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IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society
IMAPS Germany
Ilmenau University of Technology
MacroNano DKG - German Ceramics Society

IMAPS/ACerS 8th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2012)

April 16-19, 2012
Radisson Blu Hotel
Erfurt, Germany

Early Registration Deadline: March 2, 2012

General Co-Chairs:
Jens Müller
Technical University Ilmenau
jens.mueller@imaps.de
Rich Eitel
University of Kentucky
reitel@engr.uky.edu
Technical Program Co-Chairs:
Soshu Kirihara
Osaka University
kirihara@jwri.osaka-u.ac.jp
Marija Kosec
Jozef Stefan Institute
marija.kosec@ijs.si
Alexander Michaelis
Fraunhofer IKTS
alexander.michaelis@ikts.fraunhofer.de
Program Committee:

Andreas Roosen (University of Erlangen-Nuremberg), Heinz Osterwinter (HS Esslingen), Jörg Töpfer (FHS Jena), Thomas Rabe (BAM Berlin), Sebastian Brunner (EPCOS), Thomas Bartnitzek (Micro-Hybrid Electronic GmbH), Rubén Perrone (MSE GmbH)

Editor - IMAPS Journal
Fred Barlow
University of Idaho
fbarlow@uidaho.edu



Register On-Line
Download Final Program PDF |
Hotel Information | Speaker Information
Tabletop Exhibit Information | Sponsorship Information


Message from the General Co-Chairs...
After two successful meetings abroad held in Munich and Tokyo, it was decided to take the International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) back to Germany. This year the CICMT will be held in the capital of the state Thuringia which is also called the Green Heart of Germany. Thuringia itself has a long history in the glass and ceramic industry including the production of electro ceramics dating back to the late 19th century.

The conference is organized under the joint sponsorship of the International Microelectronics And Packaging Society (IMAPS),The American Ceramic Society (ACerS), IMAPS Deutschland, the Institute of Micro- and Nanotechnologies MacroNano® of Ilmenau University of Technology, the Deutsche Keramische Gesellschaft (DKG) and Mikro-Nano-Thüringen e.V. This year’s CICMT runs in conjunction with the 3rd International MacroNano-Colloquium sponsored by the Thuringian Ministry of Education, Science and Culture. The colloquium program fills the last half day with an emphasis on functional materials and high frequency characterization.

We thank our session chairs, who were very active and successful in recruiting speakers from all over the world. Thanks to their commitment we have three days filled with more than 120 papers and posters.

In addition we’d like to thank the technical co-chairs, Marija Kosec (Jozef Stefan Institute), Soshu Kirihara (Osaka University) and Alexander Michaelis (Fraunhofer IKTS), the IMAPS staff, the conference management team of Ilmenau University of Technology and the CICMT local committee: Andreas Roosen (University of Erlangen-Nuremberg), Heinz Osterwinter (HS Esslingen), Jörg Töpfer (FHS Jena),Torsten Rabe (BAM Berlin), Sebastian Brunner (EPCOS), Thomas Bartnitzek (Micro-Hybrid Electronic GmbH), and Rubén Perrone (MSE GmbH) for their support and leadership in putting this program together.

This year's keynote speakers will focus on the electro-ceramic traditions in Thuringia and the perspective of electro-ceramics in Japan and Europe.

Do not miss THE Ceramic Interconnect and Ceramic Microsystems Technologies event in Erfurt, April16 - 19, 2012.

Jens Müller, Technical University Ilmenau and Rich Eitel, University of Kentucky


Monday, April 16
Registration: 4:00 pm – 7:00 pm

Welcome Reception: 6:00 pm – 7:00 pm


Tuesday, April 17
Registration: 7:30 am – 7:30 pm

Exhibit Hours: 10:00 am – 7:30 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 8:15 am – 8:30 am
Conference Chairs

Keynote Presentation: 8:30 am – 9:00 am
Ceramic Industrial Technology in Thuringia - From Tradition to the Future
Baerbel Voigtsberger, Fraunhofer IKTS, Hermsdorf

Keynote Presentation: 9:00 am - 9:30 am
History and Future Prospect of Electro Ceramics in Japan and Asia
Hiroshi Takagi, Murata Mfg. Co., Ltd., Yasu-shi, Japan

Keynote Presentation: 9:30 am - 10:00 am
Advanced High Frequency LTCC Technology for Applications Beyond 60GHz
Sebastian Brunner, EPCOS OHG

