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IMAPS/ACerS 3rd International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies

April 23-26, 2007
Grand Hyatt Hotel
1750 Welton Street
Denver, Colorado USA

Advance Program

Early Registration Discount Deadline: March 23, 2007
Hotel Cut-off: March 23, 2007

General Co-Chairs:
Technical Program Co-Chairs:

Christian Hoffman

Kevin G. Ewsuk
Sandia National Laboratories

Andreas Roosen
University of Erlangen - Nuremberg

Michael Lanagan
Penn State University

Welcome Reception

Click on hyperlinked paper titles to preview the abstract

Monday, April 23
Registration: 4:00 pm – 7:00 pm

Welcome Reception: 6:00 pm – 7:00 pm

Tuesday, April 24
Registration: 7:00 am – 7:30 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 7:30 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 8:15 am – 8:30 am
Conference Chairs

Keynote Presentation: 8:30 am – 9:00 am
Piezoelectric MEMS for Molecular Medical Diagnostics
Speaker: Wolfgang Rossner, M. Schreiter, Siemens AG, Corporate Technology

Keynote Presentation: 9:00 am – 9:30 am
Microsystems and Microfluidics:  Why not LTCC?
Speaker: Amy J. Moll, Boise State University

Keynote Presentation: 9:30 am – 10:00 am
The Development of Multi-Gigabit Radio Technology for Terabit Wireless Personal Area Networks
Speaker: Joy Laskar, Georgia Institute of Technology

Break in Exhibit Hall: 10:00 am – 10:30 am
Session TA1:
Materials and Processes for Microsystems
Chair: Dan Krueger, Honeywell
10:30 am – 12:10 pm

Session TA2:
Co-Firing Processes and Dimensional Control in LTCC
Chair: Hyo Tae Kim, Korea Institute of Ceramic Engineering & Technology
10:30 am – 12:10 pm

Evaluation of Thick Film Conductive Pastes by using Lead Free Solder Alloys
Lars Rebenklau, Thomas Herzog, Klaus-Jürgen Wolter, Technische Universität Dresden

Powder Injection Molded Ceramic Microsystems
Sundar V. Atre, Carl Wu, Seong-Jin Park, Don Whychell, Oregon State University

Ceramic Micro-Tweezers and Tips with Sensor Electrodes for Micromanipulation and Sensing
Jouko Vähäkangas, Tuomas Haapa-aho, Marko Pudas, University of Oulu

UV Laser Processing of Alumina (AI203) Ultraminiature Circuit Substrates
Edward J. Swenson, Douglas Howe, Wilson Lu, Electro Scientific Industries, Inc.

EDA Software Requirements for a Flexible Design of LTCC Circuits
Horst Durst, Durst CAD/Consulting GmbH

Structure and the Application of Al2O3-Glass Based Self-Constrained LTCC
Takahiro Takada, Shuya Nakao, Masaru Kojima, Yukio Higuchi, Murata Manufacturing Co., Ltd.

Sinterkinetic Modeling for LTCC Materials
Markus Eberstein, Ralf Mueller, Stefan Reinsch, Torsten Rabe, Federal Institute for Materials Research and Testing (BAM)

Interpretation of the Influence of LTCC Green Tape Characteristics on Shrinkage Behavior
Martin Rauscher, Andreas Roosen, University of Erlangen-Nuremberg

New Lanthanum Borates-Based Low Temperature Dielectrics
Yong Soo Cho, Yeon Hwa Jo, Deuk Ho Yeon, Yonsei University

Co-Firing of Embedded Passives Fabricated with Photo-Imageable Thick Film Technology on the Zero-Shrinkage LTCC Substrate
Hyo Tae Kim, Jong-Woo Lim, Joong-Hee Nam, Dong-Hoon Yeo, Hyo-Soon Shin, Jonghee Kim, Korea Institute of Ceramic Engineering & Technology; Ungyu Paik, Hanyang University; Dong Yun Jung,  Chul-soon Park, School of IT Engineering, Information and Communications University

