IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us
IMAPS - International Microelectronics And Packaging Society
ACerS - American Ceramic Society

IMAPS/ACerS 9th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2013)

April 23-25, 2013
Buena Vista Palace Hotel & Spa
Orlando, FL - USA

Early Registration/Hotel Deadline: March 22, 2013

General Co-Chairs:
Rich Eitel
University of Kentucky
reitel@engr.uky.edu
Sushu Kirihara
Osaka University
kirihara@jwri.osaka-u.ac.jp
Technical Program Co-Chairs:
Co-Chair - USA:
Dan Krueger
Honeywell FM&T
dkrueger@kcp.com

Co-Chair - USA:
Donald Plumlee
Boise State University
dplumlee@boisestate.edu
Co-Chair - Europe:
Alexander Michaelis
Fraunhofer IKTS
Alexander.Michaelis@ikts.fraunhofer.de
Co-Chair Asia:
Longtu Li
Tsinghua University
llt-dms@mail.tsinghua.edu.cny
Program Committee:

Paul Clem, Mike Lanagan, Andreas Roosen, Ken Peterson, Joerg Toepfer, Torsten Rabe, Leszek Golonka, Jens Muller, Hsing-I Hsiang

Editor - IMAPS Journal
John Pan
California Polytechnic University
pan@calpoly.edu
Editor - ACerS Journal
Antonio Feteira
Sheffield Hallam University

 



Registration Details | Register On-Line
Hotel Information | Speaker Information | Discounted DISNEY Tickets
Tabletop Exhibit Information | Sponsorship Information


Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.


Tuesday, April 23
Registration: 7:00 am – 5:30 pm
Continental Breakfast: 7:00 am – 7:45 am

Exhibit Hours: 10:00 am – 6:00 pm
Refreshment Breaks, Lunch & Reception in Exhibit Hall

Opening Remarks: 7:50 am – 8:00 am
Conference Chairs

Keynote Presentation: 8:00 am – 8:40 am
Solid Oxide Fuel Cells—Applications, Commercialization and Supply Chain in 2013
Dr. Matt Seabugh, Nexceris

Keynote Presentation: 8:40 am - 9:20 am
Recent Progress in Ni-MLCC Technology
Dr. Youichi Mizuno, Taiyo Yuden

Session TA1:
Ceramic Nanomaterials and Nanostructuring
Chairs: Thomas Berfield, University of Louisville; Beth Guiton, University of Kentucky; Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST)
9:20 am – 11:40 am

Piezoelectric and Dielectric Enhancement of New Nano-structured Ceramics with Heteroepitaxial Interfaces
Satoshi Wada, University of Yamanashi (Shuto Kawashima, Ichiro Fujii, Shinichiro Ueno, Kouichi Nakashima, Eisuke Magome, Chikako Moriyoshi, Yoshihiro Kuroiwa)

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Break in Exhibit Hall: 10:00 am – 10:40 am

Complex Superstructures Resulting from Compositional Modulation and Octahedral Tilt Twinning in AA'BB'O6 Doubly Cation Ordered Perovskites
Graham King, Los Alamos National Laboratory (Susana Garcia-Martin, Esteban Urones-Garrote, Gwilherm Nenert, Patrick M. Woodward)

Room-Temperature Ceramic Nanocoating Using Nanosheet Deposition Technique
Minoru Osada, National Institute for Materials Science (Takayoshi Sasaki)

Direct Observation of the Growth and Evolution of Nanowire Heterostructures
Beth Guiton, University of Kentucky (Bethany Hudak, Yao-Jen Chang, Daniel Earle, Guohua Li)

Lunch in Exhibit Hall: 11:40 am – 1:20 pm
 

 

Session TP1:
Piezoelectric Materials and Devices

Chairs: Antonio Feteira, Sheffield Hallam University; Helene Debeda, Universite de Bordeaux
1:20 pm – 2:40 pm

Session TP2:
RF Packaging and Devices

Chairs: Steven Dai, Sandia National Laboratories; Jens Mueller, Ilmenau University of Technology
1:20 pm – 3:20 pm

Feasibility of Screen-Printed PZT Microceramics for Piezocomposites Applications
Helene Debeda, Universite de Bordeaux (Riadh Lakhmi, Isabelle Favre, Jonathan Argillos, Mario Maglione, Valerie Budinger, Xavier Hochart, Wilfrid Sourbe, Claude Lucat)

Multilayer Actuators for High Temperature Piezoelectric Applications
Ian Reaney, University of Sheffield