Break in Exhibit Hall: 10:00 am – 10:30 am
Session TA1:
Ceramic Based Power Electronics
Chairs: Richard Matz, Siemens München; Fred Barlow, University of Idaho
10:30 am – 12:10 pm

Session TA2:
Direct Write Technology
Chairs: Soshu Kirihara, Osaka University; Klaus Krüger, Helmut Schmidt University
10:30 am – 12:10 pm

005: Glasses and Glass Ceramics as Dielectrics for High Power Electronics
M. Letz, Schott AG

109: Evaluation of Direct Bond Aluminum Substrates for Power Electronic Applications in Extreme Environments
Fred Barlow, Brian Patterson, Aicha Elshabini, University of Idaho

090: Silver Processing in Thick Film Technology for Power Electronics
Markus Eberstein, Claudia Feller, Thomas Seuthe, Martin Ihle, Steffen Ziesche, Frieder Gora, Fraunhofer IKTS

112: High Current Conductors in LTCC
Steffen Ziesche, Martin Ihle, Markus Eberstein, Fraunhofer IKTS

085: Characterisation of Test Vehicle for In-Situ Measurement of Die Attach Thermal Conductivity
Conor Slater, Fabrizio Vecchio, Thomas Maeder, Peter Ryser, Ecole Polytechnique Federale de Lausanne

097: Determination of the Stability of Low Viscous Particle Inks
Ulrike Currle, AKAD. Die Privathochschulen-GmbH

072: Inkjetprinting of Multilayer Capacitors
Dietrich Jeschke, Elko Ahlfs, Klaus Krueger, University of the Federal Armed Forces Hamburg

095: Inkjet Printing Technology: A Novel Bottom-Up Approach for Multilayer Ceramic Components and High Definition Printed Electronic Devices
C. Dossou-Yovo, Martine Lejeune, M. Mougenot, N. Bernardin, CERADROP

111: YAG Laser Assisted Ink Jet Printing for Fine Ag Wiring
Akito Endo, Hiroki Tsuda, Jun Akedo, National Institute of Advanced Industrial Science and Technology

056: Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
Martin Ihle, Uwe Partsch, Sindy Mosch, Fraunhofer Institute for Ceramic Technologies and Systems

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm
 

 

Session TP1:
Advanced Packaging Technology

Chairs: Martin Oppermann, EADS Deutschland GmbH; Siegfried Voigt, DLR Space Administration
1:20 pm – 2:20 pm


Session TP2:
Metamaterials and 3D-Nanostructuring

Chairs: Michael Lanagan, Pennsylvania State University; Paul Clem, Sandia National Laboratories
1:20 pm – 3:00 pm

Session TP3:
Emerging Technologies

Chair: Brigitte Braux, EADS
1:20 pm – 3:00 pm

013: Shielded and Robust LTCC BGA-Interconnect for Ka-Band Satellite Flight Hardware
Tobias Klein, Carsten Günner, Reinhard Kulke, IMST GmbH

094: Steps Towards a Novel Cost Efficient Low Weight LTCC Packaging Technology for High End RF Applications
Franz Bechtold, VIA Electronic GmbH

088: LTCC Antenna Array with Integrated Liquid Crystal Phase Shifter for Satellite Communication
Andreas Heunisch, Bärbel Schulz, Torsten Rabe, Federal Institute of Materials Research and Testing; Sebastian Strunck, TU Darmstadt; Rüdiger Follmann, IMST; Atsutaka Manabe, Merck

055: Microwave Dielectric Metamaterials: Influence of Dielectric Loss and Permittivity Variation on Metamaterial Performance
Paul G. Clem, M. P. Rye, E. S. Kim, C. J. Jeon, Sandia National Laboratories

022: All-Dielectric Metamaterials for New Areas of Applications
Elena Semouchkina, George Semouchkin, Michigan Technological University; Michael Lanagan, Pennsylvania State University

036: Recent Advances in Practical Metamaterial Engineering
Khalid Z. Rajab, Max Munoz, Yifeng Fan, Di Bao, Yang Hao, Queen Mary University of London

113: Creation of Titania Artificial Interfaces with Geometric Patterns by Using Micro Stereolithography and Aqueous Solution Techniques
Soshu Kirihara, Yousuke Itakura, Satoko Tasaki, Osaka University

