IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society
IMAPS Germany
DKG - German Ceramics Society

IMAPS/ACerS 4th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2008)

April 21-24, 2008
Holiday Inn - City Centre
Munich, Germany

General Co-Chairs:
Technical Program Co-Chairs:

Christian Hoffman
EPCOS OHG
christian.hoffmann@epcos.com

Michael Lanagan
Penn State University
mlanagan@psu.edu

Andreas Roosen
University of Erlangen - Nuremberg
andreas.roosen@ww.uni.erlangen.de

Amy Moll
Boise State University
amoll@boisestate.edu

Jun Akedo
AIST
akdeo-j@aist.go.jp

Local Organizing Committee :

Markus Blumenberg (DKG), Christian Hoffmann (EPCOS OHG), Jens Müller (TU Ilmenau), Heinz Osterwinter (HS Esslingen),
Andreas Roosen (University of Erlangen-Nuremberg)

Advance Program

Early Registration and Hotel Deadlines: February 29, 2008



Program-at-a-Glance
Monday:
Welcome Reception | IMAPS ELC Ceramic Tutorials
Tuesday:
Wednesday:
Thursday:


Monday, April 21
Registration: 4:00 pm – 7:00 pm

Welcome Reception: 6:00 pm – 7:00 pm

IMAPS ELC Ceramic Technology Tutorials
Two tutorials will be offered by the IMAPS Europe Liaison Committee in conjunction with the conference. The tutorials will be held at the Fraunhofer IZM premises in Munich prior to the conference on Monday, April 21, from 1:00 pm to 5:00 pm.


Tuesday, April 22
Registration: 7:30 am – 7:30 pm

Exhibit Hours: 10:00 am – 7:30 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 8:15 am – 8:30 am
Conference Chairs

Keynote Presentation: 8:30 am – 9:00 am
Chip-Package-Board Co-design in High-density and High-speed Circuit Packaging
Takashi Harada, NEC Corporation

Keynote Presentation: 9:00 am - 9:30 am
Direct Write of Electronic Materials for Three-Dimensional Polymer Integration
Paul Clem, Sandia National Laboratories

Keynote Presentation: 9:30 am - 10:00 am
Modified Ceramic Technologies for the Newest Generation of Automotive Electronics
Gerd Auerswald, VDO Automotive AG

Break in Exhibit Hall: 10:00 am – 10:30 am
Session TA1:
Microsystems Materials and Processes
Chairs: Ken Peterson, Sandia National Laboratories; Donald Plumlee, Boise State University
10:30 am – 12:10 pm

Session TA2:
Co-Firing Processes and Dimensional Control
Chairs: Hyo Tae Kim, Korea Institute of Ceramic Engineering and Technology; Jau-Ho Jean, National Tsing Hua University
10:30 am – 12:10 pm

Multi-Component Ceramic Parts Produced by Micro Powder Injection Molding
Volker Piotter, R. Heldele, K. Plewa, A. Ruh, H.-J. Ritzhaupt-Kleissl, J. Hausselt, Forschungszentrum Karlsruhe

LTCC Free-Standing Structures with Mineral Sacrificial Paste
Yannick Fournier, Olivier Triverio, Thomas Maeder, Peter Ryser, Laboratoire de Production Microtechnique, Ecole Polytechnique Fédérale de Lausanne

Systematic Characterization of Embossing Processes for LTCC-Tapes
Heike Bartsch de Torres, Martin Hoffmann, TU Ilmenau

High Layer Count in LTCC Dual Band Antenna for Galileo GNSS
Peter Uhlig, Dirk Manteuffel, Stefan Malkmus, IMST GmbH

Development of 3-D Channels in LTCC for Capillary Cooling Structures for Thermal Management
W. Kinzy Jones, Feng Zheng, Florida International University

Two different layer composited LTCC system with Low Dk and High Dk for New Wireless Applications
Je-Hong Sung, Jin-Wan Kim, Yun-Huek Choi, Samsung Electro-Mechanics

Investigation of the Anisotropic Shrinkage Behavior to Improve the Dimensional Control in LTCC Multilayer Processing
Martin Rauscher, Andreas Roosen, University of Erlangen-Nuremberg

Constrained Sintering of a Low-Fire NiCuZn Ferrite
Jau-Ho Jean, National Tsing Hua University