Bismuth-Alkali-Titanate Based Ceramics for Piezoelectric Actuator Applications
Klaus Reichmann, Christian-Doppler-Laboratory for Advanced Ferroic Oxides, Graz University of Technology (W. Krauss, D. Schuetz, M. Naderer, T. Kainz, A. Feteira, M. Deluca, P. Supancic)

Strain Measurement and Mechanical Property Evolution in Sol-Gel PZT Thin Films
Thomas Berfield, University of Louisville (Brek Meuris, Daniel Porter)

Temperature Compensated Bandpass Filters in LTCC
Steve Dai, Sandia National Laboratories (Lung-Hwa Hsieh)

Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside a LTCC Fluidic Structure
Jens Mueller, Ilmenau University of Technology

Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
John Bailey, Auburn University (Michael Glover, Emmanuel Decrossas, Kaoru Porter, Tom Cannon, Alan Mantooth, Michael Hamilton)

Transmit/Receive (T/R) Modules - Key Elements for Active Phased Array Antennas
Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN (Joerg Schroth)

Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCC
Byron Caudle, Auburn University (Michael Baginski, Michael Hamilton)

Dielectric Resonators for Enhanced Magnetic Resonance Imaging
Steven Perini, Penn State University (Matthew Pyrz, Yiqing He, Ryan Tom, Thomas Neuberger, Fang Chen, Elena Semouchkina, Michael Lanagan)

Break in Exhibit: 3:20 pm – 4:00 pm

POSTER PRESENTATIONS (in the Exhibit Hall)
4:00 pm – 5:00 pm

0.84(K0.48Na0.52)NbO3-0.16K0.56Li0.38NbO3 Lead-Free Piezoelectric Ceramic Prepared by Multilayer Ceramic Process
Zhiqiang Zhang, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Zhifu Liu, Yongxiang Li)

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Synthesis and Characterization of Novel Multiferroic Composites based on Y3Fe5O12@BaTiO3 and Y3Fe5O12@Pb(Zr,Ti)O3
Giorgio Schileo, Christian Doppler Laboratory for Advanced Ferroic Oxides, Sheffield Hallam University (Antonio Feteira, Petronel Postolache, Liliana Mitoseriu, Klaus Reichmann)

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

 

Reception in Exhibit Hall: 5:00 pm - 6:00 pm

 


Wednesday, April 24

Registration: 7:00 am – 6:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 10:00 am – 4:00 pm
Refreshment Breaks & Lunch in Exhibit Hall

Awards: 8:00 am – 8:20 am

Keynote Presentation: 8:20 am - 9:00 am
Applications of Nanoscale Ceramics for High Energy Density Capacitors and Microscale Combustion
Speaker: Shubhra Gangopadhyay, Department of Electrical and Computer Engineering, University of Missouri

Abstract: The excellent electrical properties observed for ceramics and ceramic composites, such as high dielectric constants, make them very attractive dielectric materials to meet the energy density needs of ever-miniaturizing electronic devices. The versatility in ceramic deposition and processing techniques enables the deposition of nanometer thick dielectric layers, and the capability to deposit capacitors on three-dimensional substrates for further capacitance enhancement. It is also possible to fabricate thin-film integral capacitors following conventional microelectronic fabrication techniques by multi-layer capacitor deposition within a standalone system. Nanoscale ceramics powders (metal oxides) have also been synthesized and mixed with metallic fuels to produce highly reactive nanoenergetic materials with microscale combustion compatibility. The high energy densities, performance tunability, and reactivity of nanoenergetic ceramic composites are of interest for many commercial and defense combustion applications, but only recently has microscale combustion compatibility been exploited. Nanoenergetic ceramic composites have been integrated with MEMS processing to enable novel technologies such as high energy microactuators, miniaturized thrusters, microdevice combustion diagnostics, and unique devices for biomedical applications. The interesting properties of nanoscale ceramic materials pose to introduce more novel and exciting advances towards high energy density devices and technologies as research progresses.