057: Template-Based Surface Nano-Patterning and Device Applications
Yong Lei, Liaoyong Wen, Fabian Grote, HuaPing Zhao, University of Muenster & Technical University of Ilmenau

087: Direct Filament Formation of Biological Carbon Nanotube Suspensions
Hiroya Abe, Osaka University

054: Depth of Laser Etching in Green State LTCC
Krzysztof Zaraska, Monika Machnik, Adam Bienkowski, Beata Synkiewicz, Institute of Electron Technology

069: Inkjet Printing as Technology for In-Situ Blending of Thick-Film Resistor Inks
Marcel Wassmer, Waldemar Diel, Klaus Krueger, Helmut-Schmidt-University

121: Fabrication of Oxide Ceramics Dendrites for Porous Electrodes by Using Stereolithography
Satoko Tasaki, Naoki Komori, Soshu Kirihara, Osaka University

024: SiCer - A Substrate to Combine Ceramic and Silicon Based Micro Systems
Michael Fischer, T. Mache, B. Pawlowski, D. Schabbel, J. Müller, Ilmenau University of Technology, Institute of Micro- and Nanotechnologies MacroNano®

Break in Exhibit: 3:00 pm – 3:30 pm

Session TP4:
LTCC Sensor Technology

Chairs: Hiroshi Talagi, Murata Mfg. Co.; Leszek Golonka, Wroclaw University
3:30 pm – 5:30 pm

Session TP5:
Nanoprocessing and Integration

Chair: Yoshihiko Imanaka, Fujitsu Laboratories Limited
3:30 pm – 5:30 pm

Session TP6:
Design and Fabrication of Ceramic Microsystems and Devices I

Chair: Torsten Rabe, Federal Institute for Materials Research and Testing (BAM)
3:30 pm – 5:10 pm

063: High Frequency Approaches for LTCC Based Sensors
Michael Lanagan, Pennsylvania State University

010: Design, Fabrication and Operation of a Nitrogen Monoxide Measurement Device Based on LTCC
Thomas Geiling, Tilo Welker, Jens Müller, Ilmenau University of Technology

086: LTCC Substrates for High Performance Strain Gauges
Bjoern Brandt, Marion Gemeinert, Torsten Rabe, Federal Institute for Materials Research and Testing (BAM); Ralf Koppert, SiegertTFT; Jochen Bolte, Bizerba

076: Micro Fluidic Mass Flow Sensor Concept for Functional Ceramic Circuits
Christian Zeilmann, T. Haas, Micro Systems Engineering GmbH; U. Schmid, Vienna University of Technology

058: New Generation of Dew Point Sensors Based on LTCC Substrate with Decoupeld Contact System
Arndt Steinke, Mike Schneider, Wolf Hummel, Armin Heymel, CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH; Thomas Bartnitzek, VIA Electronic GmbH

003: Development and Characterization of Glass Matrix Composites as Porous Coating Film of a Solid-State Reference Electrode
Claudia Feller, Stefan Furche, Markus Eberstein, Fraunhofer-Institut for Keramische Technologien und Systeme


007: Integrated Microwave Noise Suppressor Fabricated on Magnetic/Dielectric Composite Ceramic Substrate
Liangliang Li, Zheng Chen, Yanqiu Li, Tsinghua University

018: Size Effect Investigation on Nano-Scale Ferroelectric and Piezoelectric Ceramic Materials
Longtu Li, Xiaohui Wang, Hui Zhang, Shaopeng Zhang, Tsinghua University

099: Recent Progress in the Shaping and Sintering of Barium Titanate Nanoparticles Application to High Permittivity Capacitors
Sophie Guillemet-Fritsch, Christophe Voisin, Roman Nava Quintero, Pascal Dufour, Christophe Tenailleau, Juan Antonio Aguilar Garib, Martin Edgar Reyes Melo, Bernard Durand, CIRIMAT/CNRS

053: Room-Temperature Fabrication for Functional Oxide Nanofilms Using Oxide Nanosheets
Minoru Osada, Takayoshi Sasaki, National Institute for Materials Science

114: Post-LTCC Technology for Microelectronics Packaging Application
Yoshihiko Imanaka, Hidenori Amada, Fumiaki Kumasaka, Fujitsu Laboratories Ltd.