LTCC-Modules with Integrated Ferritic Layers – Strategies for Material Development and Co-Sintering
Carsten Glitzky, Torsten Rabe, Wolfgang Schiller, Markus Eberstein
Federal Institute for Material Research and Testing (BAM); Jörg Töpfer, University of Applied Sciences Jena; Stefan Barth, Hermsdorfer Institut für Technische Keramik e.V.; Annette Kipka, W.C. Heraeus GmbH

Validation of Alternative RoHS Compliant Au-Pastes
for the DuPont LTCC 951 System
Bernhard Mussler, Dieter Schwanke, Micro Systems Engineering GmbH

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm

Session TP1:
Ceramic Actuators in Microsystems

Chair: Wolfgang Rossner, Siemens AG
1:20 pm – 3:00 pm


Session TP2:
Nanoprocessing for Integrated Electronics

Chairs: Yoshihiko Imanaka, Fujitsu Laboratories; Seung-Hyun Kim, INOSTEK
1:20 pm – 3:00 pm

Piezoelectric Properties of Pb(Zr,Ti)O3 Thin Films for Nano Data Storage Devices
Seung-Hyun Kim, Chang Young Koo, Hyun-Jung Woo, Jong-Hyeon Cheon, Jowoong Ha, Brian L. Wardle, Woosik Kim, INOSTEK Inc., R&D Center

Thick Film Accelerometers in LTCC-Technology - Design Optimization, Fabrication and Characterization
Holger Neubert, Uwe Partsch, Daniel Fleischer, Mathias Gruchow, Alfred Kamusella, The-Quan Pham, Technische Universität Dresden, Institute of Electromechanical and Electronic Design

Free-Standing Piezoelectric Thick Films for MEMS Applications
C. Castille, C. Lucat, R. Von Der Mühll, P. Ginet, F. Ménil, M. Maglione, IMS (Bordeaux1) and ICMCB (Bordeaux1)

Active Optical Structures by Use of PZT Thick Films
Sylvia Gebhardt, Andreas Schönecker, Claudia Bruchmann, Erik Beckert, Gonçalo Rodrigues, Renaud Bastaits, André Preumont, Fraunhofer Institut fuer Keramische Technologien und Systeme

Feasibility Study of a Thick-Film PZT Resonant Pressure Sensor Made on Prefired LTCC Structure
Marina Santo Zarnik, Darko Belavic, Srecko Macek, HIPOT-RR, c/o Jozef Stefan Institute

Local Porosification of Fired LTCC Substrates
Achim Bittner, U. Schmid, Saarland University

High-Permeability (Ni,Mg)-Cu-Zn Ferrites for Integrated Multilayer Inductors Based on Nanosize Ferrite Powders
Jörg Töpfer, Julia Mürbe, Univ. Appl. Sciences Jena

Preparation of Barium Titanate Nanoparticles from Barium Titanyl Oxalate Nanoparticles and Their Dielectric Property
Satoshi Wada, Shuhei Kondo, University of Yamanashi; Takuya Hoshina, Takaaki Tsurumi, Tokyo Institute of Technology; Yoshihiro Kuroiwa, Hiroshima University

Fabrication of SrZrO3 Thick Films on Polymer Composites by Aerosol Deposition Method
Song-Min Nam, Naoko Mori, Hirifumi Kakemoto, Satoshi Wada, Takaaki Tsurumi, Jun Akedo, Kwangwoon University

Fabrication of Ceramic-Based Thick Film Substrates by Aerosol Deposition for the Application of Integration Modules
Young Joon Yoon, Jae Chang Park, Hyung-Jun Kim, Hyun-Jun Na, Song Min Nam, Eun-hae Koo, Jong-Hee Kim, Korea Institute of Ceramic Engineering and Technology

Break in Exhibit: 3:00 pm – 3:30 pm

Session TP3:
Microsystems Materials and Properties

Chair: Alexander Michaelis, Fraunhofer Institute for Ceramic Technologies
3:30 pm – 5:30 pm

Session TP4:
High Frequency Characterization and Simulation

Chairs: Michael Janezic, NIST; Jack Casey, Agilent Technologies
3:30 pm – 5:30 pm

Structure and Properties of Low-temperature Sintered M2+N4+B2O6 Ceramics
Hyo-Tae Kim, Myoung-Hwa Nam, Young Joon Yoon, Eun-hae Koo, Sahn Nahm, Jonghee Kim, Korea Institute of Ceramic Engineering and Technology

