinghua University
Factors Influencing the Conductivity of
Inkjet Printed Silver Lines
Ulrike Currle, Klaus Krueger, Helmut-Schmidt-University
|
Reception
in Exhibit Hall: 5:30 pm – 7:00 pm
Wednesday, April 26
Registration:
7 am – 5 pm
Continental
Breakfast: 7 am – 8 am
Exhibit
Hours: 10:00 am – 4:00 pm
|
Session WA1:
International Session on Microsystems
Chair: Dean Anderson, Penn State University
8:30 am – 10:00 am
|
Novel LTCC System
of Co-Fired Low-e /High-e Materials for Wireless
Communications
Yukio Sakabe, Jun Harada, Yasutaka Sugimoto,
Yukio Higuchi, Murata Manufacturing Co. Ltd.
Is LTCC a Good Choice for RF Modules?
Neal Mellen, TDK R&D Corporation
New LTCC
Technology with Integrated Components -
'Developments and
Future Trends’ -
Module Miniaturization for Wireless Network
Applications
Chihiro Makihara, Kyocera Corporation
|
| Break
in Exhibit Hall: 10:00 am – 10:30 am |
Session
WA2: Microsystem Applications II
Chairs: Amy Moll, Boise State University; Jens
Mueller, Technical Univ. of Ilmenau, ZIK MacroNano
10:30 am – 12:10 pm
|
Session WA3: Direct Write
Technology
Chair: Paul Clem, Sandia National Laboratories
10:30 am – 12:10 pm
|
Three-Dimensional
Fluidic Microsystem Fabricated in Low Temperature
Cofire Ceramic Technology
Leszek J. Golonka, T. Zawada, H. Roguszczak,
K. Malecha, M. Chudy, D. Stadnik, A. Dybko,
Wroclaw University of Technology
LTCC Packaging for Bio-Application's Demands
Lars Rebenklau, G. Schlottig, J. Uhlemann,
G. Vollmer, K.-J. Wolter, Dresden University
of Technology
Development of LTCC Smart Channels for Integrated
Chemical, Temperature, and Flow Sensing
Clifford K. Ho, Kenneth A. Peterson, Lucas
K. McGrath, Timothy S. Turner, Sandia National
Laboratories
Miniature Multi-Electrode Electrochemical
Cell in LTCC
John Youngsman, Scott Wolter, Jeff Glass,
Amy Moll, Boise State University
LTCC Microsystems and Microsystem Packaging
and Integration Applications
Ken A. Peterson, K. D. Patel, C. K. Ho, B.
R. Rohrer, C. D. Nordquist, B. D. Wroblewski,
K. B. Pfeifer, Sandia National Laboratories |
Fabrication of Conductors and Inductors
by Nano-Particle Deposition through Direct
Write Technology
James W. Sears, Jacob Colvin, Michael Carter,
South Dakota School of Mines & Technology
Direct Thick Film Writing for Advanced
Microsystem Applications
William J. Grande, OhmCraft Inc.
Direct Writing of Multimaterial Three
Dimensional Structures
Jim Smay, Oklahoma State University
Direct-Write Approaches to Fabrication
and Precision Printing at Sandia National
Laboratories
Joe Cesarano, Sandia National Laboratories
Impact of Conductor Cross-Sectional Shape
on Component Performance and Total Losses
in a Microsystem
Michele H. Lim, J. D. van Wyk, Zhenxian
Liang, Virginia Polytechnic Institute and
State University
|
| Lunch
in Exhibit Hall: 12:10 pm – 1:20 pm |
WP1:
Microsystem Materials and Processes
Chairs: Ken Peterson, Sandia National Laboratories;
Larry Zawicki, Honeywell
1:20 pm – 3:00 pm
|
Session WP2: High Frequency
Characterization
Chairs: Michael Janezic,
NIST – Boulder;
Raghu Settaluri, Oregon State University
1:20 pm – 3:00 pm
|
| Dielectric
Characterization of Dielectric Ceramic
Materials using Terahertz Time-Domain Spectroscopy
Khalid
Z. Rajab, Steve Perini, Joe Dougherty,
Michael Lanagan, The Pennsylvania State
University;
Matsato Iwasaki, NGK Spark Plug Co., Ltd.
