IMAPS/ACerS 14th International Conference and Exhibition on
Ceramic Interconnect and
Ceramic Microsystems Technologies
(CICMT 2018)

April 18-20, 2018
University of Aveiro
Aveiro, Portugal

General Chair:
Paula Vilarinho
University of Aveiro

General Co-Chair:
Robert Pullar
University of Aveiro
Technical Chair:
Steve Dai
Sandia National Labs.
Technical Co-Chair:
Yongxiang Li
Shanghai Institute of Ceramics

Session Organizers:
Jorg Topfer, Jena University; Jens Muller, TU Ilmenau; Soshu Kirihara, Osaka University; Steve Dai, Sandia National Labs; YongXiang Li, Shanghai Institute of Ceramics;
Martin Letz, Schott AG; Marcus Eberstein, Epcos/TDK; Hsing-I Hsiang, National Univ Taiwan; Masahiro Yoshimura, National Cheng Kung Univ;
Minoru Osada, National Institute for Material Science; Tsukuba Peter Petrov, Department of Materials at Imperial College London; Dan Krueger, Honeywell

Thank you all for participating in CICMT 2018 PORTUGAL! Please keep an eye on this website in the months ahead for details on CICMT 2019 China! More information very soon. CICMT 2020 will return to the US.



CICMT 2018 VIDEOS (Soon)


Thank you to our CONFERENCE SPONSOR:
Conference Sponsor: AUR EL
Gala Dinner Sponsor: DuPont
Exhibitor: AdTech Ceramics Exhibitor: Micross Exhibitor: ATV
Exhibitor: Radiant Technologies Exhibitorr: Malvern Panalytical
  Exhibitorr: MonoComp  
In-Kind Sponsor: Paralab
Media Sponsor: Micromachines


Goal of CICMT...
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. CICMT 2018 Portugal will feature 2 plenary/keynote speakers and 7 "invited" speakers. In addition, this year's conference will offer more than 45 additional expert speakers from industry and academia, as well key companies on display that support these technologies, and numerous networking opportunities throughout. New with CICMT 2018 - enjoy the "debate" session on Processing Towards Room Temperature, and end Thursday evening with the Gala Dinner!

Wednesday, April 18 -- University of Aveiro, Rectory building
Registration: 8:45 am - 6:00 pm

Exhibit Hours: 10:00 am - 4:20 pm

Aveiro City Museum Guide Tour: 6:30pm (optional)

CICMT 2018 Opening Remarks: 8:45 am - 9:00 am
Conference Chairs

Ultra-Low Sintering Temperature Electroceramics - for 5G and IoT Applications

Plenary Speaker - Heli Jantunen

ABSTRACT: The number of connected devices (IoT) is predicted to increase to 50 billion by 2020. This prediction however does not take into account advances in internet and device technology (Cisco IBSG 2011) and thus the growth can be much faster. At the same time the 5th Generation Telecommunications Technology (5G) is emerging to provide higher data rates and bandwidth and lower response times. Both of these happening coincidentally is expecting fast development of electroceramics meaning new compositions, fabrication and 3D integration approaches.

In the last decade over 200 electroceramic compositions with ultra-low sintering temperature have been developed. Most of these below can be sintered in the temperature range of 300-700°C providing also an opportunity to make modules with tape casting and co-firing. In addition, several compositions needing no sintering at all are reported and some components introduced. The approaches provide interesting new ways to realize devices for 5G and IoT with the recently reported advancements as follows:

- low energy consumption and low-cost investments
- multimaterial modules
- integration with temperature sensitive materials and devices including plastics, semiconductors and paper
- totally new way to make "all ceramic" composites
- additive manufacturing with 2D and 3D printing
- accurate component dimensions by zero-shrinkage or room temperature fabrication methods
- feasible to even small scale production

These opportunities available with ultra-low sintering temperature electroceramics are discussed against the future needs by 5G and IoT highlighting also what should be next steps.

Heli Jantunen received the M. Sc. Degrees 1982 and1989, University of Oulu, Finland. After being 10 years in industry she received the Dr. Science (Tech.) degree in Microelectronics (with honours) in 2001. She is Full Professor and the Leader of Microelectronics Research Unit with the focuses on novel ICT electronics, RF applications, sensors, multifunctional micromodules and printed electronics devices.  Her research has been financed by Tekes, Academy of Finland, NiCe, EU, ERA.Net ERC with the Advanced Grant. Her group has invented electroceramic materials with ultra-low sintering temperature including even fabrication at room temperature. She is inventor in 76 patents and has over 216 scientific journal publications (2741 citations (without self-citations), h-index 29, WoS on March 2018, and GS: h-index 39, citations 5436).




Session WA1:
Low Temperature Sintering Processes / ULTCC

Chair: Steve Dai and Jianjiang Bian
10:00 am - 10:40 am

Session WA2:
Power / High Temperature Elect.

Chair: Maria Lourdes Calzada and Zhifu Liu
10:00 am - 10:40 am

Glass-ceramics with Tunable Thermal Strain
Steve Dai, Sandia National Labs (Mark Rodriguez)

Microstructure and Electrical properties of FLASH sintered Potassium Sodium Niobate
R. Serrazina, CICECO - University of Aveiro (A. M. R. Senos, P. M. Vilarinho)

Preform with Engineered Metal Mesh for Improved Bondline Control & Increased Reliability between Substrate & Baseplate in IGBT Module Assembly
Ângelo Marques, Indium Corporation (Karthik Vijay)

Glass Bonding Technology of FeSiCr Substrate and Fired NiCuZn Ferrite Substrate
Hsing-I Hsiang, National Cheng Kung University (Sheng-Mao Yang)

Coffee Break: 10:40 am - 11:00 am (SENATE ROOM)

Nondestructive Evaluation of Embedded Piezoceramics by Thermal Wave and Thermal Pulse Methods

