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International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Doubletree Paradise Valley Resort
Scottsdale, Arizona USA


Conference and Technical Workshops
March 19-22, 2007
Exhibition and Technology Showcase
March 20-21, 2007
Professional Development Courses
March 19, 2007
GBC Spring Conference
March 18-19, 2007

EARLY REGISTRATION AND HOTEL DEADLINES:
FEBRUARY 16, 2007

EXHIBIT DISCOUNT DEADLINE:
FEBRUARY 16, 2007

In conjunction with the Global Business Council (GBC) Spring Conference, March 18th & 19th
$100 discount if attending both Device Packaging and GBC


Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute
General Chair:
Andrew Strandjord
FlipChip International
andrew.strandjord@flipchip.com
Technical Co-Chair:
Beth Keser
Freescale Semiconductor
Beth.Keser@freescale.com
Technical Co-Chair:
Jon Aday
Amkor Technology Inc.
jaday@amkor.com
Technical Co-Chair:
Christo Bojkov
MAXIM-DallasSemi
christo.bojkov@dalsemi.com
Technical Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
luj@rpi.edu


Technical Program
Click on hyperlinked paper titles below to preview the abstract

Program-at-a-Glance

Sunday Global Business Council (GBC) Spring Conference
Monday

GBC Spring Conference | Device Packaging Professional Development Courses (PDCs)
PDC1 - Area Array Microelectronics Package Reliability | PDC2 - Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts | PDC3 – Advanced Thermal Management and Packaging Materials | PDC4 - Reliability Methodologies for Fiber Optic Components | PDC5 - Fundamentals of Packaging of MEMS and Related Microsystems and Nanomanufacturing | PDC6 – Drop Test Simulation and It’s Application to IC Package Design for Handheld Consumer Electronics

Tuesday Keynote Presentations | Flip Chip/CSP - Applications | Packaging-Based 3D Approaches/Trends | Advances in Optoelectronic Packaging | Exhibition and Technology Showcase
Wednesday Keynote Presentations | Flip Chip/CSP - Materials & Processes | Wafer Level 3D Packaging | MEMS and Related Microsystems | 3D Panel Session | Exhibition and Technology Showcase
Thursday CSP Reliability | Packaging Based 3D Issues | Biomedical Devices

 

SUNDAY, MARCH 18
12:00 pm

12:00 Noon – GBC Golf Tournament
(Bus leaves at 11:00 AM returns at 5:00 PM)
McCormick Ranch Golf Club -- Scottsdale, AZ

3:00 pm - 7:00 pm

Registration

5:00 pm

GBC Welcome Reception and Dinner co-sponsored by The Microelectronics Foundation

6:30 pm

Keynote Address

MONDAY, MARCH 19
GBC Spring Conference & Device Packaging Professional Development Courses (PDCs)

7:00 am - 5:00 pm

GBC and Device Packaging Registration

7:00 am - 8:00 am

Continental Breakfast

8:00 am -
5:00 pm

8:00 am - Noon

Morning Professional Development Courses (PDCs)
* Click on PDC title to see full description *

PDC1 -
Area Array Microelectronics Package Reliability

Instructor: Amaneh Tasooji
Arizona State University

PDC2 - 
Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts

Instructor: Thomas Green
TJ Green Associates LLC

PDC3 –
Advanced Thermal Management and Packaging Materials

Instructor: Carl Zweben
Advanced Thermal Materials Consultant

10:00 am - 10:20 am

Break

1:00 pm - 5:00 pm

Afternoon Professional Development Courses (PDCs)
* Click on PDC title to see full description *

PDC4 -
Reliability Methodologies for Fiber Optic Components

Instructor: David Maack
JDS Uniphase

PDC5 -
Fundamentals of Packaging of MEMS and Related Microsystems and Nanomanufacturing

Instructor: Ajay Malshe
University of Arkansas

PDC6 –
Drop Test Simulation and It’s Application to IC Package Design for Handheld Consumer Electronics

Instructor: Kinzy Jones Jr.
Motorola       

3:00 pm - 3:20 pm

Break

5:00 pm - 7:00 pm

Welcome Reception (Device Packaging)


Welcome Reception
(Device Packaging Conference)

Monday, March 19th
5:00 pm – 7:00 pm

GBC Attendees are Invited!