118: Low Temperature Growth of Oxide Thin Films by Photo Reaction of Nanoparticles
Tetsuo Tsuchiya, Tomohiko Nakajima, Kentaro Shinoda, National Institute of Advanced Industrial Science and Technology (AIST)


017: Ultraviolet LED Multi-Chip Module Based on Ceramic Substrate
Thomas Burkhardt, Marcel Hornaff, Anne Acker, Thomas Peschel, Erik Becker, Karl-Heinz Suphan, Karsten Mensel, Stephan Jirak, Ramona Eberhardt, Andreas Tünnermann, Fraunhofer IOF

023: Metal-Based Optical MEMS Scanning Devices using Lead-Free Piezoelectric Sheets Prepared by Aerosol Deposition
Jae-Hyuk Park, Jun Akedo, National Institute of Advanced Industrial Science and Technology (AIST)

106: Characterization of the Fabrication Process of Rolled LTCC Structures
Kelci Parrish, Jesse Taff, Mallory Yates, Derek Reis, Donald Plumlee, Boise State University

033: Optimized Cavities for Microwave Applications using the New Low Loss LTCC Material Du Pont 9k7
Alexander Schulz, Tilo Welker, Nam Gutzeit, Jens Müller, Ilmenau University of Technology

037: Realisation of Large Cavities in Multilayer Ceramics by Cold-Low-Pressure-Lamination and Their Characterisation by µ-CT
Ulrike Deisinger, Tobias Fey, Andreas Roosen, University of Erlangen-Nuremberg


Reception in Exhibit Hall: 6:00 pm – 7:30 pm

 


Wednesday, April 18

Registration: 7:30 am – 4:30 pm

Exhibit Hours: 10:00 am – 4:30 pm
Refreshment Break & Lunch in Exhibit Hal

 

Session WA1:
Ceramic Microsystems and Energy Systems
Chairs: Alexander Michaelis, Fraunhofer IKTS; Rubén Perrone, MSE GmbH, Berg
8:20 am – 10:00 am
Session WA2:
Microsystems Materials and Properties I
Chairs: Longtu Li, Tsinghua University; Andreas Roosen, University of Erlangen-Nuremberg
8:20 am – 10:00 am

026: An Evaluation of Thick-Film Silver as Micro Solid Oxide Fuel Cells (micro-SOFCs) Interconnection Packaging Materials
Bo Jiang, Paul Muralt, Thomas Maeder, Ecole Polytechnique Federale de Lausanne

079: Development of Thin-Film Manufacturing Technologies for Solid Oxide Fuel Cells and Gas Separation Membranes
Norbert H. Menzler, Feng Han, Tim van Gestel, Wolfgang Schafbauer, Falk Schulze-Küppers, Sven Uhlenbruck, Wilhelm A. Meulenberg, Hans Peter Buchkremer, Forschungszentrum Juelich, IEK-1

039: Stack of Planar Double-Sided Solid Oxide Fuel Cells
Zbigniew Magonski, Barbara Dziurdzia, Henryk Jankowski, Jan Koprowski, Dorota Szwagierczak, Jan Kulawik, AGH University of Science and Technology, Department of Electronics

084: Design of LTCC Structure for Micro Ceramic Combustor
Darko Belavic, Marko Hrovat, Kostja Makarovic, Marina Santo Zarnik, Janez Holc, Centre of Excellence NAMASTE; Gregor Dolanc, Jozef Stefan Institute

066: Fab in a Package: LTCC Microfluidic Devices for Micro and Nanoparticle Fabrication
Mario Ricardo Gongora-Rubio, Kellen Heloizy Garcia Freitas, Juliana de Novais Schianti, Adriano Marim de Oliveira, Natália Neto Pereira Cerize, Maria Helena Ambrosio Zanin, Instituto De Pesquisas Tecnologicas Do Estado De Sao Paulo

008: Novel Glass Free Ceramic for LTCC Applications
Dhanesh Thomas, M. T. Sebastian, NIIST-CSIR

011: Properties of Glass-Less Photoimageable Paste for Multilayer LTCC Structures Fabrication
Piotr Markowski, Elżbieta Zwierkowska, Malgorzata Jakubowska, Konrad Kiełbasiński, Steve Muckett, Wroclaw University of Technology

016: Flexography Printing of Silver Tracks on LTCC Tapes - Conductivity Measurements After Sintering in Normal Atmosphere
Rita Faddoul, Nadège Reverdy-Bruas, Anne Blayo, Grenoble INP - LGP2 (Pagora)