Invited Speaker - Dr. Gunnar Suchaneck

ABSTRACT: Structural components with embedded piezoelectric sensors and actuators find application in structural vibration suppression and noise reduction, energy harvesting, structural health monitoring, precision positioning, etc. During fabrication, piezoelectric transducers are supposed to mechanical and thermal depolarization and microcrack formation. Therefore, non-destructive evaluation of the polarization state is required for quality inspection. A periodic thermal excitation of the piezoelectric material gives rise to a pyroelectric current which carries information on the polarization profile. In frequency domain, the Laser Intensity Modulation Method (LIMM) is well-established (Lang and Das-Gupta 1986). Thereby, thermal oscillations are generated by a periodically modulated laser beam. When thermal pulses are applied with a pulsed laser, the signal is recorded in time domain, but it can be Fourier-transformed and analyzed in the frequency domain similar to LIMM (Mellinger et al. 2005). Recently, we have demonstrated that LIMM is promising for the non-destructive evaluation of the polarization state and thermal interfaces of piezoelectrics embedded into low temperature co-fired ceramics (LTCC), epoxy resin and polyimide, polyamide 6 as well as high-pressure die-casted Al (Suchaneck et al. 2012, Eydam et al. 2015). At low modulation frequencies, the pyroelectric response of PZT is governed by thermal losses to the embedding layers. In this case, the sample behavior can be described by a harmonically heated piezoelectric plate exhibiting heat losses to the environment characterized by discrete relaxation times or by their continuous distribution. Thermal relaxation characterizes the thermal contact and, thus, enables locating lamination failures. The first sample type investigated in this work, was a commercial Smart Materials Macro-Fiber Composite piezoelectric actuator. Here, the real and imaginary parts of the pyroelectric current spectrum fits to a 1-D heat loss model with Cole-Cole relaxation. The maximum relaxation time provides the interfacial thermal conductance of about 100 W/m2K. A second, much smaller relaxation time corresponds to an interface thermal conductance of approximately 30 000 W/m2K which is characteristic for interfaces between two thin metal sheets. ANSYS simulation reveals that the good agreement with a 1D-model is attributed to a significant blurring of the temperature field by the metallic electrodes and as a consequence a small lateral component of the temperature gradient at the piezoceramics/epoxy resin interface, i.e. heat conduction through this interface can be neglected. A comparison of thermal relaxation times calculated for ideal thermal contact with experimental ones allowed disclosure of lamination failures. The second sample type was an integrated low temperature co-fired ceramics/PZT module. Here, the laser light is absorbed in a surface layer of about 80µm thickness where the thermal oscillation takes its origin. The relaxation time of 0.16 s takes its origin in an uncertain thermal contact between the LTCC and the embedded PZT plate. The corresponding interface thermal conductance amounts to about 170 W/m2K at both the top and the bottom surface. Above 100 Hz, the penetration depth of the temperature oscillations into LTCC becomes less than the laser light absorption depth determined by optical transmission measurements on very thin LTCC samples. Consequently, the simplified model of harmonic heating from a very thin surface layer is no more valid. The thereby recorded pyroelectric current takes an additional time lag, i.e. a property corresponding in electrical engineering to an inductive behavior. The third sample was a thermoplastics-compatible piezoceramic module. The pyroelectric current spectrum of a thermoplastics-compatible piezoelectric are well described by five single relaxation times. The first is unknown, the other are related to thermal losses of the sample top and bottom to the environment, to thermal losses through the PZT electrode/thermoplastics interface, to bulk thermal conductance of the thermoplastic and to the metalized PZT surface/ meandered Ag-paint electrode interface. For Al die-casted piezoceramic modules, the pyroelectric current spectrum allows to distinguish centre-positioned from off-centre positioned transducers (Eydam et al. 2015). The pyroelectric current measured in time domain was Fourier-transformed and corrected by the transfer function of the measurement set-up to account for the influence of the amplifier settings. The resulting pyroelectric spectrum is analyzed then in the frequency domain as already illustrated. However, in practice, we have to account for the bandwidth of the preamplifier connected with the large capacitive load of the sample, that is we are able to reconstruct the frequency spectrum only in a certain frequency region. In summary, thermal wave and thermal pulse methods are a suitable tool to control the quality of both poling and embedding of piezoelectric ceramics. They enable to evaluate the polarization state, to characterize thermal interfaces and to indicate lamination failures.

Dr. Gunnar Suchaneck is currently Senior Researcher and Chief Assistant of the Solid State Electronics Laboratory at TU Dresden. He received his Ph.D. in physico-mathematical sciences from the Electrotechnical University - LETI, St. Petersburg, Russia, in 1983. Since 1984, he has been a Senior Scientist at TU Dresden; since 1997 he has been with the Solid-State Electronics Lab there. His current research interests include solid state sensor technology: ferroelectric thin film materials, metal oxide thin films, thin film deposition by reactive sputtering and plasma enhanced chemical vapor deposition, characterization of thin films by optical and electrical measurements. He has coauthored more than 280 technical publications in books, scientific journals, and conference proceedings, and has coauthored 15 patents. Within the Collaborative Research Center PT-PIESA, Dr. Suchaneck is currently developing a thermal method for condition monitoring of polarization and materials interconnection in active light-weight structural components comprising piezoelectric transducers which is suitable for a future mass-production.

Low Temperature Sintering Processes / ULTCC

Chair: Steve Dai and Jianjiang Bian
11:40 am - 12:00 pm

Session WA3:
Advanced Packaging

Chair: Dan Krueger and Brandon Cox
11:40 am - 12:20 pm

Feasibility of Room Temperature Fabrication for 3D Printing of Li2MoO4 Ceramics
Maria Vaataja, Microelectronics Research Unit, University of Oulu (Hanna Kähäri, Katja Ohenoja, Maciej Sobocinski, Jari Juuti, Heli Jantunen)

Approaching Fluidic Self-assembly of Small Silicon Chips on Laser Structured Thick Film Pads on LTCC
Nam Gutzeit, TU Ilmenau (M. Kaltwasser, M. Fischer, T. Stauden, H. O. Jacobs, J. Mueller)

Advances in 2D and 3D (CT) X-Ray Inspection for Ceramic Applications
Thorsten Rother, Yxlon International (David Bernard, David Bernard Consultancy)

RF Materials & Applications

Chair: Peter Petrov and Zhifu Liu
12:00 pm - 12:20 pm


A Microwave Resonator based Detector Made in LTCC Technology
Laura Jasinska, Wroclaw University of Science and Technology (Anita Pozniak, Jan Macioszczyk, Karol Malecha, Piotr Slobodzian)

LUNCH: 12:20 pm - 2:00 pm

Thick-Film Pastes for Special Applications

Invited Speaker - Uwe Partsch

ABSTRACT: Thick film pastes have been used for many years for the manufacture of hybrid microsystems, circuit boards and sensors. Screen printing technology is still the printing technology of choice also for new applications apart from traditional materials and processes. However, the thick-film pastes used must be adapted accordingly. Challenges include, for example, the adaption of the solid constituents of the pastes to obtain required functional characteristics, to avoid chemical reactions with special substrate materials while firing or to define a requested coefficient of thermal expansion. By selecting and modifying the organic paste components, it is possible to customize the printing properties of the pastes. Further requirements concern, for example, the necessary burnout behaviour of the organic components at specific temperatures or at special atmospheres such as in nitrogen or vacuum. The presentation gives an overview about the topic. The results of various projects illustrate the development cycle for specialized thick-film pastes at Fraunhofer IKTS.