$100 Discount

when you register for the
Device Packaging Conference &
the Global Business Council Conference (GBC)


Click on hyperlinked paper titles below to preview the abstract
TUESDAY, MARCH 20   
Keynote Presentation & Technical Sessions
 

FLIP CHIP / CSP

3D

OPTOELECTRONICS - MEMS - SENSORS

BIOMEDICAL - SENSORS

7:00 am - 7:00 pm

Registration

7:00 am - 8:00 am

Continental Breakfast

8:00 am - 9:00 am

Keynote Presentation
Emerging Device and Systems Packaging Trends

R
ao Tummala, Georgia Institute of Technology

9:00 am - 10:00 am

Keynote Presentation
3D Integration Update

Phil Garrou, TechSearch International, Inc.

10:00 am - 7:30 pm

Exhibition & Technology Showcase

11:00 am - 1:00 pm

Lunch in Exhibit Hall

1:00 pm - 5:00 pm

TP1
Flip Chip / CSP – Applications

Chairs: Beth Keser, Freescale Semiconductor; Jon Aday, Amkor Technology

TP2
3D – Packaging-Based 3D Approaches/Trends

Chairs: James J.-Q. Lu, Rensselaer Polytechnic Institute; Flynn Carson, STATS ChipPAC, Inc.

TP3
Optoelectronics – Photonics
Advances in Optoelectronic Packaging

Chairs: Robert Forman, Rohm and Haas Electronic Materials; Glenn Rinne, Amkor Technologies
Biomedical/Sensors Session
begins on
Thursday, March 22nd.

1:00 pm

Preliminary Manufacturability & Reliability Data for 150um Pitch Pb-Free Plated Interconnect FC using 65nm Low-k Silicon
Lou Nicholls, Kevin Engel, Amkor Technology, Inc.; Jose C. Cabauatan, Altero Bernardo, Amkor Technology Philippines; Bernt Hansen, Wolfgang Sauter, IBM; Toyohiro Aoki, IBM Japan

3D SiP Developments and Trends
Flynn P. Carson, STATS ChipPAC Inc. 

Effect of Deposition Conditions for Au-Sn and Sn Solder Film on Composition and Bonding Strength
Dong-Jin Kim, Jong-Won Lee, Taek-Yeong Lee, Gang-Beom Kim, Hanbat National University

1:30 pm

Thermal Management for FC on LTCC
Markus Noren, S. Brunner, C. Hoffmann, W. Salz, C. Block, EPCOS OHG 

System In Package (SiP) and Stacked Package Solutions
Wayne A. Nunn, Philips NXP; Denis Soldo, Robert Myoung, Ansoft Corporation 

SU-8 Bonding for Optoelectronics Packaging
Chad Brubaker, T. Matthias, M. Wimplinger, G. Mittendorfer, EV Group Inc.

2:00 pm

Applications of Thin Film Multilayer Substrate Technology and FC Interconnection for High Frequency Applications
Michael J. Toepper, H. Oppermann, M. Klein, Th. Fritzsch, R. Jordan, K. Scherpinski, L. Dietrich, H. Reichl, Fraunhofer IZM

Chip Embedding by Chip in Polymer Technology
Lars Boettcher, H. Reichl, Fraunhofer Institute for Reliability and Microintegration (IZM); D. Manessis, Alexander Neumann, A. Ostmann, Technical University of Berlin

Ultra High Thermal Dissipation of High Power Light-Emitting Diodes by Copper Electroplating
Kuan-Chun Chen, K. C. Chen, Y. K. Su, C. L. Lin, Ricky W. Chuang, J. Q. Huang, National Cheng Kung University 

2:30 pm

Optimize Flip Chip Interconnect Design using Designed Experiment Approach with 3D Modeling and Simulations
Brett Wilkerson, Ilko Schmadlak, Freescale Semiconductor, Inc.

