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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 5th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2009)

The Curtis Hotel
Denver, Colorado - USA
April 21 - 23, 2009

General Co-Chairs:
Technical Program Co-Chairs:

Michael Lanagan
Penn State University
mlanagan@psu.edu

Jun Akedo
AIST
akdeo-j@aist.go.jp

Amy Moll
Boise State University
amoll@boisestate.edu

Takaaki Tsurumi
Tokyo Institute of Technology
ttsurumi@ceram.titech.ac.jp

Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de



Advance Program

Early Registration and Hotel Deadline: March 20, 2009

Register On-Line
Download Advance Program PDF | Hotel Information | Speaker Information
Tabletop Exhibit Information | Reserve Booth On-line


Tuesday, April 21

Registration: 7:30 am – 7:30 pm

Continental Breakfast: 7:30 am – 8:15 am

Exhibit Hours: 10:00 am – 7:30 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 8:15 am – 8:30 am
Conference Chairs

Keynote Presentations: 8:30 am – 9:00 am
Development of an H/LTCC-Based HPLC (High Pressure Liquid Chromatography) Microfluidic Consumable
Geoff Gerhardt, Walters Corporation

Keynote Presentations: 9:00 am – 9:30 am
Advanced Electro-Ceramics: Present and Future Prospect
Y. Sakabe, Murata Corporation

Keynote Presentations: 9:30 am – 10:00 am
TITLE TBD
Walter Smetana, Vienna University of Technology

Break in Exhibit Hall: 10:00 am – 10:30 am
Session TA1:
Deposition Techniques, ALD, Molecular Deposition, Aerosol Deposition
Chairs: Y. C. Lee, University of Colorado at Boulder; Alexander Michaelis, Fraunhofer Institute for Ceramic Technologies and Systems
10:30 am – 12:10 pm

Session TA2:
Direct Write Technology
Chairs: Christopher A. Apblett, Sandia National Laboratories; Seung-Hyun Kim, INOSTEK Inc.
10:30 am – 12:10 pm

Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) for Barrier Coatings on Polymers
Dragos Seghete, Shih-Hui Jen, Jacob A. Bertrand, Steven M. George, University of Colorado

Defect Inspection of ALD/MLD-Based Barrier Coatings
Yadong Zhang, Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Shih-Hui Jen, Ronggui Yang, Martin L. Dunn, Steven M. George, Y. C. Lee, University of Colorado at Boulder

Mechanical Robustness of ALD/MLD-Based Barrier Coatings
David C. Miller, Ross R. Foster, Yadong Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M. George, Martin L. Dunn, University of Colorado

Flexible Thermal Ground Plane Enabled by ALD/MLD-Based Barrier Coatings
Ching-Yi Lin, Ronggui Yang, Y. C. Lee, Aziz Abdulagatov, Steven M. George, University of Colorado at Boulder

(Ba0.6,Sr0.4)TiO3 Thick Films Deposited by Aerosol Deposition Method for Multi-Layered Capacitor Applications
Daniel Popovici, Hiroki Tsuda, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

Omnidirectional Printing of Flexible, Spanning, and Stretchable Silver Microelectrodes
Jennifer A. Lewis, Bok Y. Ahn, Eric B. Duoss, Michael J. Motala, Xiaoying Guo, Sang-Il Park, Yujie Xiong, Jongseung Yoon, Ralph G. Nuzzo,  John A. Rogers, University of Illinois at Urbana-Champaign

Colloidal Gels Induced at Room Temperature for Direct-Writing of Artificially Engineered Materials
Hiroya Abe, Soshu Kirihara, Jun Akedo, Osaka University

Direct Write of Metals and Functional Materials for Three-Dimensional Interconnects and Antennas
Paul G. Clem, James F. Carroll, Adam W. Cook, Eric D. Branson, Christopher A. Apblett, Sandia National Laboratories

High Aspect Patterning of Ag Fine Line by a Laser Assisted Ink-Jet Printing
Jun Akedo, Akito Endfo, National Institute of Advanced Industrial Science and Technology