Design of LTCC with High Thermal Expansion
Markus Eberstein, Carsten Glitzky, Marion Gemeinert, Torsten Rabe, Christina Modes, Wolfgang Schiller, BAM Fed. Inst. for Materials Research and Testing

High Temperature Deflection of LTCC
Arturo Gutierrez Jr., Doug Kellis, Donald Plumlee, Amy Moll, Boise State University

Limiting Factors for the Application of LTCC at Elevated Temperatures
Christian Bienert, Andreas Roosen, University of Erlangen-Nuremberg

Porous Ceramic Membranes with 3-D Structure for the Microreactor Application
David Salamon, Rob Lammertink, Leon Lefferts, Matthias Wessling, University of Twente - Membrane Technology Group

Development of Low Loss and Temperature Stable BaNd2Ti5O14 Thick-Film Dielectrics by Electrophoretic Deposition Techniques
Paula Maria Vilarinho, Zhi Fu, Aiying Wu, Universidade de Aveiro; A.I Kingon, North Carolina State University

Tunable Interdigital Capacitors at Microwave Frequency
Jeremiah Turpin, Oleg Maksomov, Mark Fanton, Volker Heydemann, Joshua Robinson, Steve Perini, Michael Lanagan, Penn State University

Influence of Iron and Fluoride Codoping on Microwave Properties of Tunable Ba0.6Sr0.4TiO3 Thick Films
F. Paul, A. Giere, J. R. Binder, W. Menesklou, P. Scheele, R. Jakoby, J. Haußelt, University of Freiburg

Split-Post and Split-Cylinder Resonator Techniques: A Comparison of Complex Permittivity Measurement of Dielectric Substrates
Michael Janezic, National Institute of Standards and Technology; Jerzy Krupka, Warsaw University of Technology

Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICs
Lewis Dove, Agilent Technologies

Packaging of RF MEMS Switches in LTCC
Markku Lahti, Jaakko Lenkkeri, Kari Kautio, Tauno Vähä-Heikkilä, VTT

Ceramic Microwave Circuits for Satellite Communication
Reinhard Kulke, G. Möllenbeck, C. Günner, P. Uhlig, IMST GmbH; K.H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M.A. Hein,
Technical University of Ilmenau; A. Molke, T. Baras, A.F. Jacob,
Technical University of Hamburg-Harburg; D. Schwanke, J. Pohlner,
Micro Systems Engineering GmbH

Reception in Exhibit Hall: 5:30 pm – 7:30 pm


Wednesday, April 23

Registration: 7:30 am – 5:00 pm

Exhibit Hours: 10:00 am – 5:00 pm
Refreshment Break & Lunch in Exhibit Hall

Session WA1:
International Session on Microsystems I
Chairs: Yong Soo Cho, Yonsei University; Takaaki Tsurumi, Tokyo Institute of Technology
8:30 am – 10:00 am

Bottom-up Fabrication of Nanostructured Functional Materials Using Oxide Nanosheets
Minoru Osada, Takayoshi Sasaki, National Institute for Materials Science

A Diplexer Embedded in Heterogeneous Organic Substrates
Chan-Sei Yoo, Se-Hoon Park, Woo-Sung Lee, Jun-Chul Kim, Nam-Kee Kang, Jong-Chul Park, Korea Electronics Technology Institute; Kwang-Seok Seo, Seoul National University

Fabrication of Precise Fluidic Structures in LTCC
F. Barlow, J. Wood, A. Elshabini, University of Idaho; E.F. Stephens, R. Feeler, G. Kemner, J. Junghans, Northrop Grumman, USA

Break in Exhibit Hall: 10:00 am – 10:30 am

Session WA2:
Biomedical Applications

Chairs: Richard Eitel, University of Kentucky; Antonio Feteira, University of Sheffield
10:30 am – 12:10 pm

Session WA3:
Processing and Design of Integrated Passives in LTCC

Chairs: Paul Collander, Poltronic; Marija Kosec, Jozef Stefan Institute
10:30 am – 12:10 pm

Micro System Technologies for Implantable Biomedical Devices
Ir. Rogier A.M. Receveur, Medtronic Bakken Research Center B.V.