Self Assembly of Die to Wafer using Direct Bonding and Capillarity Techniques
Grossi François, Lea Di Cioccio, Sebastien Vincent, Laurent Bally, Nelly Kernevez, CEA-LETI Minatec 

High Brightness Matrix LED Assembly Challenges and Solutions
Daniel D. Evans, Jr., Palomar Technologies, Inc.

3:00 pm - 3:30 pm
Break in the Exhibit Hall
3:30 pm

Embedded Capacitor Technology for High Performance Microprocessor Packages
Daniel I. Amey, Sounak Banerji, Karl Dietz, DuPont Electronic Technologies

Vertical Interconnects for Stacked Die using Micro Dispensing
Kenneth H. Church, Dongjiang Xu, Patrick Clark, Lance Swann, Bryan Irwin, Larry Jacobsen, nScrypt

An Investigation of the Deleterious Effects of High Power, High Frequency Acoustic Noise on MEMS Gyroscopes
Robert Dean, George Flowers, Anwar Ahmed, Scotte Hodel, Grant Roth, Simon Castro, James Brunsch, David Bittle, Brian Grantham, Auburn University

 
3:30 pm

Lead Free Micro-Ball Bumping for Flip Chip and Wafer Level Packaging
Kohei Tatsumi, Shinji Ishikawa, Eiji Hashino, Masamoto Tanaka, Tsutomu Sasaki, Yukihiro Yamamoto, Taro Kono, Nippon Steel Corporation 

Solder Die Attach and Evaluation of the Solder Joint
Randy L. Hamm, Doug Lee, Emily Crespin, Eric Jamieson, Bob Williams, Honeywell Federal Manufacturing & Technologies 

 

 

3:30 pm

 

Market Trends for 3D Stacking
Eric Mounier, Jean-Christophe Eloy, Jerome Mouly, Celine Giordano, Yole Developpement 

5:00 pm - 7 :00 pm

Reception in the Exhibit Hall (Device Packaging)

 

WEDNESDAY, MARCH 21
Keynote Presentation & Technical Sessions

 

FLIPCHIP / CSP

3D

OPTOELECTRONICS - MEMS - SENSORS

BIOMEDICAL - SENSORS

7:00 am – 8:00 pm

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – 8:45 am

Keynote Presentation
Recent Business and Technology Developments in Flip Chip

E. Jan Vardaman, TechSearch International, Inc.

8:45 am – 9:30 am

Keynote Presentation
The Increasing Role of Dielectric Films in Flip Chip and Wafer Level Packaging

Robert L. Hubbard, Lambda Technologies, Inc.

9:00 am – 5:00 pm

Exhibition & Technology Showcase

9:30 am – 10:00 am
Break in the Exhibit Hall

10:05 am – 10:45 am

Keynote Presentation
The Trends and Challenges of SiP Design

Per Viklund, Mentor Graphics

11:00 am – 5:00 pm

WA1
Flip Chip / CSP – Materials & Processes

Chair: Andrew Strandjord, FlipChip International, LLC

WA2
3D – Wafer Level 3D Packaging

Chairs: Thorsten Matthias, EV Group; Christo Bojkov, MAXIM-DallasSemi

WA3
MEMS – MEMS and Related Microsystems

Chair: Ajay Malshe, University of Arkansas

 

Biomedical/Sensors Session on
Thursday, March 22nd.

11:00 am

SolderJet® for Flip Chip and Wafer-Level Packaging
Donald J. Hayes, MicroFab Technologies, Inc.