Design of a Dissolved Oxygen Microsensor
using Low Temperature Co-fired Ceramics (LTCC)
Marcos Aparecido Chaves Ferreira, Antonio
Carlos Seabra, Zaira Mendes da Rocha, LSI-PSI-EPUSP
- University of São Paulo
Blood Flow System Fabricated using Low Temperature
Co-Fired Ceramics (LTCC)
Eliphas Wagner Simões, Roberto Eduardo
Bruzetti Leminski, Mário Ricardo Gongora-Rubio,
Francisco Garcia Soriano, Lúcio Angnes,
Rogerio Furlan, Marcelo Bariatto Andrade
Fontes, Escola Politécnica da Universidade
de São Paulo
LTCC Post Load Cell
Mário Ricardo Gongora-Rubio, Franco
M. Roberti, Liliana Fraigi, Instituto de
Pesquisas Tecnolgica (IPT); Zaira M. da Rocha,
Instituto de Tecnologia Industrial (INTI) & CITEI
Fabrication of Reference Electrodes for
LTCC Miniaturized Chemical Sensors
Zaira Mendes da Rocha, Marcos Aparecido Chaves
Ferreira, Mario Ricardo Gongora Rubio, Antonio
Carlos Seabra, LSI-PSI-EPUSP - University
of São Paulo |
Development of High Density Ceramic Substrate
Tester
Bruce C. Kim, University of Alabama
3D Interconnection Technology for LTCC
RF Modules up to 60 GHz
Rubén Perrone, Jens Müeller,
Heiko Thust, Technical University of Ilmenau
Temperature-Dependent Permittivity Measurements
of Low-Loss Dielectric Substrates using
a Split-Cylinder Resonator
Michael D. Janezic, National Institute
of Standards and Technology (NIST); B.
Riddle, D. Amey, T. Mobley, DuPont
Full-Wave Analysis and Characterization
of Via Grounding Techniques used To Isolate
Striplines for Embedded Passive Interconnects
Jerry Aguirre, Paul Garland, Kyocera America,
Inc.; Tim Mobley, DuPont Electronic Technologies;
Marcos Vargas, Paula Lucchini, Nathan Roberts,
Mikaya Lumori, Ernie Kim, University of
San Diego
20 to 90GHz Broadband Characterization
of LTCC Materials for Transceiver Modules
and Integrated Antennas
Timothy P. Mobley, Michael Smith, DuPont
Electronic Technologies; David Zimmerman,
Michael Miller, Deepukumar Nair, Matthew
Walsh, Delphi
|
WP3:
Interactive Forum (Poster Session)
One-on-One Interactive Forum. This is your
chance for detailed interaction with authors
whose work is too good to miss.
Chairs: Martin Oppermann, EADS Deutschland
GmbH; Walter Rothlingshofer, Robert Bosch
GmbH
3:00 pm – 5:00 pm |
| A Prototype Continuous Flow Polymerase Chain
Reaction LTCC Device
Korey Moeller, J. Besecker, J. M. Hampikian,
A. Moll, D. Plumlee, J. Youngsman, G. Hampikian,
Boise State University
Magnetic Properties of Bi Substituted Garnet
Thin Film on GGG(100) and (110) Substrate
for MO Indicator
Daisuke Uematsu, N. Adachi,T.Ota,T. Okuda,
T.Machi, N. Koshizuka, Nagoya Institute of
Technology
Electrospun Hydroxyapatite Fibers Via Sol-Gel
Routine using PVA as Precursor
Xiaoshu Dai, Satya Shivkumar, Worcester Polytechnic
Institute
A New Approach to Zero Shrinkage LTCC
Yong Jun Seo, Yong S. Cho, Yonsei University
LTCC Technology - An Integration Solution
for Power Electronics
Michele H. Lim, J. D. van Wyk, Zhenxian Liang,
Virginia Polytechnic Institute and State
University
Mechanical Properties and Morphology of
Polyimide Films Filled with Barium Titanate
Jin-Hyun Hwang, Hiroki Maie, Burtrand I.
Lee, Clemson University
Study of Laser Milling of Sintered LTCC,
Quartz, and Pyrex Substrates for Meso and
Micro Fluidic Applications
Rogerio Furlan, Jose Manuel Castillo Colon,
Idalia Ramos, Jorge J. Santiago-Aviles, University
of Puerto Rico at Humacao
Energy Scavenging Device in Low Temperature
Co-Fired Ceramics
Sarah Scherrer, Boise State University
Fabrication of Microstructure in Transparent
Materials using Femtosecond Laser Irradiation
Shingo Kanehira, J. Si, K. Miura, K. Fujita,
K. Hirao, Kyoto University
High Temperature Raman Study of CVD Diamond
Films
Jui-Chen Pu, Sea-Fue Wang and James C. Sung,
National Taipei University of Technology
Effect of Re-Oxidation Firing on PTCR Properties
of SM-Doped Barium Titanate Ceramics
Myoung-Pyo Chun, Jung-Ho Cho, Byung-Ik Kim,
Korea Institute of Ceramics Engineering and
Technology (KICET)
A Novel Process to Synthesize Hollow ZnO
Particles using Bubbles as Templates
Yong Sheng Han, Li Wei Lin, Masayoshi Fuji,
Minoru Takahashi, Hiroaki Takegami, Nagoya
Institute of Technology
The Application of Artificial Neural Network
to CalibrateMicro-Actuator
Y. B. Zhang, J. G. He, G. M. Liu, Z. M. Pan,
T. Yang, Y. K. Fang, Institute of Machinery
Manufacturing Technology
Effect of CuO on the Sintering Behavior
and Dielectric Characteristics of Titanium
Dioxide
Yeong-Kyeun Paek, Chang-Keun Shin, Andong
National University – Korea
Fabrication of Micro Tubular SOFCs and their
SOFC Performance in the Intermediate Temperature
Toshio Suzuki, National Institute of Advanced
Industrial Science and Technology
Microstructure and Electrical Properties
of Sputtered Ba(Sr)TiO3 Films: Dopant and
Crystal Structure Effects
C. H. Wu, Jinn P. Chu, S. F. Wang, National
Taiwan Ocean University
Advanced Fabrication Techniques for an Ion
Mobility Spectrometer in Low Temperature
Co-Fired Ceramics
Brian Jaques, H. Weston, D. G. Plumlee, A.