Dielectrophoresis and Microfluidics: Key Methods for the Manipulation of Biological Objects Ranging from Nanoparticles to Cells
Claus Duschl, Magnus Jaeger, Michael Boettcher, Christian Marschner, Michael Kirschbaum, Isabella Guido, Fraunhofer Institute for Biomedical Engineering

Biostability of Low Temperature Cofired Ceramic materials for Microfluidics and Biomedical Devices
Richard Eitel, Wenli Zhang, Janet Lumpp, University of Kentucky

Fabrication and Testing of a LTCC Microfluidic Serial Dilution Device
Mario Ricardo Gongora-Rubio, Marcio Rodrigues da Cunha, Izabela Dutra Alvim, Maria Ines Ré, Institute for Technological Research of the State of São Paulo

Construction and Evaluation of Miniaturized Photometer Device for Phosphate Ion Determination Using LTCC Continuous Flow Systems
Z.M. Da Rocha, M.A.C. Ferreira, N. Ibáñez-García, A.C. Seabra, J.A. Chamarro, M.R. Gongora-Rubio, LSI-PSI, Polytechnic School, University of São Paulo

Power Inductors in Ceramic Multilayer Circuit Boards
Richard Matz, Dieter Götsch, Thomas Goßner, Roman Karmazin, Ruth Männer, Bernhard Siessegger, Siemens Corporate Technology

Novel Method for Embedding High Quality LTCC RF-Capacitors Using Mid-K Tapes
Jens Mueller, Matthias Mach, Ruben Perrone, ZIK MacroNano, TU Ilmenau

Dielectric Properties of Bismuth-Zinc-Niobium Thin Films for Embedded Capacitor
Seung Eun Lee, Jung Won Lee, Inhyung Lee, Byung Ik Song, Samsung Electro-Mechanics

Filling Methods for Embossed Low Resistance Fine Line Coils in LTCC
Rubén A. Perrone, H. Bartsch de Torres, M. Hoffmann, J. Müller, TU Ilmenau

Embedded Capacitor Technology Using Aerosol Deposition
Yoshihiko Imanaka, Jun Akedo, Fujitsu Laboratories Ltd.

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm

Session WP1:
Design and Fabrication of Ceramic Microsystems and Devices

Chairs: Torsten Rabe, Federal Institute for Materials Research and Testing; Thomas Maeder, EPFL
1:20 pm – 3:00 pm

Session WP2:
Advanced Packaging Technology

Chairs: Martin Oppermann, EADS Deutschland GmbH; Jouko Vähäkangas, University of Oulu
1:20 pm – 3:00 pm

Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-fired Ceramics
Douglas Kellis, Amy Moll, Donald Plumlee, Boise State University

Development and Prototyping of a Ceramic Micro Turbine
Werner Bauer, Marcus Müller, Regina Knitter, J. Oerding, A. Albers, J. Kotschenreuther, J. Fleischer, Forschungszentrum Karlsruhe

Terahertz Wave Control Using Ceramic Photonic Crystals with Diamond Structure Including Plane Defects Fabricated by Micro-Stereolithography
Soshu Kirihara, Yoshinari Miyamoto, Osaka University

Experimental Reliability Assessment of Ceramic Micro-Systems and Interconnects in Hostile Environments
Michael Hertl, Diane Weidmann, Jean-Claude Lecomte, Insidix

Silicon on Ceramics - A New Integration Concept for Silicon Devices to LTCC
Michael Fischer, H. Bartsch de Torres, M. Mach, R. Gade, M. Stubenrauch, M. Hoffmann, J. Müller, ZIK MacroNano, TU Ilmenau

Micro-Cone-Shaped Au-Bump by Gas Deposition Method for High-Density Interconnection of LSI Chips
Fumito Imura, Yasuhiro Yamaji, Hiroshi Nakagawa, Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology (AIST)

Innovative Thermal Design for High Power LED Applications
Claus Peter Kluge, CeramTec AG

Aspects on Advanced Thermal Management and Reliability for Flip Chip on LTCC
M. Norén, C. Hoffmann, W. Salz, K. Aichholzer, EPCOS OHG

Enhancement of Fine Line Print Resolution Due to Coating of Screen Fabrics
Dieter Schwanke, Jürgen Pohlner, Micro Systems Engineering GmbH;
Andreas Wonisch, Fraunhofer-Institut fuer Werkstoffmechanik (IWM);
Jürgen Geng, Plasma Electronic GmbH