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm

Session TP1:
High Frequency Characterization and Simulation

Chairs: Michael Janezic, National Institute of Standards and Technology; Rhonda Franklin Drayton, University of Minnesota
1:20 pm – 3:00 pm

Session TP2:
Ceramic Actuators

Chairs: Richard Eitel, University of Kentucky; Clive Randall, The Pennsylvania State University
1:20 pm – 3:00 pm

Complex Permittivity Measurements at Millimeter Waves
Bill Riddle, Michael Janezic, National Institute of Standards and Technology

Design and Fabrication of Terahertz Wave Control Devices by Micro-Stereolithography
Soshu Kirihara, Hideaki Kanaoka, Takanori Hibino, Yoshinari Miyamoto, Osaka University

Design and Implementation of Baluns at 60GHz on LTCC
Sven Rentsch, Jens Müller, Ralf Stephan, Matthias Hein, Technische Universität Ilmenau

Comparison of IBM PowerPC Processors in High Speed Multi Layer Ceramic Packages: Ceramic Designs and Influence of Wiring Layout
Christopher Spring, Warren D. Dyckman, Erwin Cohen, Michael Stopford, Benjamin Fasano, Michael J. Longo, IBM Corporation

Comparison of High Resolution Patterning Technologies for LTCC Microwave Circuits
Jens Mueller, R. Perrone, K.-H. Drüe, R. Stephan, J.Trabert,  M. Hein, D. Schwanke, J. Pohlner, G. Reppe, R. Kulke, P. Uhlig, A. F. Jacob, T. Baras, A. Molke, Technical University of Ilmenau, ZIK MacroNano

Multilayer Piezo Actuators for Injection Valves
Bertram Sugg, Petra Vogel, Sandrine Baudry, Friederike Lindner, Friedrich Boecking, Robert Bosch GmbH

Electrode-Ceramic Interactions in Low-Firing PZT Multilayer Actuators with Ag-Pd Electrodes
Niall Donnelly, T. R. Shrout, C. A. Randall, Penn State University

Novel Piezoelectric Sensors and Actuators
Ahmad Safari, Rutgers University

Processing of 0.65 Pb (Mg1/3Nb2/3)O3 – 0.35 PbTiO3 Thick Films on Alumina and LTCC Ceramic Substrate
Marija Kosec, J. Holc, M. Hrovat, D. Kuscer, S. Drnovšek, Josef Stefan Institute

Characterization of Lithographically Structured PZT Thick Film Structures
Stefan Schimpf, Matthias Hartmann, Thomas Lemke, Otto-von-Guericke-University Magdeburg

Break in Exhibit: 3:00 pm – 3:30 pm

Session TP3:
Advanced Packaging Technology I

Chair: Fred Barlow, University of Idaho
3:30 pm – 4:50 pm

Session TP4:
Direct Write Technology

Chairs: Paul Clem, Sandia National Laboratories; Jim Smay, Oklahoma State University
3:30 pm – 4:50 pm

A Simple and Robust Structure for LTCC Green Tape Characterization and Process Control Monitoring
George Kang, Simon Gay, Mike Curley, David Ross, Jamie McCormick, Anaren Ceramics, Inc.

Examination of Surface Roughness Effect on Insertion Loss at Microwave Frequencies within LTCC Structures
Tracey S. Vincent, Barry Industries and Worcester Polytechnic Institute; I. Bar-On, C. A. Brown, Worcester Polytechnic Institute

Low-K with Low-Loss LTCC Materials Based on Dolomite-Type Boron Compounds
Hyo Tae Kim, Myoung-Hwa Nam, Joong-Hee Nam, Dong-Hoon Yeo, Hyo-Soon Shin, Jonghee Kim, Korea Institute of Ceramic Engineering & Technology; Sahn Nahm, Korea University

Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)
Khalid Z. Rajab, Mira Naftaly, Edmund H. Linfield, Juan C. Nino, Daniel Arenas, David Tanner, Raj Mittra, Michael T. Lanagan, The Pennsylvania State University

System Analysis of a DoD Print Head for Direct Writing of Conductive Circuits
Dominik Cibis, Klaus Krueger, Helmut-Schmidt University

A Square Uniform UV Laser Beam for Screen Printing Enhancement and Photoresist Ablation for Ultraminiature Chip Resistors
Edward J. Swenson, Douglas Howe, Wilson Lu, Electro Scientific Industries, Inc.