J. Moll, Boise State University
Magnetic Domain Structure of NdFeB Thin
Film on Si Substrate
Nobuyasu Adachi, Y. Isa, T. Yoshimura, T.
Ota, I. Sakamoto, T. Okuda, Nagoya Institute
of Technology
Fabrication of Barium Strontium Titanate
Films Directly on Copper Electrodes by Aerosol
Deposition Method for Multilayer Dielectric
Devices
Jae-Hyuk Park, Sewoong Oh, Masakazu Mori,
Jun Akedo, National Institute of Advanced
Industrial Science and Technology (AIST)
Ceramic Substrate with Hidden Heat Sources
for Soldering of Electrical Components
Eli Meroz, Jacob David, Dan Har-Even, soreq
NRC
Fabrication of a Multilayered Ceramic Micro-Plasma
Generating Device
Amanda Baker, Clive Randall, The Pennsylvania
State University; Randall Stewart, Richard
Fantazier, R D imagetech, Inc.; Fred Wise,
Wise Electronic Systems, Inc. |
| Thursday, April 27
Registration:
7:30 am – Noon
Continental Breakfast: 7:30
am – 8:20
am
|
Session THA1:
International Session on Microsystems
Chairs: Dave Wilcox, Consultant; Leszek Golonka,
Wroclaw University
8:20 am – 9:50 am |
| An Overview of LTCC-Related Technologies
in Korea
Yong S. Cho, Yonsei University; Jun Chul
Kim, Nam Kee Kang, Korea Electronics Technology
Institute
LTCC an Enabling Technology for RF-, Microwave,
Bio- and Chemical Systems
Jens Mueller, Rubén Perrone, Sven
Rentsch, Torsten Thelemann, Michael Hinz,
Andreas Schober, Thomas Friedrich, Technical
Univ. of Ilmenau, ZIK MacroNano; Dieter Schwanke,
Thomas Haas, MSE GmbH & Co.; Lars Rebenklau,
TU Dresden
LTCC Toolbox for Photonic Integration
Pentti Karioja, Kimmo Keränen, Kari
Kautio, Jyrki Ollila, Jukka-Tapani Mäkinen,
Kari Kataja, Pentti Korhonen, Mikko Karppinen,
Veli Heikkinen, Teemu Alajoki, Antti Tanskanen,
Juhani Heilala, VTT (Technical Research Center
of Finland) |
| Break:
9:50 am – 10:20
am |
Session THA2:
Novel Synthesis Technology for Multilayer
Electronics II - Aerosol Deposition
Chair: Yong Cho, Yonsei University
10:20 am - Noon
|
| Room Temperature Impact Consolidation (R.T.I.C.)
of Ceramic Fine Powder on Aerosol Deposition
Jun Akedo, Hisato Ogiso, National Institute
of Advanced Industrial Science & Technology
Embedded Capacitor Technology on Printed
Wiring Board using Aerosol Deposition
Yoshihiko Imanaka, Nobuyuki Hayashi, Masatoshi
Takenouchi, Jun Akedo, Fujitsu Limited
Aerosol Deposition Fabrication of Transparent
Electro-Optic Films for Optical Modulator
Masafumi Nakada, Keishi Ohashia, Hiroki Tsudab,
Jun Akedo, NEC
Preparation of Thick Magnetic Garnet Films
with Aerozol Deposition Method and their
Magnetic Properties
Mitsuteru Inoue, Masahiko Mizoguchi, Pan
Boey Lim, Hironaga Uchida, Toyohashi University
of Technology
Multilayer Construction with Various Ceramic
Films for Electronic Devices Fabricated by
Aerosol Deposition
Hironori Hatono, Tomokazu Ito, Kengo Iwata,
Toto Ltd.; Jun Akedo, Advanced Manufacturing
Research Institute
|
| Closing Remarks: Noon |
Housing (Hotel Cut-off is March 25, 2006)
Housing Accommodations must be made directly to:
Grand
Hyatt Denver Hotel
1750 Welton Street
Denver, Colorado 80202
Phone: 303-295-1234 or 800-233-1234
When making reservation by phone, please reference
IMAPS.
TO
RESERVE ROOM ON-LINE, VISIT:
http://granddenver.hyatt.com/groupbooking/denrdimap2006
Single/Double
$179
A deposit for the first night's room and tax
is required to hold your room. Deposit
refunded if reservation is cancelled more
than 72 hours prior to arrival.
Transportation
Super Shuttle Coupon
Register
On-Line
|