Session WA1:
Metamaterials
Chairs: Khalid Rajab, Queen Mary University of London; Elena Semouchkina, Michigan Technological University
9:00 am – 11:20 am

Multilayered CRLH Metamaterials Using Magnetic Dipole-like Resonant Dielectric Particles and Cut-off TE Modes in Metallic Structures
Tetsuya Ueda, Kyoto Institute of Technology (Yoshiaki Sato, Yuichi Kado, Tatsuo Itoh)

Zero-Index All-Dielectric Metamaterials at Optical Frequencies
Yuanmu Yang, Vanderbilt University (Parikshit Moitra, Zachary Anderson, Jason Valentine)

Dielectric Metamaterials: Toward Low-Loss, Single Element Backward Wave Metamaterials
Paul Clem, Sandia National Laboratories (M.B. Sinclair, M.P. Rye, C.J. Jeon, E.S. Kim)

Break in Exhibit Hall: 10:00 am – 10:20 am

Realization of High-Q Fano Resonances in Ceramic Dielectric Metamaterials for Sensing, Cloaking, and Lossless Energy Transfer Applications
Elena Semouchkina, Michigan Technological University (Arash Hosseinzadeh, George Semouchkin)

Metamaterial Bandwidth Enhancement Using Active Electronics
Khalid Rajab, Queen Mary University of London (Yifeng Fan, Yang Hao)

Fabrication of Diamond Photonic Crystals with Oxide and Metallic Glasses Lattices for Terahertz Wave Control by Using Micro Pattering Stereolithography
Soshu Kirihara, Osaka University

Lunch in Exhibit Hall: 11:30 am – 1:00 pm

Session WP1:
Microsystem Materials and Applications

Chairs: Paula Maria Vilarinho, University of Aveiro; Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research
1:00 pm – 3:00 pm

Session WP2:
Power/High Temperature Electronics

Chairs: Markus Eberstein, Fraunhofer IKTS; Wenli Zhang, Viginia Tech-Center for Power Electronics Systems
1:00 pm – 2:20 pm

Electromagnetic Valve Made in LTCC
Mateusz Czok, Wroclaw University of Technology (Kalina Czajkowska, Karol Malecha, Leszek Golonka)

LTCC-3D Flow Focusing Microfluidic Device for Nanoparticle Fabrication and Production Scale-Up
Mario Ricardo Gongora-Rubio, IPT - Institute for Technological Research (Juliana de Novais Schianti, Andre da Costa Teves, Adriano Marim de Oliveira, Natalia Neto Pereira Cerize)

Feasibility of Micro-Plasma Transistor Device in LTCC
Brooke Garner, Boise State Univeristy

Multifunctional LTCC Substrates for Thermal Actuation of Tunable Steffen Leopold, Ilmenau University of Technology (Thomas Geiling, Caroline Fliegner, Martin Hoffmann)

Fine Dust Measurement with Electrical Fields - Concept of A Hybrid Particle Detector
Thomas Geiling, Ilmenau University of Technology (Tilo Welker, Martin Hoffmann)

Electric Micro-Propulsion in Low Temperature Co-Fired Ceramics
Jesse Taff, Boise State University

Characterization of Low Temperature Sintered Ferrite Laminates for High Frequency Point-of-Load Converters
Wenli Zhang, Center for Power Electronics Systems (Mingkai Mu, Yipeng Su, Qiang Li, Fred Lee)

Thick Film Pastes for Aluminium Nitride and Silicon Nitride Ceramics
Marco Wenzel, Fraunhofer IKTS (Christel Kretzschmar, Richard Schmidt, Markus Eberstein)

Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology
Dominique Ortolino, Lehrstuhl for Funktionsmaterialien, University Bayreuth (Jaroslaw Kita, Roland Wurm, Andreas Pletsch, Karin Beart, Ralf Moos)

Thick Film Pastes for Power Application
Christina Modes, Heraeus Precious Metals GmbH & Co. KG, TFD-TH (Jochen Langer, Melanie Bawohl, Jessica Reitz, Anja Eisert, Heraus Precious Metals, TFD-TH; Mark Challingsworth, Virginia Garcia, Samson Shabhazi, Heraeus Precious Metals North America Conshohocken LLC)

Break in Exhibit Hall: 3:00 pm – 4:00 pm

Session WP3:
Lab on a Chip and Biomedical Applications

Chair: Shubhra Gangopadhyay, University of Missouri-Columbia; Leszek Golonka, Wroclaw University of Technology
4:00 pm – 6:00 pm

Session WP4:
Energy/Fuel Cells/Batteries

Chair: Tim Yosenick, General Electric; Hiroya Abe, Osaka Univerisity; Matthew Seabaugh, Nexceris
4:00 pm – 5:20 pm

Improved Trans-Endothelial Electrical Resistance Sensing using Microfluidic Low-Temperature Co-fired Ceramics
William Mercke, University of Kentucky (Richard Eitel, Thomas Dziubla, Kimberly Anderson)

An LTCC-Based Microfluidic Calorimeter and Detection Scheme for Rapid Biomarker Detection
Ben Brummel, University of South Carolina (Richard Eitel, Brad Berron)