Inkjet Printing of Post-Fired Thick-Film Capacitors
Marcel Wassmer, Waldemar Diel, Klaus Krueger, Helmuth Schmidt University

Lunch in Exhibit Hall: 12:10 pm – 1:40 pm (Lunch served 12:10 pm – 1:10 pm)

Session TP1:
Ceramic Actuators in Microsystems (Piezoelectrics Materials and Devices)
Chairs: Ken Peterson, Sandia National Laboratories; Fred Barlow, University of Idaho
1:40 pm – 3:20 pm

Session TP2:
Nanoprocessing and Co-Firing and Dimensional Control
Chairs: Yoshihiko Imanaka, Fujitsu Limited; Daniel S. Krueger, Honeywell FM&T; Minoru Osada, National Institute for Materials Science
1:40 pm – 3:20 pm

Piezoelectric Single Crystal PMN-PT: Field-Induced Actuation at Temperature
James F. Carroll III, D. A. Payne, J. Tian, P. Han, Sandia National Laboratories

PZT Thick Films for MEMS Applications by Lithographically Structured Electrophoretic Deposition
Stefan Schimpf, Bertram Schmidt, Otto-von-Guericke University

A High Flow Piezoelectric Ceramic Choke for an Adaptive Vehicle Gas Spring Damper Manufactured by Ceramic Injection and Ceramic Insert Molding
Matthias Hartmann, Frank Baerecke, Roland Kasper, Bertram Schmidt, University of Magdeburg (IMOS)

LTCC Electromechanical Devices Based on PZT Thick Film Technology
Tomasz Zawada, Rasmus Lou-Moeller, InSensor A/S; Karsten Hansen, Erling Ringgaard, Ferroperm Piezoceramics A/S; Dominik Jurkow, Leszek Golonka, Wroclaw University of Technology

Enhanced Structure Stabilization and Piezoelectric Properties of PZT Thin Films for MEMS Applications
Seung-Hyun Kim, C. Y. Koo, D-H. Ryu, Brian L. Wardle, Angus I. Kingon, INOSTEK Inc.

Highly Enhanced Dielectric Properties of Metal-Dielectric Nanocomposites Prepared by Aerosol Deposition Method
Jae-Hyuk Park, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

Fabrication of High-K Dielectric Nanofilms using Solution-Based Bottom-Up Nanotechnology
Minoru Osada, Takayoshi Sasaki, National Institute for Materials Science

Effect of PAS System on Constrained Sintering of Large and Thick Size Ceramic Substrate
Byeung Gyu Chang, Kipyo Hong, Yongsuk Kim, WonHee Yoo, Yongsoo Oh, Samsung Electro-Mechanics Co., Ltd.; Torsten Rabe, Federal Institute for Materials Research and Testing (BAM)

Pressure Sintering of LTCC-Modules with Integrated Ferrite Layers
Carsten Glitzky, Torsten Rabe, Jörg Töpfer, Christina Modes, Annette Kipka, Federal Institute for Material Research and Testing (BAM)

Predicting LTCC Firing Shrinkage:A Response Surface Analysis Study
Michael Girardi, Gregg Barner, Cristie Lopez, Brent Duncan, Larry Zawicki, Honeywell Federal Manufacturing and Technologies

Break in Exhibit: 3:20 pm – 3:50 pm

Session TP3:
Microsystems Materials and Processes
Chairs: Donald Plumlee, Boise State University; Charles Lewinsohn, Ceramatec, Inc.
3:50 pm – 5:50 pm

Session TP4:
High Frequency Characterization and Simulation
Chairs: Michael Janezic, NIST; Jack Casey, Agilent
3:50 pm – 5:10 pm

Thick Film Ceramic Chip Packaging for Hearing Aids
John Dzarnoski, Doug Link, Starkey Laboratories, Inc.