052: Gas Permeation Measurements on Low Temperature Cofired Ceramics
R. S. Goeke, R. K. Grubbs, D. Yazzie, A. L. Casias, K. A. Peterson, Sandia National Laboratories

089: Microwave Dielectrics of Low Firing Temperature Bi2Te2W3O16 Ceramics
Antonio Feteira, University of Birmingham

Break in Exhibit Hall: 10:00 am – 10:30 am

Session WA3:
LTCC Processing and Manufacturing

Chairs: Daniel S. Krueger, Honeywell FM&T; Thomas Bartnitzek, Micro-Hybrid Electronic GmbH
10:30 am – 12:10 pm

Session WA4:
Interactive Forum - Poster Session

Chairs: Heinz Osterwinter, HS Esslingen; Malgorzata Jakubowska, Institute of Electronic Materials Technology
10:30 am – 12:10 pm

082: Cold Embossing of Ceramic Green Tapes
Anja Kucera, Hans-Juergen Richter, Tassilo Moritz, Fraunhofer Institute for Ceramic Technology and Systems

044: Chemical Selective Coating of Nickel / Palladium / Gold Metallization on Screen-Printed Thick Film on LTCC and Al2O3 Ceramic for High Temperature Applications
Thomas Mache, Jens Müller, Torsten Thelemann, Technical University of Ilmenau

117: Fully Integrated Applications of Thin Films on Low Temperature Cofired Ceramic (LTCC)
J. Ambrose Wolf, Honeywell FM&T; Ken Peterson, Sandia National Laboratories; Matt O'Keef, Wayne Huebner, Missouri University of Science and Technology (MS&T); Bill Kuhn, Kansas State University (K-State)

050: Combined 3D Micro Structuring of Ceramic Green Tape Using Punching, Embossing and Laser Processing
Gunter Hagen, Thomas Kopp, Steffen Ziesche, Uwe Partsch, KMS Technology Center GmbH

096: Lamination of LTCC at Low Pressure and Moderate Temperature Using Screen-Printed Adhesives
Thomas Maeder, Bo Jiang, Fabrizio Vecchio, Caroline Jacq, Peter Ryser, Ecole Polytechnique Federale de Lausanne

038: Effect of Internal Silver Conductor on Heat Spreading Capability of LTCC Membrane
Claudia Bruchmann, Thomas Burkhardt, Erik Beckert, Ramona Eberhardt, Andreas Tünnermann, Friedrich Schiller University of Jena

048: Comparison of Magnetic Characteristics and Structural Properties of Commercially Available LTCC Materials
Nelu Blaž, Andrea Marić, Goran Radosavljević, Ibrahim Atassi, Walter Smetana, Ljiljana Živanov, University of Novi Sad

108: Feasibility of Micro-Plasma Transistor Devices in LTCC
David Mullner, Brooke Garner, Jim Browning, Vishal Saxena, Donald Plumlee, Boise State University

073: Stability of a Piezoresistive Ceramic Pressure Sensor made with LTCC Technology
Marina Santo Zarnik, Darko Belavic, CoE NAMASTE

071: Improving Performance of Laser-Printed Conductive Silver Lines
Dustin Buettner, Klaus Krueger, Helmut Schmidt University

015: Improvement of Ampacity of LTCC Conductors
Olga Shorina, Jens Müller, Ilmenau University of Technology

045: Embedded Ferrite LTCC Inductors
Andrea Marić, Goran Radosavljević, Nelu Blaž, Ljiljana Živanov, Walter Smetana, University of Novi Sad

065: Modified Organic Low-k Dielectric Layers on Fired LTCC Substrates
Achim Bittner, Ulrich Schmid, Vienna University of Technology

102: High Temperature Properties of Miniaturized Thick-Film Components
Damian Nowak, Andrzej Dziedzic, Tomasz Piasecki, Tomasz Baraniecki, Wroclaw University of Technology

031: Infrared Optical and Mechanical Properties of Ceramic Coatings Fabricated by Aerosol Deposition
Hiroki Tsuda, Jun Akedo, Shingo Hirose, Keishi Ohashim AIST

062: Low Temperature Co-Fired Ceramics Processing Parameters Governing the Performance of Miniaturized Force Sensors
Michael Weilguni, Walter Smetana, Johann Nicolics, Werner Goebl, Alex Hofmann, Vienna University of Technology