LTCC Active Oxygen Getter Module for Hermetic Packaging Applications
Thomas Maeder, Yannick Fournier, Frank Seigneur, Peter Ryser, Laboratoire de Production Microtechnique, Ecole Polytechnique Fédérale de Lausanne

WP3:
LTCC Standards Initiative
Chairs: Howard Imhof, Metalor; Tim Mobley, DuPont Electronic Technologies; Mike Ehlert, Barry Industries
3:30 pm – 5:00 pm

LTCC Processing Standards & iNEMI Roadmap
Howard Imhof, Metalor Technologies USA; Mike Ehlert, Barry Industries

LTCC Processing Standards from the IMAPS LTCC Standards SiG
Mike Ehlert, Barry Industries

Panel Discussion of the Draft LTCC Standards
Mike Ehlert, Barry Industries; Howard Imhof, Metalor; Tim Mobley, DuPont Electronic Technologies

WP4:
Interactive Forum (Poster Session)
One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.
Chairs: Fred Barlow, University of Idaho; Ulrich Schmid, Saarland University
3:30 pm – 5:00 pm

P1: Automatic Optical Inspection of Ceramic Thick Film, Thin Film Hybrids and LTCCs
Sabine Miksa, Stratus Vision GmbH

P2: Study of the Microstructure of Silver Thin Films on LTCC
Achim Bittner, U. Schmid, Saarland University

P3: Dielectric Behavior of Co-Zr Substituted Hexagonal Barium Ferrites
D. Ravinder, Ch. Venkateshwarlu, Ch. Gopal Reddy, B.S Boyanov, Osmania University

P4: Ceramic Plate Heat Exchanger for Heterogeneous Gas Phase Reaction
Beate Pawlowski, Carsten Schmitt, David Agar, Stefan Turek, Matthias Duisberg, Hermsdorfer Institut für Technische Keramik e.V.

P5: PZT Films on Silicon Wafers Made by Aerosol Deposition
Atsushi Iwata, Jun Akedo, National Institute of Advanced Industrial Science and Technology

P6: Aerosol Deposition Method for On-Demand Process
Jun Akedo, Shizuka Nakano, Kiwamu Ashida, So Baba, Jaehyuk Park, Akito Endo, Advanced Manufacturing Research Institute, AIST

P7: Properties Study of Mo-SBA-1 Catalyst and its Activity
Suparb Tamuang, Walairat Tanglumlert, Toyoko Imae, Sujitra Wongkasemjit, Chulalongkorn University

P8: LTCC Microfluidic Diode
Mario Ricardo Gongora-Rubio, Márcio Rodrigues da Cunha, Cyro Ketzer Saul, Instituto de Pesquisas Tecnológicas do Estado de São Paulo

P9: Solid Filled Via: Improved Interconnects for DC and RF Thin Film Applications
Alexander Kaiser, K. Ruess, B. Holl, J. Vanselow, E. Feurer, Reinhardt Microtech GmbH; J. Kusterer, University of Ulm

P10: Structure and its Effect on Electrical Properties for BST Thick Films Deposited by Aerosol Deposition Technique
Daniel Popovici, Hiroki Tsuda, Jun Akedo, National Institute of Advanced Industrial Science and Technology

P11: Ceramic-Based Polymer Composite Film for Integrated Substrates Fabricated by Aerosol Deposition Method
Hyun-Jun Na, Hyung-Jun Kim, Jong-Min Oh, Jae Chang Park, Young Joon Yoon, Jong-Hee Kim, Song-Min Nam, Kwangwoon University

P13: Piezoresistive Properties of Low-Firing Temperature Thick-Films on Steel Sensors
C. Jacq, T. Maeder, P. Ryser, EPFL

P14: Influencing Parameters in Droplet Formation for DoD Printing of Conductive Inks
Dominik Cibis, Klaus Krüger, Helmut-Schmidt-University/University of the Federal Armed Forces Hamburg

P15: Preliminary Study on Real-Time PCR in LTCC Chip
Pawel Bembnowicz, Rafal Walczak, Jan Dziuban, Leszek Golonka, Wroclaw University of Technology

P16: New Masking Technique for PZT Thick Films Utilizing KOH Etched Trenches
Thomas Pedersen, C. C. Hindrichsen, E. V. Thomsen, K. Hansen, R. Lou-Møller, Technical University of Denmark