Preparation of Inorganic-Organic Hybrid Membrane for Peripheral Nerve Reconstruction
Yuki Shirosaki, Kyushu Institute of Technology

Effect of Platinum Metallization in Cofired Platinum /Alumina Microsystems for Implantable Medical Applications
Ali Karbasi, Florida Internationl University (Ali Hadjikhani, Kinzy Jones)

Biocompatible Low Temperature Co-Fired Ceramic for Biosensors
Jin Luo, University of Kentucky (Richard Eitel)

An LTCC-based Microfluidic Electrochemical Biosensing System for Label-free Detection of Cortisol
Abhay Vasudev, Florida International University (Ajeet Kaushik, Shekhar Bhansali)

All-Crystal-State Lithium-Ion Batteries: Innovation Inspired by Novel Flux Coating Method
Katsuya Teshima, Shinshu University (Hajime Wagata, Shuji Oishi)

Development of Advanced Ceramic Film Capacitors for Power Electronics in Electric Drive Vehicles
U. (Balu) Balachandran, Argonne National Laboratory (M. Narayanan, S. Liu, B. Ma)

Electrostatic Dry Coating of Cathode Materials for Li Ion Battery
Hiroya Abe, Osaka University (Akira Kondo, Makio Naito, Takashi Wakimoto, Masayuki Yamaguchi, Honda Engineering Co.,Ltd.)

Routes for LTCC to Power-electronics
Franz Bechtold, VIA electronic GmbH (Mohamed Ashari)

 

Thursday, April 25
Registration: 7:00 am – 11:30 am

Continental Breakfast: 7:00 am – 8:00 am

Session THA1:
Integrated Passives and Ferrites
Chair: Robert Pullar, University of Aveiro
8:00 am – 9:20 am
Session THA2:
Direct Write/3D Printing
Chairs: Klaus Krueger, Helmut Schmidt University; Mike Newton, Newton Cyberfacturing, LLC
8:00 am – 9:40 am

Magnetoelectric Coupling in Single Crystalline Hexaferrite at Room Temperature
Khabat Ebnabbasi, Northeastern University (Marjan Mohebbi, Carmine Vittoria)

A Study on Reliability Test of Multilayer Chip Inductors
Wen-Hsi Lee, National Cheng-Kung University (Shih-Feng Chien, C. S. Chiang, Wen-Hsi Lee, Wen-Yu Lin, Po-Chih Shen, Chin-Pei Lin)

On-chip Tunable Magnetoelectric Components
Shashank Priya, Virginia Tech

Hexagonal Ferrite Fibres
Robert Pullar, University of Aveiro

In-Situ-Blending of Inkjet-Printed Resistors
Dietrich Jeschke, University of the Federal Armed Forces (Mathias Niemann, Klaus Kruger)

Direct Printing and its Application in LTCC
Xudong Chen, nScrypt Inc (Kenneth Church)

Inkjet Printing of Piezoelectric Lead Magnesium Niobate-Lead Titanate Thick Films
Klaus Kruger, Helmut Schmidt University / University of the Federal Armed Forces (Andreas Rathjen, Clemens Junker, Helmut Schmidt University; Hana Ursic, Marija Kosec, Jozef Stefan Institute)

Preparation of Integrated Passive Microwave Devices through Inkjet Printing
Andreas Friederich, Institute for Applied Materials, Karlsruhe Institute of Technology (Christian Kohler, Mohsen Sazegar, Mohammad Nikfalazar, Rolf Jakoby, Joachim R. Binder, Werner Bauer)

Aerosol Jet Printing of Two Component Thick Film Resistors on LTCC
Markus Eberstein, Fraunhofer IKTS (Kai Swiecinski, Robert Jurk, Egle Dietzen, Martin Ihle)

Break in Foyer: 9:40 am – 10:00 am

Session THA3:
Ceramic Functional Materials

Chairs: Satoshi Wada, University of Yamanishi; Minoru Osada, National Institute for Materials Science (NIMS)
10:00 am – 12:00 am

Session THA4:
Advance Packaging Technologies

Chair: Torsten Rabe, BAM, Federal Institute for Materials Research and Testing; Brian Rowden, General Electric, Martin Oppermann, EADS Deutschland GmbH / CASSIDIAN
10:00 am – 12:00 pm

Evaluation of TFR-Characteristics in a Wide Temperature Range
Uwe Partsch, Fraunhofer IKTS (Christian Lenz, Marco Wenzel, Marco Eberstein)

Effects of Al2O3 and B2O3-SiO2 Modification on the Microstructure and Dielectric Properties of BaTiO3 Ceramics
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences

LTCC Multilayer Modules with Integrated Functional Materials
Jorg Topfer, University of Applied Sciences (T. Reimann, R. Lehnert, S. Bierlich, S. Barth, B. Capraro, H. Bartsch de Torres, J. Muller)

Structure-Property Relationships in BaTiO3-BiFeO3-BiYbO3 Ceramics
Antonio Feteira, Christian Doppler Lab in Advanced Ferroic Oxides, Sheffield Hallam University (Luke Luisman, Giorgio Schielo, Marco Deluca, Klaus Reichmann)

Modulating the Temperature Coefficient of the Permittivity by Substrate Induced Texturization in BaO-Ln2O3-TiO2 Thick Films
Ana Senos, University of Aveiro, Ciceco (L. Amaral, P.M. Vilarinho, C. Jamin, O. Guillon)

Alternative Strategies for the Preparation of Multiferroic Thin Films
Paula Maria Vilarinho, University of Aveiro

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding
Maren Bruder, Atotech Germany GmbH (Mustafa Oezkoek)

Surface Characteristics of LTCC Substrates Fabricated by Pressure-Assisted Sintering
Bjoern Brandt, BAM Federal Institute for Materials Research and Testing (Torsten Rabe)

Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Michael Hambuch, University of Erlangen-Nuremberg (Andreas Roosen)

In Situ Characterization of the Sintering Behavior of LTCC Laminates with Embedded Cavities by High Temperature Laser Profilometry
Andreas Heunisch, BAM Federal Institute for Materials Research and Testing (Ulrich Marzok, Marco Munchow, Ralf Muller, Torsten Rabe)

Electroplating and Electroless Plating Process Development for DuPont GreenTape™ 9K7 LTCC
Allan Beikmohamadi, DuPont (Deepukumar Nair, Steve Stewart, Jim Parisi, Mark McCombs, Michael Smith, Ken Souders, J.C. Malerbi, K.M. Nair, Michael Farb)

Application of Cylindrical Pipe-Type LTCC Substrates as a Platform for Multi-Array Gas Sensors
Jaroslaw Kita, University of Bayreuth (Annica Brandenburg, Ralf Moos)

Closing Remarks: 12:00 pm



Registration Details | Register On-Line

 


Registration Information:(Early Registration/Hotel Deadline: March 22, 2013)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) Proceedings CD-ROM. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 3/22/13
Advance/Onsite Fee
After 3/22/13
IMAPS Member
$575
$675
Non-Member
$700
$800
Speaker
$400
$500
Chair
$400
$500
Student
$200
$300
Chapter Officer
$400
$500
Tabletop Exhibit (Member)
$550
$650
Tabletop Exhibit (Non-Member)
$700
$800
Corporate Sponsorship (Includes Tabletop & 1 Attendee)
Sponsorship of CICMT includes: 1 tabletop booth ($550+); 1 attendee for technical sessions ($400+), logo/url posted at cicmt.org, logo on program covers & insides, 1/2 page advertisement in printed programs, opportunity to provide 1 marketing flyer for IMAPS to distribute at registration to all attendees. LIMIT of 4 Corporate Sponsors
$1500
$1500

Register On-Line

 


Speaker Dates/Information:

  • Abstract Deadline Extended: November 16, 2012
  • Speaker notification: January 14, 2013
  • Final Manuscripts for Proceedings CD-ROM due: March 15, 2013
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (30 to present; 10 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at: http://www.imaps.org/speakers/poster.htm.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 15 minutes (25 for keynotes) followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 15 minutes (25 for keynotes), followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 

 


Hotel Reservations (Hotel Deadline: March 22, 2013)

Buena Vista Palace Hotel & Spa
1900 Buena Vista Dr
Lake Buena Vista, FL 32830 - USA

Standard Single/Double: $155/night + tax and fees
Triple: $175/night + tax and fees
Quad: $195/night + tax and fees

On-Line Reservations

Phone Reservations: 1-866-397-6516
When calling, mention: IMAPS Annual Symposium/ CICMT Conference

 


Walt Disney World Advance Purchase Tickets

Walt Disney World - Discounted Advance Purchase Tickets

IMAPS has teamed up with Disney for a special offer for those attending CICMT 2013 in Orlando. Have a little fun while visiting Orlando for our 9th CICMT Conference...

If you’re planning a trip to Walt Disney World® Resort during your participation at IMAPS/ACerS 2013 CICMT Conference in April 2013, please visit www.mydisneymeetings.com/4imps13/ for information about ordering tickets in advance, at the special conference rate!

 

 

 

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>