Uwe Partsch is head of the Hybrid Microsystems Department and the Thick Film Technology Group at Fraunhofer IKTS, Dresden/ Germany. Scientific topics concern various aspects of ceramic thick-film and multilayer technology, in particular LTCC technology. Examples are the development of various thick-film and LTCC-based components as well as material and technology development for 3D printing of functional structures and components.

Session WP1:
Integrated Passives in LTCC

Chairs: Jens Muller and Peter Petrov
2:40 pm - 4:00 pm

Session WP2:
Thick Films / LTCC

Chair: Steve Dai and Zhifu Liu
2:40 pm - 3:20 pm

Relaxor Dielectrics for Multilayer Capacitors with Temperature-stable Permittivity up to 250°C
Thomas Schulz, University of Applied Sciences Jena (B. Capraro, D. Schabbel, H. Bartsch, J. Töpfer)

Transverse Multilayer Thermoelectric Generators
Joerg Toepfer, EAH Jena (Timmy Reimann, Thomas Schulz, Arne Bochmann, Beate Capraro, Steffen Teichert)

Miniaturized Laser Structured Components in LTCC for 5G Applications
Nam Gutzeit, TU Ilmenau (A. Schulz, J. Mueller)

Effect of Electrode Composition on Performance of Sputter Deposited MIM Capacitors on LTCC Substrates
Daniel Krueger, Honeywell (James Claypool, Wayne Huebner, Ambrose Wolf)

Characterization of a New and Complete Lead-Free Thick Film Resistor System for the Hybrid Circuit Market
John Oleksyn, DuPont Uk (Michael Skurski, Marc LaBranche, Peter Weigand)

Tape Casting and Characterization of a Glass Free LTCC for Microwave Applications
Bian Jianjiang, Shanghai University

Coffee Break: 4:00 pm - 4:20 pm

Critical Evaluation of Additively Manufacturing Electrical Ceramics for Dielectric Resonator Applications

Invited Speaker - Brandon Cox

ABSTRACT: Additive manufacturing is gaining popularity in materials research and manufacturing due to the ability to generate complex geometry parts from computer-aided 3D designs. These designs include shapes that are not achievable by traditional subtractive manufacturing, and more specifically for ceramic material systems. The complex geometry capability, more frequently known as near-net-shape (NNS), sets this method apart from traditional methods such as pressing and casting. However, there are challenges that arise by using this method, as well as limitations. Complex printed shapes almost always have a higher surface-area-to-volume ratio compared to traditionally formed parts, and it can be very difficult, if not impossible, to perform any post-sintering surface treatment on printed parts. If you press and sinter a pellet, it is relatively easy to polish the surface as well as the underlying bulk material, but this cannot be done with NNS printed parts. There can be inner surfaces that cannot be reached, and therefore must exhibit the final surface after being printed. With this specific limitation, there needs to be much more understanding and control of the interactions between the parts and the sintering environment/atmosphere (e.g. grains on the surface may sinter differently than ones in the bulk). Also, the sintering stresses associated with NNS parts will be much different than those of the bulk monolithic pieces. Printing multiple ceramic materials poses its own specific challenges as well. There is much concern with the printing method used, and the transition point, or gradient, between materials. These areas of concern are being considered in this work, and optimistically being improved for a better ceramic product via control over specific materials during the printing process. Customization of ceramic components will be demonstrated as a step that can be taken to further in tailoring the printing process to meet the specific needs of a part’s final application. One application for additive manufacturing (AM) of ceramics is with wireless technologies using dielectric resonators. Wireless technologies have become ubiquitous in modern life and are gaining momentum for their technological advancement. Dielectric materials are typically the material of choice when developing specifically tailored microwave dielectrics for wireless applications [1]. Across the entire electromagnetic spectrum, there are a variety of frequency bands that are covered by the various wireless technologies, such as those used with mobile phones, communication satellites, radar and car sensors, across frequencies ranging from 800 MHz to 30 GHz. One of the large concerns with wireless technology is the size of the antennas used and their anticipated satisfactory performance. The selectivity and stability of these components are essential for ensuring that the signals produced are restricted to their predetermined frequency bands and to control the introduction of unwanted signals from outside sources. Some common devices that require this technology are satellites and mobile radio communications, in which they utilize narrow band, frequency-stable filers and oscillators [1]. The size requirement of these antennas must be addressed, and this can be achieved by considering the used of dielectric resonators (DR). DRs fill the need for compactness, temperature-stability and high quality-factor (Q-factor) for use with microwave resonating elements. The relative permittivity of these ceramics must be high enough in order for a standing electromagnetic wave to be contained within its volume because of the potential for dielectric-air interface reflection. Titanium dioxide (TiO2) and barium titanate (BaTiO3)-based ceramics have many uses for their electrical properties, with particular applications utilizing their medium and high relative permittivities, respectively. At microwave frequencies and higher, a DR can be used in place of a resonator circuit due to its high Q-factor and minimal resistive losses. A typical DR consists of a block of ceramic material that is mounted on a printed circuit board with input and output transmission line feed networks typically in a micro-strip form [2][3]. The operating modes of a DR are determined primarily by relative permittivity and geometry. Utilizing AM one can create a monolithic part with spatially-varying permittivity which will generate different modes of operation for the DR enabling a host of new opportunities. For example, in DR filters (DRFs), this capability can be utilized to control the coupling between the micro-strip lines and the DR as well as the coupling coefficients between adjacent DRs in multi-pole filters, adding several design degrees of freedom. Similarly, in DR oscillators (DROs), this capability can be utilized to improve the coupling between the resonator and transistor circuit which will in turn improve the loaded Q-factor. In the case of a DR antenna (DRA), the graded permittivity enables one to tailor the radiation pattern of the antenna to a desired shape without changing the physical geometry of the DRA. This research considers the electrical and structural properties of the printed multi-material ceramics through the combination of rheological studies, their effects on paste-based printing, outcomes of controlling multi-material printing, and characterization of sintered parts by scanning electron microscopy and electrical impedance analysis. This system is particularly of interest due to its dielectric properties, which, when combined with the shape control offered by AM, enables the production of complex dielectric ceramic DRs. This work is supported by Honeywell Federal Manufacturing & Technologies (Technical Fellowship Program) and the Department of Energy’s Kansas City National Security Campus. The Department of Energy’s Kansas City National Security Campus is operated and managed by Honeywell Federal Manufacturing & Technologies, LLC under contract number DE-NA0002839.