Nano-Particles for Low Temperature Processing of Interconnects
Lance Swann, B. Li, X. Dongjiang, K. Church, nScrypt

Aerosol Deposition of Integrated Capacitors
David P. Williams, B. A. Tuttle, T. J. Garino, M. K. Niehaus, J. Cesarano, D. L. Moore, J. A. Voigt, Sandia National Laboratories

Reception in Exhibit Hall: 5:00 pm – 7:30 pm

Wednesday, April 25

Registration: 7 am – 5 pm

Continental Breakfast: 7 am – 8 am

Exhibit Hours: 10:00 am – 5:00 pm
Refreshment Break & Lunch in Exhibit Hall

Session WA1:
International Session on Microsystems I
Chairs: Yong Soo Cho, Yonsei University; Takaaki Tsurumi, Tokyo Institute of Technology
8:30 am – 10:00 am

Direct Patterning for Printable Electronics by Inkjet Technologies
Shin-ichi Nishi, Konicaminolta IJ Technologies, Inc.

High K Embedded Thin Film Capacitor for PCB Application
Jung-Won Lee, Inhyung Lee, Seung Eun Lee, Yul Kyo Chung, Yong Soo Oh, Samsung Electro-Mechanics

Study on Microstructure and Properties of Nanograin Ferroelectric Ceramics
Longtu Li, Xiaohui Wang, Xiangyun Deng, Hai Wen, Zhilun Gui, Tsinghua University

Break in Exhibit Hall: 10:00 am – 10:30 am

Session WA2:
Microsystem Applications

Chairs: Karl-Heinz Drue, Technical University of Ilmenau; Hansu Birol, Ecole Polytechnique Fédérale de Lausanne (EPFL)
10:30 am – 12:10 pm

Session WA3:
Processing and Design of Integrated Passives in LTCC

Chairs: Timothy Mobley, DuPont; Jerry Aguirre, Kyocera America Inc.
10:30 am – 12:10 pm

Design and Fabrication of Ceramic Microchannel Microreactors
C. Lewinsohn, M. Wilson, J. Cutts, H. Anderson, Ceramatec, Inc.

Synthesis of Nanoparticles in High Temperature Ceramic Microreactors: Design, Fabrication & Testing
Sundar V. Atre, Kartavya Jain, Carl Wu, Shoichi Kimura, Goran Jovanovic, Vinod Narayanan, Sukumar Roy, Vincent Sprenkle, Oregon State University

LTCC-Based Fluidic Components for Chemical Applications
Torsten Thelemann, J. Müller, M. Fischer, A. Groß, Technical University of Ilmenau

Microfluidic LTCC Devices for Cellular Biology
Richard E. Eitel, Wenli Zhang, Janet Lumpp, University of Kentucky

LTCC Enzymatic Microreactor
Leszek J. Golonka, Karol Malecha, Dorota Pijanowska, Wladyslaw Torbicz, Wroclaw University of Technology

Suppression of Simultaneous Switching Noise by Embedded Decoupling Capacitor in LTCC Package
Yun-Hwi Park, Kwangje Oh, Ikseop Kim, Hosung Chu, Jehong Sung, Seokchul Yun, Jinwaun Kim, Samsung Electro-Mechanics Co., Ltd.