Design and Application of 3D Memories
Robert Patti, Tezzaron Semiconductor Corporation

Flip Chip Ultrasonic Gold to Gold Interconnect for Small Die using Organic Substrates
Philip Couts, M. Kawahara, TDK Corporation of America

11:30 am

Effect of External Stress on Sn Whisker Growth
Jae-Hoon Choi, Si-Suk Kim, Hun Han, Seong-Chan Han, Dong-Chun Lee, Heui-Seog Kim, Samsung Electronics

Assembly and Cooling Technology for 3-D VLSI Chip Stacks
Leonard W. Schaper, Yang Liu, Susan Burkett, Li Cai, University of Arkansas / Xanodics LLC

High Flux Value Micro-Heat-Pipe Arrays using a Liquid Metal as the Working Fluid
Daniel K. Harris, Robert Dean, Ashish Palkar, Auburn University

12:00 pm – 1:00 pm

Lunch in the Exhibit Hall

1:00 pm

Lead Free Flux Cleaning Problem and its Solution
Kunihiko Okaoto, Junichi Maeno, Arakawa Chemical Industries Ltd.

Science, Materials, and Process Technology of Cu Bonding for 3D Integration
Kuan-Neng Chen, IBM T. J. Watson Research Center 

Wafer Bonding for MEMS: Low Temperature Processes using Plasma Activation
V. Drago, G. Mittendorferc, Thannerp Lindneri, EV Group

1:30 pm

Low Temperature Curable Photosensitive Polymer Dielectrics for Wafer Level Packaging Application
Takeshi Eriguchi, Masahiro Ito, Kaori Tsuruoka, Yuichiro Ishibashi, Hiromasa Yamamoto, Yong Zhang, Shunsuke Yokotsuka, Asahi Glass Co. Ltd.

Fabrication of 3D Packaging TSV using DRIE 
Jean-Marc Thevenoud, M. Puech, J. M. Gruffat, N. Launay, N. Arnal, P. Godinat, Alcatel Micro Machining Systems 

Fabrication and Characterization of Wafer Level Micro Package (WLμP®) 
Jongoh Kwon, JaeYong Ahn, ByungGil Jung, SukJin Ham, WoonBae Kim, InSang Song, Samsung Advanced Institute of Technology

2:00 pm

MicroLithographic Polymer Films - A Dry Film Lithography Solution for Advanced Packaging
Pedro Jorge, Hidehiro Yamada,Toshiaki Itabashi, DuPont Advanced Packaging Lithography

Back-End Copper Plating for 3D Chip Stacking Applications
Bioh Kim, Semitool, Inc.

Air Cavity Plastic Packaging, the New Near Hermetic Flexible Platform for Base-Station Microwave Applications
Raimond Dumoulin, NXP Semiconductors; David DeWire, RJR Polymers, Inc.

2:30 pm

Recent Developments in Flip Chip Lid Adhesives
Lyndon Larson, Stan Dent, Yi Zhao, Dow Corning Electronics

Ultra High Aspect Ratio Plating and 3-D Air Bridges with KMPR Photoresist
Harris R. Miller, MicroChem Corp. 

Plastic Air Cavity QFN Achieves True Hermetic Performance for MEMS Applications
Michael A. Zimmerman, Chris Lee, Quantum Leap Packaging, Inc. 

3:00 pm – 3:30 pm

Break in the Exhibit Hall

3:30 pm

The Development of a Single Chamber, Multi-Metal, Bump Plating Tool
Lee R. Levine, Miles Prim, Doug Welter, Yixiang Xie, Qiang Fu, Solomon Basame, Surfect Technologies, Inc.

3D Integration - Advances in Chip-to-Wafer and Wafer-to-Wafer Manufacturing Schemes
Thorsten Matthias, Stefan Pargfrieder, Paul Lindner, Markus Wimplinger, Eric Pabo, EV Group 

Uniformity Control in Si Deep Etching by NLD Plasma
Yasuhiro Morikawa, Takahide Murayama, Kousaku Yamaguchi, Koukou Suu, ULVAC, Inc.

4:00 pm

 

 

Assembly Strategies for 3D-Integration; Wafer-to-Wafer versus Chip-to-Wafer
Gilbert Lecarpentier, SUSS MicroTec 

Sealing of MEMS Device Cavity: Thermo-Mechanical Considerations
Ujjwala Darvemula, Ajay P. Malshe, University of Arkansas; Li Sun, Shawn Cunningham, Art Morris, wiSpry

4:30 pm

An Electronic Packaging Roadmap
Voya Markovich, F. D. Egitto, B. Chan, J. M. Lauffer, R. N. Das, Endicott Interconnect Technologies, Inc. 