Brandon Cox is currently a graduate student in the Materials Science & Engineering program at the Colorado School of Mines in Golden, Colorado, United States.  His research interests are in additive manufacturing of electrical ceramics, and the processing-structure-property-performance relationship that is unique to various geometries that are achievable using this technology.  Particular interest is in medium to high permittivity ceramics, as well as ferroelectric and piezoelectric ceramics.

Session WP3:
Additive Manufacturing / 3D Printing

Chair: Hsing-I Hsiang and Zhifu Liu
5:00 pm - 5:20 pm

Session WP4:

Chair: Jorg Topfer and Angus Kingon
5:00 pm - 5:40 pm

Direct Aqueous Ink Writing of Piezoelectric BCZT Ceramics
Bo Nan, Central European Institute of Technology (Susana Olhero, Tim Button, Jose Ferreira)

Synthesis and Magnetic Properties of Exchange-Coupled BaFe12O19@Fe3O4 Nanocomposite
Farzin Mohseni, CICECO - Aveiro Institute of Materials, University of Aveiro (R. C. Pullar, J. M. Vieira, J. S. Amaral)

SnO2 Nanostructured Thick Films for CO Sensing
Anna Wlodarkiewicz, CICECO, University of Aveiro (Sloany Medeiros, Alexandre Santos, M. Elizabete Costa, Paula M. Vilarinho)

End of Day 1

Conference participants are invited to a guide visit to Aveiro City Museum after first day of conference. The Visit will take place at 18:15 and the museum is 10 minutes walking distance from the University.


Thursday, April 19 -- University of Aveiro, Rectory building

Registration: 8:00 am - 6:00 pm

Exhibit Hours: 10:00 am - 4:00 pm

GALA DINNER: 8:00 pm

Towards Microsystems via Heterogeneous Integration of Functional Materials on Non-Standard Substrates

Plenary Speaker - Angus Kingon

ABSTRACT: This presentation traces the development work that we have undertaken over a number of years to integrate multifunctional elements onto flexible substrates. The investigations have pursued many interesting avenues (and some dead-ends), but the overall direction has been towards achieving multifunctional microsystems or modules on flexible substrates, including composite boards (eg FR4). The presentation briefly covers the early work and successful on embedding passives into multilayer printed circuit boards. Passives such as resistors, inductors and capacitors were followed by the integration of simple sensors such as strain and temperature sensors. However, the challenge of integrating high value capacitors required us to address the difficult and innate problem of the temperature incompatibilities: i.e. the limited temperature stability range of the composite or flexible substrate versus the high temperatures required to achieve long range order in ferroelectric oxides to achieve the required high dielectric constants. While other researchers have worked to reduce the oxide processing temperatures to make them compatible with high temperature polymers (see for example the invited talk by Lourdes Calzada in this meeting), we chose instead to process on flexible metal foil substrates, and subsequently integrate with the substrate (eg FR4). Success was achieved for PLZT-based thin film capacitors on Ni foil substrates, subsequently BaTiO3-based capacitors on Cu foil, and then PZT ferroelectrics (and piezoelectrics) on similar Cu foil. In the second part of the presentation I present some of our adventures in adding additional functionality on metal substrates, including thermoelectric, and energy harvesting devices, as well as the effort to increase the thickness dimension to the range of thick film technology. This section of the presentation includes the investigation of lead-free materials on flexible metal foils for ferroelectric devices and high value capacitors. In the final part of the presentation I present some of the science of processing on metal foil substrates which have a large thermal expansion mismatch with the film. The large biaxial stresses which result can lead to a substantial change in film properties. These biaxial stress effects are discussed in terms of both the imposed limitations, and the opportunities to engineer properties.

Angus Kingon holds dual faculty positions at Brown University in the USA. He is Professor of Engineering, where he specializes in electronic materials, and is also Professor of Entrepreneurship and Organizational Studies, responsible for research, teaching and programs in entrepreneurship and technology commercialization. As an electronic materials researcher, he has focused on functional oxides for applications such as memory devices, capacitors, RF and microwave devices, piezoelectric sensors and actuators, miniature power generators, and thermoelectric devices. He has published about 340 papers in refereed journals, edited 7 books, published 6 book chapters, and has 15 issued patents. Some of his research has been commercialized, for example for use in mobile phones, and mobile controllers. In his second role he studies and teaches technology entrepreneurship and commercialization. He is the Co-Director of the Program in Innovation Management and Entrepreneurship, and founding Academic Director of the IE-Brown Executive MBA program. He has developed or advises technology commercialization and technology entrepreneurship programs in multiple countries. He was the co-winner of the Price Foundation Award as Innovative Entrepreneurship Educator for 2006. He is a Fellow of the Center for Innovation Management Studies, and a Fellow of the American Ceramic Society.