PZT-Based Thin Film Embedded Capacitors for High Density Printed Circuit Boards
Seung-Hyun Kim, C. Y. Koo, H-J. Woo, J-H. Yeom, J-H. Cheon, J. Ha, INOSTEK Inc., R&D Center

Structural Design of Future MLCCs using Computer Simulation
Takaaki Tsurumi, Youichi Mizuno, Hiroshi Kishi, Hirokazu Chazono, Tokyo Institute of Technology

Mg-Cu-Zn Ferrites for Multilayer Inductors
Jorg Topfer, Julia Mürbe, University of Applied Science Jena

Investigate the Inter-Diffusion and Microstructure in Multilayer Ceramic Capacitors
Zhilun Gui, Xiaohui Wang,  Hai Wen, Lei Chen, Longtu Li, Tsinghua University

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm

Session WP1:
Microsystem Materials and Processes

Chair: Ken Peterson, Sandia National Laboratories
1:20 pm – 3:00 pm

Session WP2:
Advanced Packaging Technology II

Chairs: Martin Oppermann, EADS Deutschland GmbH; Jouko Vähäkangas, University of Oulu
1:20 pm – 3:00 pm

Heaters for LTCC-Sensors Made of Resinate Pastes
Jaroslaw Kita, Ralf Moos, Universität Bayreuth

Non-Abrasive Removal of Zero Shrink LTCC Constraint Layer
Cristina Lopez, Dan Krueger, Gregg Barner, Brent Duncan, Honeywell FM&T

New Sacrificial Layer-based Screen-Printing Process for Free-Standing Thick-Films Applied to MEMS
Claude Lucat, Patrick Ginet, Francis Menil, Université Bordeaux

Modeling and Characterization of Screen-Printed Metallic Electrothermal Microactuators
Patrick Ginet, Claude Lucat, Francis Ménil, Jean-Luc Battaglia, Université Bordeaux

Benchmarking Different Types of Thick-Film Pressure Sensors
Darko Belavic, Marina Santo Zarnik, Marko Hrovat, Srecko Macek, Marko Pavlin, Mitja Jerlah, Janez Holc, Silvo Drnovsek, Jena Cilensek, Marija Kosec, Jozef Stefan Institute

Commercial PZT Thick Film for Integrated and Miniaturized Devices and High Frequency Ultrasound
Rasmus Lou-Møller, Erling Ringgaard, Wanda W. Wolny, Annette Foged Pedersen, Ferroperm Piezoceramics A/S

Research into Ceramic Injection Molding of PZT for New 3D Shapes on Prototyping and Mass Production in Microsystems
Matthias Hartmann, Stefan Schimpf, Thomas Lemke, Bertram Schmidt, University of Magdeburg IMOS

2-Degrees of Freedom Ultrasonic Motors Co-Sintered with Low Temperature Cofired Ceramics (LTCC)
Seung-Ho Park, Seung-Ho Park, Kenjj Uchino, Amanda Baker, Clive A. Randall, The Pennsylvania State University
; Richard Eitel, University of Kentucky

Dielectric Properties of Liquid Crystal Polymer and CaTi03-LaAl03 Composites for Embedded Matching Capacitors
Jin Cheol Kim, Jun Rok Oh, Samsung Electro Mechanics

The Study of Adhesion Enhancement between Metal Top Electrode and Ferroelectric Materials for MEMS Process
Jung-Hoon Yeom, Seung-Hyun Kim, Chang Young Koo, Jowoong Ha, INOSTEK Inc., R & D Center

Interactive Forum (Poster Session)
One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.
3:00 pm – 5:00 pm

Synthesis of Nano-Sized Cordierite based Materials and Their Modification for LTCC Application
Hyo Tae Kim, Jonghee Kim, Myoung-Hwa Nam, Joong-Hee Nam, Dong-Hoon Yeo, Hyo-Soon Shin, Korea Institute of Ceramic Engineering & Technology

Miniaturization of LTCC Devices by using Mixed Dielectric Substrates
Amanda Baker, Michael Lanagan, Elena Semouchkina, George Semouchkin, Thomas Kerr, The Pennsylvania State University

Cold Plasma Generator
Alex Miller, Boise State University

Ceramic Micro-Nozzle Model Verification through Schlieren and IR Photography
Aaron Coulter, Boise State University

Electrospinning of Ceramic Fiber Mats from a Suspension
Hongbo Zhang, M. J. Edirisinghe, East China University of Science and Technology

Fabrication of Micro-Channels in LTCC Devices
Douglas Kellis, Amy Moll, Donald Plumlee, Boise State University

Anodic Bondable Glass-Ceramic LTCC Tape
Beate Pawlowski, E. Müller, R. Ehrt, Hermsdorfer Institut für Technische Keramik e.V.