035: Assembly of a Microoptical Glucose Sensor with Nanoporous Separation Membrane
Michael Hintz, G. Fischer, H. J. Freitag, A. Schmidt, G. Schwarzrock, CiS Forschungsinstitut für Mirkosensorik und Photovoltaik

059: Realisation of Hermetically Tight Joints for Microfludic Applications in LTCC-Technology
Bruno Balluch, Ibrahim Atassi, Michael Weilguni, Goran Radosavljevic, Arsim Myrtezani, Onkotec GmbH

025: Microwave Dielectric Characteristics of Butyl Rubber-Barium Titanate Composites
J. Chameswary, M. T. Sebastian, NIIST-CSIR

030: Bonding of 2mm Thick Silicon Wafers using LTCC as Intermediate Layer
Sabine Günschmann, M. Fischer, T. Bley, I. Käpplinger, W. Brode, H. Mannebach, J. Müller, Technical University of Ilmenau

068: Structure and Dielectric Properties of BaRE2(MoO4)4 [RE=Pr, Gd and Dy] Ceramics and PTFE Composites for Microwave Circuit Applications
R. Ratheesh, A. Surjith, Nijesh K. James, Centre for Materials for Electronics Technology (C-MET)

116: Design of Compact Transmission Line Transformers in LTCC Technology
Eva Gartzke, Dieter Götsch, Ruth Männer, Richard Matz, Wolfgang Rossner, TU Ilmenau

067: LTCC 3D Micromixer Optimization for Process Intensification
Marcio Rodrigues da Cunha, Mário Ricardo Gongora-Rubio, Sao Paulo University

Lunch in Exhibit Hall: 12:10 pm – 1:20 pm

Session WP1:
Processing and Design of Integrated Passives

Chairs: Dmitry Kholodnyak, St. Petersburg Electrotechnical University "LETI”; Goran Radosavljevic, Vienna University of Technology
1:20 pm – 3:00 pm

Session WP2:
Microsystems Materials and Processes

Chairs: Donald Plumlee, Boise State University; Ulrich Schmid, Vienna University of Technology
1:20 pm – 3:00 pm

093: Tunability, Frequency and Temperature Behavior of Co-fired LTCC-Integrated Barium-Strontium-Titanate up to 8 GHz
Sven Rentsch, Jens Müller, Matthias Hein, Ilmenau University of Technology

074: Tunable Ferroelectric Ceramic Components for Reconfigurable Wireless Communications
Yuliang Zheng, Mohsen Sazegar, Holger Maune, Joachim R. Binder, Xianghui Zhou, Christian Kohler, Nikfal Mohammad, Arshad Mehmood, Rolf Jakoby, IMP, TU Darmstadt

019: Embedded Ceramic Capacitors in LTCC
Heike Bartsch, Jens Müller, Stefan Barth, Technical University of Ilmenau

060: Ferrite-Polymer-Composite Materials for Inductive Electronic Components
Roman Karmazin, R. Matz, D. Götsch, R. Hofmann, Siemens AG

092: Pressure-Assisted Sintering of Multilayer Transformer Using LTCC-Compatible NiCuZn-Ferrite and Silver Conductor
Hamid Naghib-Zadeh, Torsten Rabe, Federal Institute for Material Research and Testing (BAM)

110: Thermal Characterization of an LTCC Module for Miniature Atomic Clock Packaging
Fabrizio Vecchio, Conor Slater, Thomas Maeder, Peter Ryser, Ecole Polytechnique Federale de Lausanne

078: The Effect of Phase Composition on the Mechanical and Thermal Properties of LTCC Material
Kostja Makarovic, Marko Hrovat, Janez Holc, Andreja Bencan, Ales Dakskobler, Marija Kosec, Jozef Stefan Institute; Anton Meden, University of Ljubljana

028: Insulating Properties of Heat Dissipation Substrates (Al2O3 on Al) Fabricated by Aerosol Deposition Method
Muneyasu Suzuki, Jun Akedo, National Institute of Advanced Industrial Science and Technology

027: Influence of the Latex Binder Type on Alumina Tapes Lamination Process
Karol Malecha, Dominik Jurków, Johanna Stiernstedt, Leszek Golonka, Wroclaw University of Technology