Defect Free Through Silicone Via Fill with Minimum Overburden
Yun Zhang, Stream Chung, Cookson Electronics - Enthone Inc.

3D Panel Session: Roadmap of 3D Integration and Packaging

PRESENTATIONS    -    POSTERS    -     PANEL DISCUSSION
Moderators: James J.-Q. Lu, Rensselaer Polytechnic Institute; Christo Bojkov, MAXIM-DallasSemi
5:00 pm – 6:00 pm

EMC-3D Consortium Presentations

EMC-3D Consortium Overview by Dr. Bioh Kim, Consortium Program Director, Semitool

Technologies and Activities in Fraunhofer IZM by Dr. Jurgen Wolf, Project Manager, IZM

Advanced MEMS/Sensors Packaging by Dr. Yoon-Chul Sohn, Sr. Research Staff Member, SAIT
6:00 pm – 6:30 pm

EMC-3D Consortium Poster Session & Reception

Via Etch by RIE by Dr. Michel Puech, CTO, Alcatel

Via Etch by Laser by Dr. Dick Toftness, VP Business Development, XSiL

ECD Cu Fill and Wet-etch based Thinning by Dr. Bioh Kim, Business Development Manager, Semitool

Stacking and Lithography by Dr. Thorsten Matthias, Director of Technology, EVG North America
6:30 pm – 7:00 pm

Opening Remarks

Product and Market Trends in 3D Packaging by Ms. Jan Vardaman, President, TechSearch International, Inc.

3D Integration/Packaging - Status and Trend by Dr. Rajen Chanchani, Senior Scientist, Sandia National Laboratories

3D Technology Status and Trends by Dr. Phil Garrou, Consultant, TechSearch International

The PoP Ecosystem by Mr. Lee Smith, Senior Director Business Development, Amkor Technology

7:00 pm – 8:00 pm

3D Panel Discussion

Topics cover 3D technology platforms (SiP, PoP, Die-stack, Die-wafer, Wafer-to-wafer and Device-by-Device), unit processing technologies and equipment/material capabilities, and future trends and technology drivers (applications and benefit).

Panelists:

  • Flynn Carson, Director of 3D Packages, STATS ChipPAC, Inc.
  • Robert Patti, CTO, Tezzaron Semiconductor Corporation
  • Kuan-Neng Chen, Research Staff Member, IBM T. J. Watson Research Center
  • Jan Vardaman, President, TechSearch International, Inc.
  • Phil Garrou, Consultant, TechSearch International, Inc.
  • Rajen Chanchani, Senior Scientist, Sandia National Laboratories
  • Christo Bojkov, Director WLP, MAXIM-DallasSemi
  • James J.-Q. Lu, Professor, Rensselaer Polytechnic Institute

A SPECIAL THANKS
TO THE
DEVICE PACKAGING CONFERENCE
SPEAKERS & ORGANIZERS!

YOUR COMMITMENT IS GREATLY APPRECIATED!


THURSDAY, MARCH 22
Technical Sessions

 

FLIPCHIP / CSP

3D

OPTOELECTRONICS - MEMS - SENSORS

BIOMEDICAL - SENSORS

7:00 am – Noon

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – Noon

THA1
Flip Chip / CSP – CSP Reliability

Chair: Lee Levine, Surfect Technologies, Inc.

THA2
3D – Packaging Based 3D Issues

Chairs: Kuan-Neng Chen, IBM – T.J. Watson Research Center; Rajen Chanchani, Sandia National Laboratories

 

THA3
Biomedical/Sensors – Biomedical Devices

Chair: Steve Adamson, Asymtek

8:00 am

Wafer Level Packaging - Bringing Size and Performance Benefits to an Expanding Application Space
Ravi Chilukuri, David Hays, Glenn Rinne, Amkor Technology Inc.