Session THA1:
MHz, GHz and THz for Communications, Sensors and Devices

Chairs: Peter Petrov and JianJiang Bian
10:00 am - 10:40 am

Session THA2:
Piezoelectric Materials & Applications

Chair: Martin Letz and Luis Pereira
10:00 am - 10:40 am

Cost-effective Gas Sensors based on Tungsten and Tungsten Trioxide Thin Films for H2S Detection
Nathalie Verbrugghe, UDSMM, Université Littoral Côte d'Opale (Didier Fasquelle, Benoît Duponchel, Stéphanie Deputier, Nicolas Uschanoff)

Ferroelectric Thin Film based Multilayer Structure for Acoustic Devices with Electrical Multiband Switching Ability
Peter Petrov, Imperial College London (W Liu, N McN Alford; AK Mikhailov, SV Ptashnik, AV Yastrebov, AB Kozyrev, St. Petersburg State Electrotechnical University; S Hirsch, University of Applied Sciences Brandenburg)

Low pO2 Sintering of Sodium Potassium Niobate based Lead-free Piezoceramics for Multilayer Actors with Base Metal Electrodes
T. Reimann, Jena University of Applied Sciences Jena (S. Fröhlich, A. Kynast, M. Töpfer, E.Hennig, J.Töpfer)

Photoferroelectric Perovskites - an Investigation of Compositional and Processing Influence on Microstructure and Properties
Yang Bai, University of Oulu (Heli Jantunen, Jari Juuti)

Coffee Break: 10:40 am - 11:00 am

Printed Electrical and Electrochemical Devices based on Oxide Nanoparticles

Invited Speaker - Luis Pereira

ABSTRACT: The growing demand of new and sustainable consumer printed electronics led to the increased interest in electric and electrochemical devices on paper substrates. Here we present the wok resulting from recent research concerning the combination of oxide nanoparticles with cellulosic materials. First topic is related to nanostructured electrochromic printed films with controllable dual phase, which show an optical density 80% higher than amorphous ones, in parallel with improved coloration efficiency and response time (below 3s). Second topic to be addressed are printable inks based on commercial ZnO NPs mixed with some cellulose derivatives that were optimized to create printed channel layers at temperatures lower than 150C. This allowed the development of fully screen-printed EGTs with mobility above 1 cm2V-1s-1 and on/off current ratio close to 10^4. Finally, the dual phase approach was used to prepare inks that can be written on paper, resulting in dense NPs matrix with sufficient interparticle connectivity to be used in hybrid handdrawn/printed UV-sensors, transistors and logic gates.

Luis Pereira was born in Lisbon, Portugal, in 1977. He received the Engineering degree in Materials Science in 2001 and has finished the Ph.D. in Microelectronics and Optoelectronics in 2008 at Universidade Nova de Lisboa. His Ph.D. work was focused on polycrystalline silicon and high k dielectrics for TFT’s application.  The expertise gained on oxide materials for electronics allowed focusing the pos-doc activities on the development printed inorganic nanostructured materials for chromogenic, electronic and electrochemical devices on paper and plastic substrates. He was involved in the team that demonstrated for the first time transistors made of oxides with paper as dielectric. He has authored and co-authored 167 publications in peer-reviewed journals and proceedings of the ISI with more than 5000 citations and has a H factor of 35. He is currently Associate Professor at DCM-FCT/UNL and researcher at CENIMAT/I3N where coordinates and participates in R&D projects. He has been granted in 2015 with a Starting Grant of the European Research Council (ERC) on the development of cellulose nanocomposites for paper electronics (New-Fun, project 640598). His current research interests are on the design and synthesis of 1D, 2D and 3D inorganic and hybrid nanostructures, chiral cellulose nanocomposites, functional micro and nanofibers and it integration on chromogenic, electronic and electrochemical devices.

Session THA3:
Microsystem Materials / Design & Simulation / Applications

Chairs: Jens Muller and Uwe Partsch
11:40 am - 12:00 pm

Piezoelectric Materials & Applications

Chair: Martin Letz and Luis Pereira
11:40 am - 12:00 pm

Evaluation of Strength Distribution and Toughness of LiTaO3 and LiNbO3 Single Crystals for Smartphone Applications
Manuel Gruber, Institute of Structural and Functional Ceramics, Montanuniversitaet Leoben (Daniel Kiener, Peter Supancic, Raul Bermejo)

Strain Effect on the Properties of K0.5Na0.5NbO3 Thin Films
André dos Santos, Universidade de Aveiro (S. Zlotnik, O. Okhay, I. Bdikin, M. E. Costa, P. M. Vilarinho, A. Tkach)

LUNCH: 12:00 pm - 1:20 pm

Low-temperature Crystallization of Solution Derived Metal Oxide Thin Films - Towards the Integration of High-performance Oxides in Flexible Electronics

Invited Speaker - Maria Lourdes Calzada

ABSTRACT: To date, amorphous oxide semiconductors are considered high- performance layers that, only some few years ago, have been successfully grown on plastic substrates by low- temperature solution deposition methods.[1] More challenging is the preparation of crystalline complex oxide thin films at temperatures compatible with their direct integration in flexible plastic substrates (≤350 ºC). These metal oxides usually crystallize at temperatures over 600 ºC, which has historically excluded them from their use in flexible electronics. Significant efforts have been devoted in our group to address this challenge.[2] This presentation shows an overview to the different solution strategies that we have developed for the fabrication at low temperature of functional metal oxide films. Most of these approaches are based in the use of light as an alternative energy source to induce crystallization by photochemistry. Novel photosensitive precursors will be prepared by using different synthesis routes (modified metal alkoxides, charge-transfer metal complexes or structurally designed molecular compounds) and by a precise control over the reactions promoted by UV light (photochemical cleavage, ozonolysis, condensation or photocatalysis). The efficiency of these solution methods for the low- temperature fabrication of crystalline metal oxide films on plastic will be shown for several functional compounds like the photoferroic BiFeO3, the ferroelectric Pb(Zr,Ti)O3 or the photocatalytic β-Bi2O3. [1] S.Jeong and J.Moon. J.Mater.Chem., 2012, 22, 1243. [2] I.Bretos, R.Jiménez, J.Ricote and M.L.Calzada. Chem. Soc. Rev., 2018, 47, 291. Supported by Spanish Project MAT2016- 76851-R.

M. Lourdes Calzada is Research Professor of the Spanish National Research Council (CSIC, Spain), at the Materials Science Institute of Madrid (ICMM). Here, she leads the research line on “Functional metal oxide thin films”. Key points of this investigation are the “Development of low-temperature sol-gel synthesis strategies to attain metal oxide materials” and the “Integration of functional films and self-assembled systems with semiconductor and flexible substrates (Si-technology and Flexible Electronics)”. In the framework of this area, her group is pioneer in the “Low-temperature solution processing of ferroelectric and multiferroic complex oxides for flexible electronic devices”. Prof. Calzada has been Principal Investigator of several National and European projects and has published more than 180 publications. She has presented more than 10 invited talks in International Conferences, has published 10 book chapters and is co-inventor in 3 patents of application. She belongs to the steering committees of several National and International Conferences and participates in university under- and post-graduate programmes.