041: Intelligent Hermetically Sealed LTCC Package with an Integrated Sensor System for Avionics
Josef Leschik, Anton Harasim, University of Applied Sciences; Jens Müller, Ilmenau University of Technology

Break in Exhibit Hall: 3:00 pm – 3:30 pm

Session WP3:
Design and Fabrication of Ceramic Microsystems and Devices II

Chair: Thomas Maeder, Ecole Polytechnique Federale de Lausanne
3:30 pm – 4:30 pm

Session WP4:
Microsystems Materials and Properties II

Chair: Karl-Heinz Drüe, Ilmenau University of Technology
3:30 pm – 4:30 pm

029: Manufacturing and Characterization of a Deformable LTCC Membrane with Integrated Temperature Sensors, Strain Gauges and Heating Structures
N. Gutzeit, J. Müller, C. Bruchmann, S. Gebhardt, Ilmenau University of Technology

040: Novel High-G Accelerometer Geometry Requiring 90 Degree Contacting Techniques
Robert Kuells, Siegfried Nau, Manfred Salk, Martin Ihle, Adrian Goldberg, Fraunhofer EMI

083: Gas Sensors Based on Ceramic MEMS Structures Made of Anodic Alumina and Yttria Stabilized Zirconia Films
Alexey Vasiliev, A. S. Lipilin, A. M. Mozalev, A. S. Lagutin,  A. V. Pisliakov, N. P. Zaretskiy, N. N. Samotaev, S. A. Soloviev, A. V. Sokolov, National Research Center

061: Materials in the Al2O3 - TeO2 System: Exploitation for High Frequency Applications
Paula Maria Vilarinho, Xinming Su, Aiying Wu, University of Aveiro

100: Low-Temperature Sintered NTC Ceramics for Thick Film Temperature Sensors and Multilayer Thermistors
Timmy Reimann, J. Töpfer, University of Applied Sciences Jena; S. Barth, B. Pawlowski, Fraunhofer-Institute for Ceramic Technologies; J. Müller, H. Bartsch-Torres, Ilmenau University of Technology

049: Stress Assisted Grain Growth and Dielectric Properties of BaLa4Ti4O15 Thick Films
Ana Maria Senos, Luis Amaral, Paula Maria Vilarinho, Christine Jamin, Olivier Guillon, University of Aveiro

Guided City Tour: 4:30 pm - 7:00 pm

Congress Dinner: 7:00 pm (Kaisersaal)


Thursday, April 19
Registration: 7:30 am – 12:00 pm

Session THA1:
Microsystems Applications
Chairs: Richard Eitel, University of Kentucky; Antonio Feteira, University of Birmingham
8:20 am – 9:40 am
Session THA2:
Piezoelectrics Materials and Devices
Chairs: Marija Kosec, Jozef Stefan Institute; Ken Peterson, Sandia National Laboratories
8:20 am – 10:00 am

014: Biocompatibility evaluation of human umbilical vein endothelial cells directly onto low-temperature co-fired ceramic materials for microfluidic applications
Richard E. Eitel, William L. Mercke, Jin Luo, Thomas Dziubla, Kimberly Anderson, University of Kentucky

103: Evaluation of Stacked Via Structures for High Density Feedthroughs
W. Kinzy Jones, Ali Karbasi, Florida International University

043: LTCC System for Light Absorbance Measurement
Mateusz Czok, Pawel Bembnowicz, Leszek Golonka, Wroclaw University of Technology

012: Design and Fabrication of Gas Tight Optical Windows in LTCC
Tilo Welker, Jens Müller, Ilmenau University of Technology

002: Preliminary Model and Technology of Piezoelectric Low Temperature Co-fired Ceramic (LTCC) Uniaxial Accelerometer
Dominik Jurkow, Arkadiusz Dabrowski, Tomasz Zawada, Leszek Golonka, Wroclaw University of Technology

020: Determination of Damage Zone in Fatigued Lead Zirconate Titanate Ceramics
Yong Zhang, Tsinghua University

077: Large Strain Actuation of 0.65PMN-0.35PT/Pt Thick-Film Bimorphs
Hana Ursic, Janez Holc, Marina Santo Zarnik, Marko Hrovat, Marija Kosec, Jozef Stefan Institute

051: Effects of Vapor Phase Soldering on the Properties of Piezoceramic Materials
Silke Bramlage, Klaus-Jürgen Wolter, Technical University of Ilmenau