Power Integrity: Design Tradeoffs at the PCB Level, Investigated Through Measurement and Simulation
Mark Alexander, Michael Brenneman, Xilinx, Inc.

Photoresist Aerosol Spray Can for Fabricating Microfluidic Devices
Harris R. Miller, MicroChem Corp.

8:30 am

C4NP - Reliability and Yield Data for Lead Free Wafer Bumping
Eric Laine, Klaus Ruhmer, Eric Perfecto, David Hawken, Hai Longworth, SUSS MicroTec

Sealing Hermetic Packages Using the Gold-N-Flo™ Process
K. J. Huth, V. A. Tanzi, L. C. Monterulo, C. M. Italiano, Semiconductor Packaging Materials Co.

Configurable, Modular Wireless Retinal Prosthesis and Hermetic Packaging Development at the VA Center for Innovative Visual Rehabilitation
Douglas B. Shire, M. D. Gingerich, S. F. Cogan, S. K. Kelly, J. L. Wyatt, J. F. Rizzo, Cornell University 

9:00 am

Mechanical and Electromigration Reliability Evaluation of Various Lead-Free Binary/Ternary Solder Ball on Electroplated Ni/Au under Bump Metallurgy in Wafer Level Package
Yun-Mook Park, NEPES

A Survey of Organic Materials for Printed Circuit Board Based Cavity Packaging
Linas Jauniskis, Brian Farrell, Andrew Harvey, David Walker, Scott Kennedy, Foster-Miller, Inc.

Ink Jet Microdispensing - a Tool for Fabrication and Packaging of BioMEMS Devices
David B. Wallace, Donald J. Hayes, MicroFab Technologies, Inc.

9:30 am – 10:00 am

Break

10:00 am

The Advances of the Electro-less Ni/Pd/Au Metal Stack as UBM for the Flip Chip Technology
Robert Preisser, ATOTECH Deutschland GmbH

The Application of SEMI E142 for Single Device Traceability
Dave Huntley, Kinesys Software  

 

Palm-Sized Enzyme-Based Electrochemical Breath Acetone Sensor
B. Landini, B. Sanchez, D.Lutrull, S. Bravard, J. McIntyre, P. Cranley, J. Vrtis, Kemeta, LLC

10:30 am

Investigation of the Current Crowding Effects during Electromigration of Lead-Free Flip Chip Solder Joint
Jin-Wook Jang, L. N. Ramanathan, J. Tang, J. K. Lin, D. R. Frear, Freescale Semiconductor, Inc.

Photoresists for 3D-Packaging - Challenges and Solutions
Georg Pawlowski, Chunwei Chen, Bob Plass, AZ Electronic Materials 

Inclined Angle Optical Lithography Micro-Structures for Improved Micro-Mixing
Arun K. Nallani, Jeong-Bong (J-B.) Lee, University of Texas at Dallas; David S. Silva, Donald J. Hayes, MicroFab Technologies, Inc.

11:00 am

Analysis of Non-ENIG Pad Finish on Solder Joint Reliability
Tim Pham, Thomas Koschmieder, Trent Uehling, Freescale Semiconductor

 

 

 

 

11:30 am

 

 

Noon

Closing Remarks


Conference Registration

Advance Rate Ends:
February 16, 2007

Exhibit Booth Deadline:
February 9, 2007

Register Today



Hotel Cut-off:

February 16, 2007

Doubletree Paradise Valley Hotel
Single/Double - $199



HOUSING (Hotel cut-off is February 16, 2007)
Housing Accommodations must be made directly to:
Doubletree Paradise Valley Resort
5401 N. Scottsdale Road
Scottsdale, AZ 85250
Ph: 480-947-5400 or 877-445-6677

Single/Double - $199 plus tax

Register On-line: http://doubletree.hilton.com/en/dt/groups/personalized/phxsjdt_ima/index.jhtml
Please reference IMAPS when making reservations by Phone.



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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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