Micro-Patterning of Green Tape Ceramic using Powderblasting for LTCC Packaging
Yves Lacrotte, Farid Amalou, Weixing YuMarc, P. Y. Desmulliez, Heriot-Watt University

Material Behavior of Low Temperature Co-Fired Ceramics at Elevated Temperatures and its Impact on Applications
Christian Bienert, Andreas Roosen, University of Erlangen-Nuremberg

Silver in LTCC - Interfacial Reactions, Transport Processes and Influence on Properties of Ceramics
Torsten Rabe, Carsten Glitzky, Hamid Naghib-zadeh, Gabriele Oder, Markus Eberstein, Federal Institute for Materials Research and Testing (BAM)

Structuring of Green Sheets and Laminates for Multilayer Ceramic Microsystems with a Combined Laser and Punching Machine
Gunter Hagen, KMS Technology Center GmbH; Uwe Partsch, Fraunhofer IKTS

Development of NITE-SiC/SiC Composite Compact Intermediate Heat Exchanger
Tatsuya Hinoki, Yi-Hyun Park, Satoshi Konishi, Kyoto University

Bismuth Pyrochlore Based Dielectric Thin Films for Tunable Applications
Wei Ren, Peng Shi, Xiaohua Zhang, Xin Yan, Xiaoqing Wu, Xiaofeng Chen, Xi Yao, Xi'an Jiaotong University

Fabrication of Terahertz Wave Resonators of Twinned Photonic Crystals with Alumina Diamond Lattices by using Micro-Stereolithography
Toshiki Niki, Soshu Kirihara, Osaka University

Size Effect and Domain Contribution in Barium Titanate
Takaaki Tsurumi, Takuya Hoshina, Hiroaki Takeda, Tokyo Institute of Technology

Antenna Concepts for Ceramic Multilayer Modules
Peter Uhlig, Sybille Holzwarth, Matthias Geissler, IMST GmbH



Reception in Exhibit Hall: 6:00 pm – 7:30 pm


Wednesday, April 22

Registration: 7:30 am – 5:00 pm

Continental Breakfast: 7:30 am – 8:30 am

Exhibit Hours: 10:00 am – 4:00 pm
Refreshment Break & Lunch in Exhibit Hall

Session WA1:
International Session on Microsystems
Chairs: Leszek Golonka, Wroclaw University of Technology; Karl-Heinz Drüe, Technical University of Ilmenau
8:30 am – 10:00 am

Liquid Phase Morphology Control and Patterning of Metal Oxides -TiO2, ZnO, BaTiO3, Eu:Y2O3-
Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)

Materials Tectonics by Structural Joinings: Fabrication of Ceramics Micro Patterns with Dielectric Polygon Tablets for Terahertz Wave Resonations by Using Stereolithography
Soshu Kirihara, Noritoshi Ohota, Toshiki Niki, Masaru Kaneko, Osaka University

Thick-Film Pressure / Force Sensors on Different LTCC Substrates; a Characterization and Evaluation
Marija Kosec, Marko Hrovat, Darko Belaviè, Hana Uršiè, Jaroslaw Kita, Janez Holc, Silvo Drnovšek, Jena Cilenšek, Josef Stefan Institute

Break in Exhibit Hall: 10:00 am – 10:30 am

Session WA2:
Design and Fabrication of Ceramic Microsystems and Devices
Chairs: Torsten Rabe, Federal Institute for Materials Research and Testing (BAM); Thomas Maeder, Ecole Polytechnique Fédérale de Lausanne
10:30 am – 12:10 pm

Session WA3:
Processing and Design of Integrated Passives in LTCC
Chairs: Richard Eitel, University of Kentucky; Jerry Aguirre, Kyocera America Inc.
10:30 am – 12:10 pm

LTCC Flow-Through Amperometric Detector for Glucose Determination
Karol Malecha, Dorota Pijanowska, Leszek Golonka, Piotr Kurek, Wroclaw University of Technology

Remote Controlled Valves for Flow Control in LTCC-Based Microfluidic Devices
Richard E. Eitel, Wenli Zhang, Nitin S. Satarkar, J. Zach Hilt, University of Kentucky