Post-Bonding and Fabrication of Low Temperature Co-fired Ceramic
Hope Weston, Boise State University

Fabrication of Moving Parts within an LTCC Structure
John Gustav Engstrom, Boise State University

Application of Nanoceramic Processing for High Power Multi-Channel Electron Multiplier in Low Temperature Cofire Ceramic (LTCC)
Feng Zheng, Wenzhong Wu, W. Kinzy Jones, Florida International University

Structural Electrical and Surface Tensional Properties of Ceramic Polymer Composites
Rosalin Abraham, Jayakumari Isac, Sabu Thomas, St. Dominics College

Tunable Metamaterials Based on LTCC
Zhou Ji, Du Bo, Zhao Qian, Kang Lei, Tsinghua University

Eucryptite Filler for CTE Control of Organic Substrates
Jin Cheol Kim, Tae Kyoung Kim, Jun Rok Oh, Hwa Young Lee, Keum Hee Yun, Samsung Electro Mechanic



Thursday, April 26
Registration: 7:30 am – Noon

Continental Breakfast: 7:30 am – 8:30 am

Session THA1:
International Session on Microsystems II
Chairs: Jens Mueller, Technical University of Ilmenau; Leszek Golonka, Wroclaw University of Technology
8:30 am – 10:00 am

Application of Ceramic Technology for Cost Effective Manufacturing of Micro Fuel Cell Systems
Alexander Michaelis, Fraunhofer Institute for Ceramic Technologies and Systems

A Charging Unit Based on Micro-PEM-Fuel Cells in LTCC-Technology
Adrian Goldberg, Uwe Partsch, Michael Stelter, Fraunhofer Institut Keramische Technologien und Systeme

Sacrificial Layer Materials for 3D Structuration of LTCC and Thick-Film Sensors
Thomas Maeder, Yannick Fournier, Hansu Birol, Simon Wiedmer, Caroline Jacq, Peter Ryser, Ecole Polytechnique Fédérale de Lausanne

Break: 10:00 am – 10:20 am

Session THA2:
Design and Fabrication of Ceramic Microsystems and Devices

Chair: Torsten Rabe, Federal Institute for Materials Research and Testing
10:20 am – Noon

Design and Fabrication of an Embedded Hydrogen Peroxide Catalyst Chamber in LTCC
Donald Plumlee, Matt McCrink, Doug Kellis, Amy Moll, Judi Steciak, Boise State University

A LTCC Burner for Studying Sub-Millimeter Scale Flames
Ming-Hsun Wu, Richard A. Yetter, Pennsylvania State University

Study on Producing High Precision Micro Ceramic Device with High Aspect Ratio by Liga Process
Jun Wang, Gang Liu, Yangchao Tian, National Synchrotron Radiation Laboratory (NSRL)

A New Concept for LTCC-Based Pressure Sensors
Uwe Partsch, Fraunhofer IKTS; Dietmar Arndt, Hannes Georgi, ADZ Nagano

Nanoscale SiC Sintered Structures for Power Electronics Packaging and Advanced Microsystems
Manish Bothara, S. J. Park, R. M. German, T. S. Sudarshan, R. Radhakrishnan, S. V. Atre, Oregon Nanoscience & Microtechnologies Institute

Closing Remarks: Noon



Housing (Hotel Cut-off is March 23, 2007)
Housing Accommodations must be made directly to:

Grand Hyatt Denver Hotel
1750 Welton Street
Denver, Colorado 80202
Phone: 303-295-1234 or 800-233-1234
When making reservation by phone, please reference Ceramic Interconnect Conference.


Single/Double $187
A deposit for the first night's room and tax is required to hold your room. Deposit
refunded if reservation is cancelled more than 72 hours prior to arrival.



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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