P17: BaTiO3-Based High-K Dielectric Composition with LTCC Compatible Sintering Temperature
Hamid Naghib-Zadeh, Carsten Glitzky, Torsten Rabe, Federal Institute for Materials Research and Testing (BAM); Andre Lissner, IZM; Stephan Mörbe, CEAG

P18: Application of Ceramic Material and Process to Fabricate Passive Mixers
Young Joon Yoon, Mi Ri Joung, Jong-woo Lim, Hyo Tae Kim, Joong-hee Nam, Youn-Suk Choi, Jong-hee Kim, Korea Institute of Ceramic Engineering and Technology

P20: Radar Transmitter and Receiver MCM Subassemblies Implemented in LTCC
Richard Knudson, Ken Peterson, Sandia National Laboratories; Frank Smith, Lawrence Zawicki, Honeywell FM&T

P21: Influence of Microstructural Factors on the Dielectric Properties of Multilayered MgTiO3-SrTiO3 Thin Films on Pt/TiO2/SiO2/(100)Si Substrates
Kuzhichalil Surendran Peethambharan, Aiying Wu, Paula Maria Vilarinho, Victor M. Ferreira, University of Aveiro

P22: Formation of Molten Droplet During Inkjet Printing Process
Hsin-Hung Chou, Ming-Hsiu Tsai, Yu-Pin Huang, Weng-Sing Hwang, National Cheng Kung University

P23: Polymer-Derived SiOC, SiC and SiCN Ceramic MEMS
Sandra Martínez Crespiera, Ralf Riedel, Martin Koehne, Jürgen Oberle, Viacheslav Bekker, Technical University Darmstadt

P24: Elaboration and Characterization of Multilayer Ceramic Capacitors Based on High Permittivity CaCu3Ti4O12
Barbier Bertrand, Alstom-Pearl / CIRIMAT; C. Combettes, S. Guillemet-Fritsch, Centre Interuniversitaire de Recherche et d’Ingénierie des MATériaux; T. Chartier, F. Rossignol, Ecole Nationale Supérieure de Céramiques Industrielles; A. Rumeau, T. Lebey, Laboratoire Plasma et Conversion d’Energie; E. Dutarde, Alstom Transport

P25: Highly Enhanced Dielectric Properties of Ferroelectric Nanocomposite Films Prepared by Aerosol Deposition Method
Jae-Hyuk Park, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

P26: Fabrication of Ceramic Dielectrics on Base-Metal Foils for Embedded Capacitors
U. Balachandran, B. Ma; D. K. Kwon; M. Narayanan, Argonne National Laboratory

P27: Mn-doping Effect on Optical Absorption of Pb(Zr,Ti)O3 Films Prepared by Aerosol Deposition
Hiroki Tsuda, Masafumi Nakada, Jun Akedo, Keishi Ohashi, National Institute of Advanced Industrial Science and Technology (AIST)

P28: Synthesis and Property Study of La2-xSrxNiO4 and NiO4 to be Used for IT-SOFCs Cathode
Thitirat Inprasit, Pimpa Limthongkul, Sujitra Wongkasemjit, Chulalongkorn University

P29: Room-Temperature-Deposited Transparent Magnetic Nanocomposite Thick Films by Aerosol Deposition Method
Jae-Hyuk Park, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

P30: Laser Annealing of PZT Thick Film Deposited on Stainless-steel Substrate by Aerosol Deposition
So Baba, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

P31: Microstructural Examinations of Brazed Boron Carbide Parts
Ehsan Rezabeigi, Ali Mohammad Hadian, Amir Hadian, School of Metallurgy and Materials, University of Tehran

P32: Influence of Temperature on Enzyme Activity in LTCC-Based Microreactor
Karol Malecha, Dorota Pijanowska, Leszek Golonka, Wladyslaw Torbicz, Wroclaw University of Technology

P33: Magneto-Optic Spatial Light Phase Modulator with PZT/Bi:YIG Hybride Structure
Mitsuteru Inoue, H. Takagi, K. H. Chung, J. Y. Kim, J. Heo, Toyohashi University of Technology

P34: Low Temperature Growth of Patterned Conducting Oxide Films by Excimer Laser Assisted Metal Organic Deposition
Tetsuo Tsuchiya, T. Nakajima, K. Kumagai, National Institute of Advanced Industrial Science and Technology (AIST)