Fabrication Technology of Micro SOFCs and Modules
Toshio Suzuki, Y. Funahashi, T. Yamaguchi, Y. Fujishiro, M. Awano, National Institute of Advanced Industrial Science and Technology

Design and Analysis of a Micro-Combustion Device in LTCC
Matthew H. McCrink, Don Plumlee, Boise State University

Structuration of Thin Bridge and Cantilever Structures in LTCC / Thick-Film Technology using Mineral Sacrificial Materials
Thomas Maeder, Caroline Jacq, Yannick Fournier, Wassim Hraiz, Peter Ryser, Ecole Polytechnique Fédérale de Lausanne

Synthesis and Characterization of (Bi1/2A1/2)-Modified BaTiO3(A=Na, K) Semiconducting Ceramics
Hiroaki Takeda, Takuya Hoshina, Takaaki Tsurumi, Tokyo Institute of Technology

Low Fired X7R Dielectrics Buried into LTCC Substrates
Hamid Naghib-zadeh, Carsten Glitzky, Torsten Rabe, Federal Institute for Materials Research and Testing (BAM)

Fabrication of Capacitor Embedded LTCC Substrate for RF Applications
Ki Pyo Hong, Yong Seok Choi, Seung Gyo Jeong, Ji Hwan Shin, Byeung Gyu Chang, Samsung Electro-Mechanics

Highly Integrated Passive LTCC Device with Embedded High-k Capacitors
Jens Müller, Rubén Perrone, Polina Kapitanova, Dmitry Kholodnyak, Irina B. Vendik, Stefan Humbla, Matthias A. Hein, TU Ilmenau, ZIC MacroNano®

Defects Affecting Dielectric Properties of BaTiO3 Films in Applying Aerosol Deposition Method to Thin Film Process
Song-Min Nam, Jong-Min OH, Kwangwoon University

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm
WP1:
Interactive Forum (Poster Session)
One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.
Chair: Jack Casey, Agilent
1:30 pm – 3:30 pm

Erosion of Low-Temperature Co-Fired Ceramics in a Radio Frequency Inductively Coupled Plasma
Alex Miller, Donald Plumlee, Jim Browning, Amy Moll, Boise State University

Measurement and Simulation of Interdigital Capacitor Structures with High-Permittivity Thin Films
Clinton P. Scarborough, Steve Perini, Joshua Robinson, George Semouchkin, Michael Lanagan, Penn State University

3-D Si Chip Stacking and Interconnection Process using Through-Si-Via
Wonjoong Kim, Ji Heon Jun, Hee Yul Lee, In Rak Kim, Young Gon Lee, Jae Pil Jung, University of Seoul

Continuous Flow Polymerase Chain Reaction in Low Temperature Co-Fired Ceramics
Andrew Vissotski, Don Plumlee, Amy Moll, Boise State University

Fabrication of 6063 Al/60SiC-35Al-5Si Graded Multilayer Electronic Packaging Materials by Spark Plasma Sintering
Lianmeng Zhang, Wuhan University of Technology

Fabrication and Characteristics Dielectric Film by using Plasma Assisted Aerosol Deposition Method
Masakazu Mori, Naoki Akita, So Baba, Jun Akedo, Ryukoku University

Micro-Reactor in LTCC Technology for Biodiesel Production
Mário Ricardo R. Gongora-Rubio, Marcio Rodrigues da Cunha, Adriano Marim Oliveira, Instituto de Pesquisas Tecnológicas do Estado de São Paulo

Adhesive Bonded Joints of Ceramic Fiber Composites for High Temperature
Vijay K. Srivastava, Shraddha Singh, Banaras Hindu University

Break in Exhibit Hall: 3:30 pm – 4:00 pm

WP2:
LTCC Standards Initiative
Chairs: Howard Imhof, Metalor; Mike Ehlert, Barry Industries
4:00 pm – 5:30 pm

LTCC Standards SIG
Michael R. Ehlert, Barry Industries Inc.

LTCC Standards vs. iNEMI RoadMap - A Match Made in Heaven?
Michael R. Ehlert, Barry Industries Inc.; Howard Imhof, Metalor Technologies USA

LTCC Standards Progress
Michael R. Ehlert, Barry Industries Inc.