DEBATE : 2:00 pm - 3:40 pm (SENATE ROOM)


Sintering is still a vital step to densify materials. In spite the several alternative sintering techniques developed over the past years, sintering is still performed at relative high-temperatures. Besides energy consumption, high-sintering temperature markedly affects the stoichiometry and defect chemistry of materials and above all drastically limits the manufacturing of composites and layers on flexible low-cost substrates. It is of the utmost necessity the drastic decrease of the sintering temperature of polycrystalline materials.

Some talks at CICMT 2018 address directly and indirectly this challenge. And due to its relevance, Processing Towards Room Temperature, is the topic of this Debate session at CICMT 2018.

The talk of Prof. Lourdes Calzada entitled Low-temperature Crystallization of Solution Derived Metal Oxide Thin Films - Towards the Integration of High-performance Oxides in Flexible Electronics will serve as a motto for discussion.

Moderator: Dr. Rob Pullar
Commentators: Prof. Heli Jantunen, Prof. Angus Kingon, Prof. Luis Pereira

Coffee Break: 3:40 pm - 4:00 pm

Towards Ultra Fine Line Technology - An Industrialization Study on Photoimageable Thick Film Pastes

Invited Speaker - Jan Strueben

ABSTRACT: The trend for smaller devices in the electronics industry requires miniaturization on all levels. Especially the increased demand for sensors, 5G high frequency communication circuits, touch panel displays, smaller passive electronic components and medical devices. The degree of miniaturization has become a huge challenge for current thick film technology. The demand for finer structures has reached the limitations of screen printing which is typically used to apply thick film pastes. As a leading global supplier of materials solutions for the semiconductor and electronic packaging industries, Heraeus Electronics is well aware of the demand for component miniaturization and higher density microelectronic circuits. In this work, results from process development work done at industrial partner Neways Micro Electronics using Heraeus photoimageable pastes are presented. We show that photoimageable thick film technology can be used as robust and repeatable process in production environments. Through addition of photoactive and polymerizable components, thick film pastes are obtained that are patterned using lithographic techniques. The production of ultra fine line structures down to 25 µm are demonstrated. The factors that govern the minimum achievable linewidths are discussed. With the availability of ultra fine line thick film pastes such as conductor pastes with Ag, Au, AgPd but also dielectric pastes, the full range of materials is available to be used for hybrid manufacturing. Next to the standard requirements for thick film pastes such as printability, shelf life, firing behavior, photoimageable pastes must fulfill additional criteria. The paste must show sufficient optical properties to achieve fine line resolutions and their reliable use in a production environment. As a key property, the influence of the light penetration depth of the paste on the line resolution and the processability of the paste is being discussed. A reproducible and tolerant process is the result of proper optimization of paste composition. Paste performance and corresponding process capability is evaluated in terms of tolerance to variations in exposure and development processes. Moreover paste sintering during firing must result in predictable and reproducible behavior with respect to pattern shrinkage, line integrity as well as electrical conductivity and adhesion of the material. This is a prerequisite to set up proper design rules. Industrialization aspects are discussed, specific strengths and weaknesses compared to the standard screen printing process will be indicated. A higher level of cleanliness of working environment, tools and materials gets more important when dimensions get smaller. Under these optimal industrial conditions, capability for volume manufacturing production was demonstrated at Neways.

Dr. Jan Strueben is Team Lead Organic Materials Development, Heraeus Electronics, Germany. 2005-2010 Study of chemistry at the Christian Albrechts university of Kiel. Diploma thesis: „Towards a Novel Synthetic Route to Electrically Conductive Polymers with Alternating Heteroles in the Main Chain“. 2011-2015 PhD degree on the “Synthesis of Mechanically Light-Responsive Materials for the Application in Photoswitchable Adhesives“ at the Otto Diels Institute for Organic Chemistry of the University of Kiel. 2016-2018 Project lead in product development of electrically conductive and non-conductive assembly materials for electronics and feasibility studies on new thick film technologies. 2018-now Team lead of the organic materials development group for new assembly and thick film materials.

Microsystem Materials / Design & Simulation / Applications

Chairs: Jens Muller and Uwe Partsch
4:40 pm - 6:00 pm

Piezoelectric Materials & Applications

Chair: Martin Letz and Luis Pereira
4:40 pm - 5:40 pm

Core-shell Conductive Powders for Reduced Metal Content and Improved Performance in HTCC Applications
Richard Stephenson, SVMT LLC (Howard Imhof)

Growth and Patterning of Organic Single-Crystal for Whispering-Gallery-Mode Ddevices
Ismael Domingos, Universidade de Aveiro (João Serra, Ana Oliveira, Diana Leitão, Helena Alves)

Analysis of Different Homogenization Methods for the Calculation of Deformations in 3D Printed Circuit Boards
Martin Pletz, Montanuniversitaet Leoben (Katerina Macurova, Peter Supancic, Raul Bermejo)

An Atmospheric Pressure Plasma Jet Made in LTCC Technology - Preliminary Results
Jan Macioszczyk, Wroclaw University of Science and Technology (Aneta Radka, Karol Malecha, Krzysztof Widerski, Piotr Jamróz, Andrzej Stafiniak, Leszek Golonka)

Metrology of Pyroelectric and Electrocaloric Measurements in Ferroelectric Ceramics and Thin Films
Andrey Berenov, Imperial College London (C. Abeyratne, L. Allers, J. Phair, P. Petrov, R. Whatmore)

Inhomogeneous Conductivity Behavior of Poly- and single-crystalline CaCu3Ti4O12 Samples: a Strong Evidence for the Existence of Polaronic Stacking Fault Defects
Filipe Amaral, Polytechnic Institute of Coimbra/University of Aveiro (Maxim Ivanov, V.A. Khomchenko, J.A. Paixão, Luis Cadillon Costa)

Conduction Mechanisms of Lead Free Potassium Sodium Niobate (KNN) Single Crystals and Polycrystals
Maria Elisabete Costa, CICECO, University of Aveiro (Muhammad Asif Rafiq, Alexander Tkach, Paula Maria Vilarinho)


Session THA4:
Energy Applications

Chair: Marcus Eberstein and M Lourdes Calzada
5:40 pm - 6:00 pm


Sintering and Interconnecting Thermoelectric Oxides for Energy Applications
Bjoern Mieller Bundesanstalt fuer Materialforschung und -pruefung (BAM) (Sophie Bresch, Patryck Marucha, Ralf Moos, Torsten Rabe)