P35: Characterization of Al2O3-Polyimide Composite Thick Films Fabricated by Aerosol Deposition Method
Hyung-Jun Kim, Hyun-Jun Na, Dong-Won Lee, Jae Chang Park, Young Joon Yoon, Jong-Hee Kim, Song-Min Nam, Kwangwoon University

P36: Mapping of Ferroelectric Response by Scanning Capacitance Microscopy
Yuichi Naitou, H. Ogiso, J. Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

P37: Formation of Resistance Film for Stress Sensor by Aerosol Deposition Method
Masakazu Mori, Jun Akedo, Ryukoku University

P38: Effect of Crystallization on Adhesion Strength of External Electrode in LTCC
Ko Minji, SooHyun Lyoo, Jongmyeon Lee, Samsung Electro-Mechanics

P39: Integrated LTCC Gas Flow Sensor with Measuring Device
Dominik Jurkow, Leszek Golonka, Wroclaw University of Technology

P40: Dielectric Properties of PZT Films Deposited by Inductively Coupled Plasma Assisted Aerosol Deposition Method
Naoki Akita, Jun Akedo, Masakazu Mori, Shoji Miyake, Takeshi Utsunomiya, Ryukoku University

P41: Low Sintering High K Materials for LTCC Application
Stefan Barth, M. Arnold, D. Grützmann, B. Pawlowski, P. Rothe, Th. Bartnitzek, Hermsdorfer Institut für Technische Keramik

P42: Generation of Via Holes and Patterns in Green Foils for Multilayer Ceramics
Gunter Hagen, Uwe Partsch, KMS Kemmer Technology Center GmbH

P43: Fundamental Study on High Frequency Ultrasound Probe with Piezoelectric Polycrystalline Film Deposited by Aerosol Deposition Method
Akito Endo, Jun Akedo, National Institute of Advanced Industrial Science and Technology

P44: UV-Curing for Ceramic Tape Casting
Rainer Ronniger, KARO Electronics GmbH

P45: An Evaluation of the Influence of Temperature on the Characteristics of Capacitive, Resonant and Piezoresistive Thick-Film Pressure Sensors
Darko Belavic, Marina Santo Zarnik, Marko Hrovat, Mitja Jerlah, Srecko Macek, Marko Pavlin, Janez Holc, Sandi Kocjan. HIPOT-RR, c/o Jozef Stefan Institute

P46: Processing of Reaction-Bonded and Post-Sintered Silicon Nitride Micro Parts
Marcus Müller, Werner Bauer, Dorit Nötzel, Regina Knitter. Institut für Materialforschung III, Forschungszentrum Karlsruhe

P47: Effect of the Degree of Constraining on the Densification and Microstructure of LTCC Films
Jean-Baptiste Ollagnier, Olivier Guillon, Jürgen Rödel, Technische Universität Darmstadt

P48: Field Effect on the Dielectric Properties of Sr1-1.5xYxTiO3 Ceramics
Paula Maria Vilarinho, Alexander Tkach, University of Aveiro

P50: Reliability and Failure Mechanism of Ceramic Matrix Composites in High-Temperature Combustion Environment
Yani Zhang, Litong Zhang, Laifei Cheng, Yongdong Xu, Northwestern Polytechnical University

P51: Manufacturing of High Resolution Water-Based Ceramic and Metal Materials Using Accurate Inkjet Printing Device
C. Dossou-Yovo, N. Bernardin, R. Noguéra, M. Lejeune, CERADROP

P52: Empirical and Theoretical Study of the Performance of Thermal Vias Within LTCC
Peter Barnwell, T. Vincent, Barry Industries

P53: Piezoelectric Properties of Ceramic PZT-BT Solid Solution C. Miclea, C. Tanasoiu, C.F. Miclea, L. Amarande, A. Iuga, M. Cioangher, National Institute for Materials Physics; I. Spanulescu, C. Plavitu, Hyperion University

Bavarian Congress Dinner: 7:00 pm
Green Hall, Augustiner Restaurant


Thursday, April 24
Registration: 7:30 am – Noon

Session THA1:
International Session on Microsystems II
Chairs: Jens Mueller, Technical University of Ilmenau; Leszek Golonka, Wroclaw University of Technology
8:30 am – 10:00 am

Non-Linear LTCCs and Their Applications
Heli Jantunen, Johanna Honkamo, University of Oulu

Combined Manufacture Methods for High Density LTCC-Substrates: Thick Film Screen-Printing, Ink-Jet, Post-Firing Thin Film Processes and Laser-Drilled Fine-Vias
Arne Albertsen, Katsumi Aruga, Kyoji Kobayashi, Koji Koiwai, KOA Europe GmbH

Shear-Mode Ultrasonic Motors Using High Qm Lead-Free Alkaline Niobate Ceramics
Takaaki Tsurumi, Enzhu Li, Takuya Hoshina, Ryo Suzuki, Hirofumi Kakemoto, Tokyo Institute of Technology

Break: 10:00 am – 10:30 am

Session THA2:
Microsystems Applications

Chairs: Terho Kultilainen, Selmic Oy; Brigitte Braux, EADS Astrium
10:30 am – 12:10 pm

Session THA3:
Direct Write Technology

Chairs: Paul Clem, Sandia National Laboratories; Soshu Kirihara, Osaka University
10:30 am – 12:10 pm

Mixed LTCC and LTTT Technology for Microplasma Generator Fabrication
Roberto Katsuhiro Yamamoto, Mario Ricardo Gongora-Rubio, Marcio Rodrigues da Cunha, Rodrigo S. Pessoa, Homero S. Maciel, Faculdade de Tecnologia de São Paulo (FATEC-SP)

Thick-Film Resistors as Strain Gauges for Mechanical Sensors
Uwe Partsch, Christel Kretzschmar, Horst Griessmann, Fraunhofer IKTS

Sensor Hybrid Circuit for Imaging Applications Based on LTCC
Rainer Dohle, Christian Zeilmann, Jörg Goßler, Micro Systems Engineering GmbH

Hermetic Package for Optical MEMS
Frank Seigneur, Yannick Fournier, Thomas Maeder, Jacques Jacot, Peter Ryser, Laboratoire de Production Microtechnique, Ecole Polytechnique Fédérale de Lausanne

Operation of Wireless Sensor Modules Inside Hermetically Enclosed Conductive Envelopes Applying Low Temperature Co-fired Ceramics Substrates
Luong Ngo, Helmut Seidel, Ulrich Schmid, Saarland University; Martin Kluge, Josef Schalk, EADS Innovation Works

Nanoparticle Dispersed Soft-Colloidal Gels for Material Direct Writing
Hiroya Abe, Jun Akedo, Osaka University

Ink-Jet Printing Processed Mesoporous Silica Microdots Arrays: New Possible Platforms for the Design of Multifunctional Sensors
Bruno Fousseret, Marion Mougenot, Martine Lejeune, Fabrice Rossignol, Jean-François Baumard, Bernard Soulestin, Ecole Nationale Supérieure de Céramique Industrielle; Cédric Boissière, Clément Sanchez, Laboratoire de Chimie de la Matière Condensée, UPMC; Dominique Jalabert, Centre de Microscopie Electronique, Université d’Orléans; Dominique Massiot, Centre de Recherches sur les Matériaux à Haute Température

Characterisation of the Dispersion Process of Functional Ink-Jet Inks
Ulrike Currle, Robert Moebius, Klaus Krueger, Helmut-Schmidt-University/ University of the German Armed Forces

Fabrication of Conductive Patterns by Inkjet Printing of Silver Nano-suspension
Hsin-Hung Chou, Ming-Hsiu Tsai, Weng-Sing Hwang, National Cheng Kung University

Laser Assisted Ink-Jet Printing for Metal Wiring on Glass Substrate
Akito Endo, Youngkyu Park, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

 

Closing Remarks: 12:10 pm



Register On-line


Hotel Reservations

Holiday Inn Munich – City Center
Hochstrasse 3
81669, Munchen, Germany

EUR 120.00 single, EUR 140.00 double
Rooms on hold April 19 – 24, 2008

For internet based reservations, go to: http://www.ichotelsgroup.com/h/d/hi/925/en/hd/muchb and use CIC as booking code.

Hotel Front Desk: 49-89-48030 or 1-888-465-4329 (Holiday Inn Main Line)
For phone reservations, please reference CICMT - Ceramic Interconnect Conference to receive the special group rate.

 

 

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>