 

Thursday, April 23
Registration: 7:30 am – Noon

Continental Breakfast: 7:30 am – 8:30 am

Session THA1:
Advanced Packaging Technology
Chairs: Martin Oppermann, EADS Deutschland GmbH; Paul Collander, Poltronic
8:30 am – 10:30 am

IEEE LTCC STANDARDS WORKING GROUP (P1787)
Moderators: Mike Smith; Marian Hargis, Delphi Electronics and Safety; Mike Ehlert, Barry Industries Inc.
8:30 am - 12:00 pm

Investigation on the Porosification Behaviour of Ffired LTCC Substrates
Achim Bittner, H. Seidel, R. Kautenburger, A. Roosen, U. Schmidt, Saarland University

Packaging of a MEMS Optical Switch During Developmental Testing
Thomas P. Swiler, Kenneth A. Peterson, Ernest J. Garcia, Sandia National Laboratories

UV-Laser Drilled µ-Vias in Dielectric Layers on LTCC as Part of a Build-Up Technology for High Density Interconnections
Karl-Heinz Drüe, Jens Müller, Technical University of Ilmenau

Measurement and Performance of Embedded LTCC Inductors Utilizing Full Tape Thickness Feature Conductors
Adam Boutz, William B. Kuhn, Kansas State University

Photoformable Thick Film Dielectric Process Optimization for Reduced Via Size
Doug Link, Starkey Laboratories, Inc.; Mike Skurski, E.I. DuPont de Nemours & Co., Inc.

Improved Isolation for LTCC Transceiver Modules using Full-Tape-Thickness Features
Ken A. Peterson, Rick Knudson, Brian Duverneay, Sandia National Laboratories; Gregg Barner, Frank Smith, Honeywell Federal Manufacturing & Technology

The IEEE LTCC Standards Working Group (P1787) is responsible for writing the standard for measuring LTCC materials at high frequency and will be meeting to discuss the candidacy forms, balloting and voting procedures for electing the officers for the Working Group. In addition, the committee will review the document format required by the IEEE Standards Association.

Three subcommittees have been formed to write three substandard.  The first subgroup is Measurement of Unmetallized LTCC chaired by Mike Smith. The second, Measurement of Metallized LTCC is chaired by Marian Hargis and the third group, Test Measurements Standard for thermo-physical properties of LTCC is led by Mike Ehlert.

During this session, the members will review the test procedures being written by the subcommittees, metallized, and unmetallized and thermo-physical properties of LTCC.

 

Session THA2:
LTCC University Consortium Meeting
Chairs: W. Kinzy Jones, Florida International University; Amy Moll, Boise State University
10:30 am - 12:00 pm

Organization meeting to discuss the creation of a university network similar to MEMS exchange where university and industrial researchers could access LTCC labs in the network - either for an entire fabrication process or just for one piece of equipment.

For example:
If Boise State needed something isostatically laminated, they could send it to Florida International University to have it done for a very reasonable cost.

 

Conference Closing Remarks: 12:00 pm

Lunch: 12:00 pm - 1:30 pm
(Not Provided - On Your Own)

NIST Dielectric Measurement Tutorial
Instructor: Dr. Michael Janezic, NIST
1:30 pm - 4:00 pm

The IEEE LTTC Standards Working Group (P1787) is currently developing a series of standard test methods and best practice guides to support the LTCC industry. A key component will be the standardization of high-frequency techniques to measure the broadband dielectric properties of LTCC substrates. To support this effort, the National Institute of Standards and Technology (NIST) have developed new measurement methods to characterize the high-frequency dielectric properties of unmetallized LTCC substrates. In this tutorial, Dr. Michael Janezic, a member of NIST Advanced Materials Metrology Project, will summarize the state-of-the-art nondestructive dielectric measurement techniques and overview the latest measurement procedures in a series of live dielectric substrate measurement demonstrations.



Register On-Line | Hotel Reservations

 

 

 

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