End of Day 2

**GALA DINNER: 8:00 pm**
HOTEL MELIA RIA - Confirm presence at the registration desk


Friday, April 20 -- University of Aveiro, Rectory building
Registration: 8:00 am - 12:00 pm
Exhibit Hours: 10:00 am - 12:00 pm

Advanced Detection and Manipulation of Magnetically Labeled Biomolecules using In-chip Integrated Microfluidics

Invited Speaker - Susana Cardoso de Freitas

ABSTRACT: Magnetoresistive (MR) sensors are a mature technological product with many successful applications, from industrial and automotive smart systems to precision instrumentation for biomedical areas. Irrespectively of the usage, all these applications share the need of a high spatial resolution (micrometer), room temperature operation, large scale integration and good magnetic field detectivities (ranging from mili-Tesla to pico-Tesla) at low cost. The integration of MR sensors in adaptable media (eg. flexible, stretchable substrates) offers the possibility to merge the magnetic detection capability with mechanical functionalities. On the other hand, the precision of a micrometric needle can highly benefit from the integration of MR sensors microfabricated with top-down approaches. In this work, we demonstrate through several detailed examples how advanced MR sensors (spintronic devices based on ultrathin films) can be integrated with challenging architectures – namely (i) monolithic integration with nanoelectronic ASIC, CMOS chips, (ii) flexible substrates and flexible interconnections and (iii) microfluidic technologies. Here, the challenges of handling liquids over a chip combine with those for miniaturization of microelectronics for MR readout. However, when surpassed, the result is an integrated system with added functionalities capable to answer to the request of biomedical and biochemistry for lab- on-a-chip device. A competitive feature is the reduced size, compatible with portable platforms, where sensors, electronics for control and readout and also microfluidics are packed into a single block. This solution is very attractive for biomedical applications, where lab-on-chip solutions are being provided to many applications related with the manipulation, mixing and detection of magnetic nanoparticles attached to biomolecules. As an example, portable platforms incorporating readout electronics for multiple addressing of MR sensors have been demonstrated successfully for CD4 cell counting, Salmonella detection and milk bacteria detection. However, in biochip applications where microfluidics are also integrated (so to guide the nanoparticles towards the detecting region over the MR sensors) a monolithic integration of the sensors with the CMOS wafer is not economical viable. Usually the microchannels have several 100 um, which is much larger than the MR sensor itself (few 10 um), therefore a wide area over the chip is not used by electronics, while being required for microchannel physical support. We present alternatives to the integration of MR sensor chips (low cost) with electronic readout/control available in small area CMOS chips (high cost) and very large footprint microchannels. Here we discuss alternative methods for integration of microfluidic channels using advanced chip fan-out, which has the advantages of being scalable for massive production, with high economical impact. The two technologies are brought together in a process compatible with large area wafers. In the applications above, MR sensors benefit from the maturity of microfabrication technologies over Silicon substrates (rigid), where the sensors show optimum performance when compared with flexible ones. In this work we describe some key features of magnetoresistive sensors, from the materials to the physical characteristics and technological aspects (thermal stability, noise levels, mechanical robustness upon bending). In parallel, we will describe methods for magnetic particle manipulation and trapping in a microfluidic channel, using microcoils. Here, the effectiveness of the attractive forces require large currents, combined with a smart geometry. When handling biomolecules and cells, accurate temperature control (37ºC) is crucial for cell integrity, and must be assured with additional cooling mechanisms. Strategies for in-chip cooling will be presented as well. We will present examples where these hybrid technologies are implemented towards Lab-on-chip platforms.

Susana Cardoso de Freitas, received the B.S. and M.S. degrees in technologicSusana Cardoso de Freitaal physics engineering from the IST, University of Lisbon in 1996 and the Ph.D. degree in physics from IST, in 2002. In 2002 she was a “Co-op Pre-Professional Engineer” at IBM, T.J.Watson Research Center (USA). Since 2002 she is a researcher at INESC-MN and the co-leader of the Magnetics & Spintronics group since 2006. She is an Associated Professor at the Physics Department (IST) since 2015, and is responsible for student coordination and presently is the VP for the Physics Department at IST. She is co-author of over 270 publications (researcher ID: B-6199-2013). Her research interests include advanced thin films, spintronic sensors, microfabrication processes in large area wafers, and sensors for robotics, biomedical and industrial applications. Dr. Cardoso de Freitas was a recipient of the Honorable Mention in Scientific Awards Universidade de Lisboa/Santander in 2016 and 2017, and the Magnetic Society of Japan Distinguished Publication Award for the book edited: Giant Magnetoresistance (GMR) Sensors, Ed.Springer, in 2014, and she was one of the team members awarded as 2nd finalist for the EU Descartes Prize for Research in 2004.

Session FA1:
RF Materials & Applications (CONTINUED from Wednesday)
Chairs: Peter Petrov and Zhifu Liu
9:40 am - 10:40 am (SENATE ROOM)
Session FA2:
Ceramic Sensors & Applications
Chair: Marcus Eberstein, Epcos/TDK
9:40 am - 10:40 am

ULTCC Material for Device Fabrication at 400°C; An Upgraded Low Cost Fabrication Technology for 5th and 6th Generation Wireless Devices
Heli Jantunen, University of Oulu (Varghese J., Ramachandran P., Sobocinski M., Vahera T., Juuti J., Jantunen H.)