115: Highly Controlled Orientation of Piezoelectric Ceramics Using a Strong Magnetic Field
Tohru S. Suzuki, Y. Miwa, M. Kimura, S. Kawada, T. Uchikoshi, Y. Sakka, National Institute for Materials Science

Break in Foyer: 10:00 am – 10:30 am

Session THA3:
High Frequency Characterization and Simulation

Chairs: Mailadil Sebastian, NIIST-CSIR; Reinhardt Kulke, IMST GmbH
10:30 am – 11:50 am

Session THA4:
Ceramic Functional Materials

Chair: Jörg Töpfer, University of Applied Sciences Jena
10:30 am – 12:30 pm

046: Fineline Structuring of Microwave Components in LTCC Multilayer Technology
Dirk Stöpel, Stefan Humbla, Thomas Mache, Alexander Schulz, Gabor Vogt, Matthias Hein, Jens Müller, Technical University of Ilmenau

047: Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness Loss
A. Ege Engin, Pavithra Pasunoori, San Diego State University

120: Support Vector Regression Modeling of LTCC Interconnection Based on Prior Knowledge
Lei Xia, Ruimin Xu, University of Electronic Science and Technology of China

006: Effective Compensation of the Temperature Coefficient of Resonant Frequency in LTCC
Steve Dai, Lung-Hwa Hsieh, Sandia National Laboratories

070: Interfacial Reaction of LTCC/NiCuZn Ferrites in Multilayer Composites
Hsing-I Hsiang, Bing Jyun Lyu, Li-Then Mei, National Cheng Kung University

075: A Novel Low-Temperature-Fired Multifunctional Varistor-Magnetic Ferrite Materials
Li-Then Mei, Hsing-I Hsiang, Huei Wen Ye, National Cheng Kung University

021: The Rapid Discovery of Novel Dielectric and Magnetic Ceramics, and Structure-Property Relationships, through Combinatorial High Throughput Methods
Robert C. Pullar, Universidade de Aveiro

091: Route to Develope Resource-Efficent Novel Colossal Dielectric Constant Materials
Stephan Krohns, Peter Lunkenheimer, Armin Reller, Simon Meissner, Benedikt Gleich, Andreas Rathgeber, Hans-Ulrich Buhl, Derek Sinclair, Alois Loidl, University of Augsburg

098: Cofiring Behavior of Multilayer Inductors Based on Substituted Y- and M-Type Hexagonal Ferrites
Silvia Bierlich, J. Töpfer, University of Applied Sciences Jena; S. Barth, B. Pawlowski, Fraunhofer-ICT;
J. Müller, H. Bartsch-Torres, Ilmenau University of Technology

107: Low Firing Functional Materials for Application in Power Electronics
Stefan Barth, Fraunhofer Institute for Ceramic Technologies and Systems IKTS; J. Töpfer, University of Applied Sciences Jena; T. Bartnitzek, Micro-Hybrid Electronic GmbH

Closing Remarks: 12:30 pm



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Speaker Dates/Information:

  • Abstract Deadline Extended: November 18, 2011 (CLOSED)
  • Speaker notification: January 13, 2012
  • Final Manuscripts for Proceedings CD-ROM due: February 29, 2012
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 70 cm x 100 cm. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.

 


Hotel Reservations (Hotel Deadline: March 2, 2012)

Radisson Blu Hotel
Juri-Gagarin-Ring 127
D-99084 Erfurt, Germany

Standard Single: 92,90€ and Standard Double: 114,40€ (price includes breakfast, VAT and city tax).
Other room categories are available on request.

Phone: +49 (361) 55 10 0
Fax: +49 (361) 55 10 210
E-mail: info.erfurt@radissonblu.com
www.radissonblu.com/hotel-erfurt

Reservation code: CICMT
Important note: in order to get the reduced room rate, bookings should be made by phone or e-mail

Travel to the Conference:
Air Berlin has cancelled its service to Erfurt in 2011. Therefore we should recommend to fly to Frankfurt Airport and to take the direct high speed train (ICE)-connection to Erfurt central station (approx. 2:30h). Tickets can be booked online under www.bahn.de (seat reservation is recommended - see time table for Monday, April 16). The hotel can be easily reached by taxi in a 5min ride or you can even walk the 850m (about 10 min, see google map).

 

 

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Phone: 202-548-4001

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