Structured Metallization on Glass: a Comparative Study of Resonance and Propagation Characteristics at 24GHz
Martin Letz, SCHOTT AG (Matthias Jost, Holger Maune, Institute for Microwave Engineering and Photonics, TU Darmstadt;
Romeo Premerlani, Alex Bruderer, Varioprint AG; Manuel Martina, Thomas Gottwald, Schweizer Electronic AG; Tetsuya Onishi, Grand Joint Technology Ltd. / KOTO Electric Co.; Sukhadha Viswanathan, Siddharth Ravichandran, Fabian Benthaus,Venkatesh Sundaram, Packaging Research Center, Georgia Tech; Matthias Jotz, SCHOTT AG)

Mg substituted X-type barium-zinc hexaferrites (Ba2Zn2-xMgxFe28O46) for use in high frequency applications
Rob Pullar, CICECO,University of Aveiro (Amrin Kagdi, Neha Solanki, Francisco Carvalho, Sher Singh Meena, Pramod Bhatt, Rajshree Jotaniar)

Optical Studies of CaF2:Eu Crystals for Scintillator and Dosimeter Applications
J. Cardoso, Universidade de Aveiro (J. Cardoso, N. Ben Sedrine, I.F.C. Castro, P.M.M. Correia, J. F. C. A. Veloso, M. R. Correia, T. Monteiro)

A Temperature Stable Probe for Plasma Diagnostics Realized in Ceramic Multilayer Technology
Peter Uhlig, IMST GmbH (Alexandra Serwa, Dennis Pohle, Christian Schulz, Moritz Oberberg, Ilona Rolfes, Peter Awakowicz)

Development of Autonomous µ-Flame Ionization Detector for the Explosion Protection in Civil Sewer Networks
Franz Bechtold, VIA electronic GmbH (Dominik Jurkow, VIA electronic GmbH; Jan Förster, Winfred Kuipers, Christian Koch, Krohne AG; Christian Lenz, Steffen Ziesche, Fraunhofer IKTS; Bastian Ruffmann, baltic FuelCells GmbH)

Coffee Break: 10:40 am - 11:00 am (SENATE ROOM)
Session FA3:
Microfluidics and Lab-on-a-chip
Chair: Susana Cardoso and JianJiang Bian
11:00 am - 11:40 am
Session FA2 (CONTINUED):
Ceramic Sensors & Applications
Chair: Marcus Eberstein and Angus Kingon
11:00 am - 11:40 am

LTCC Microfluidic Devices Applied on Synthesis and Functionalization of Nanoparticles
Mario Ricardo Gongora Rubio, Institute for Technological Research (IPT) (Roberta M. Cardoso, Houari C. Gomez, Koiti Araki)

LTCC Continuous Regime Microfluidic System for Nanocapsules Generation
Mario Ricardo Gongora Rubio, Institute for Technological Research (IPT) (Houari Cobas Gomez, Bianca Oliveira Agio, Jéssica Gonçalves da Silva, Luciana Wasnievski da Silva de Luca Ramos, Kleber Lanigra Guimarães, Adriano Marim de Oliveira, Antonio Carlos Seabra)

Fabrication and Performance of Passive Wireless Pressure Sensors based on LTCC Technology
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences (Lin Lin, Mingsheng Ma, Faqiang Zhang, Feng Liu, Yongxiang Li)

Fabrication and Characterization of an LTCC-Based Thermoelectric Generator with Embedded Heat Source
Nesrine Jaziri, METS Research Unit, National Engineering School of Sfax Tunisia (Jens Mueller, Ayda Boughamoura, Fares Tounsi, Bjorn Mueller, Ammar B Kouki, Tilo Welker)

Closing Remarks: 11:40am-12:00 pm



Registration Information: (Early Registration/Hotel Deadline: 18 March 2018)

Participant and student registration fees include: access to all technical sessions, access to the tabletop exhibition, meals, refreshment breaks, and one (1) DOWNLOAD of the Conference technical presentation slides. Exhibit fee includes one tabletop exhibit space, and 1 registration to work the booth/exhibition. All prices below are subject to change.

Early Fee
Through 18/3/2018
Regular/Onsite Fee
After 18/3/2018

Conference Participant




Tabletop Exhibit
If you decide to join our meeting just as an Exhibitor, a Table Exhibit will be available and will be displayed in a significant place next to session rooms, where numerous activities of the event will take place, specifically the poster sessions, and the coffee breaks. The Table Exhibit will include one table (approx. 1.20m x 0,4m), 2 chairs. The cost of table exhibit is € 1000 for the three days of the event. One full registration for the conference is included, with access to Coffee Breaks, Lunches, Gala Dinner and Social Events. The List of Attendees will be sent after the event. Also available the opportunity to provide one advertisement page with information about company products, services and contacts. The deadline for submission of the pdf-file (not password-protected) is 18 March 2018. Any material arriving after the deadline may not appear on the Book of Abstracts. Please send files to before 18 March 2018.

Exhibition Hours
• April 18 -- 09:00 am - 6:00 pm Coffee Breaks & Exhibitor Reception will be held in the Exhibit Area.
• April 19 -- 09:00 am - 6:00 pm Coffee Breaks will be in the Exhibit Area.
• April 20 -- 09:00 am - 2:00 pm Coffee Breaks will be in the Exhibit Area.
• Installation Hours: April 17 --2:00 pm - 6:00 pm
• Dismantle Hours: April 20 -- 2:00 pm - 7:00 pm


- Regular Sponsor - Companies that offer support for the amount of 1500 €.

1 Table Exhibit include one table (approx. 1.20m x 0,4m),
2 chairs in a place next to session rooms - 2 Participation Passes (2 full registration) at the congress, entitled to all the benefits offered to participants, including coffee breaks and lunches, conference bag with program and Abstracts book, welcome cocktail, gala dinner and social activities.
- An A4 page ad in the program and the Abstracts book.
- Sponsor logo will be placed on the conference bag
- The sponsor's advertisement / logo will be placed on the conference homepage with a link to the sponsor's home page;
- The logo will appear in prominent places in the conference spaces;
- Availability of time for oral presentation throughout the event;
Publicity material of the company can be placed free of charge in the folder offered to the participants.

- Specific Sponsor - Companies that promote specific items and events during the meeting.
• Conference welcome cocktail - € 500
• Conference Gala Dinner - 1000 €
• Conference Lunches - 750 €
• Conference Coffee Breaks - 500 €



Speaker Dates/Information:

  • Abstract Deadline: JANUARY 31, 2018
  • Speaker notification: February 15, 2018
  • Early Registration/Hotel Deadlines: March 18, 2018
  • Speaker BIO Due: April 1, 2018
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q/A)
  • Keynote Presentation Time: 30 minutes (25 to present; 5 for Q/A)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Poster Presentations will be made on poster boards/easels approximately 3ft x 4ft. Presenters should plan accordingly. Pins/tacks will be provided for the setup. Additional poster details at:


Hotel Reservations & Venue Details -- Rate Valid Until 29/12/2017


Melia Ria Hotel & Spa -

Additional Hotel Options:

Imperial Hotel -
Jardim Hotel -
Afonso V Hotel -


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic