FLIPCHIP / CSP

3D

OPTOELECTRONICS - MEMS - SENSORS

BIOMEDICAL - SENSORS

7:00 am – 8:00 pm

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – 8:45 am

Keynote Presentation
Recent Business and Technology Developments in Flip Chip
E. Jan Vardaman, TechSearch International, Inc.

8:45 am – 9:30 am

Keynote Presentation
The Increasing Role of Dielectric Films in Flip Chip and Wafer Level Packaging
Robert L. Hubbard, Lambda Technologies, Inc.

9:00 am – 5:00 pm

Exhibition & Technology Showcase

10:05 am – 10:45 am

Keynote Presentation
The Trends and Challenges of SiP Design
Per Viklund, Mentor Graphics

11:00 am – 5:00 pm

WA1
Flip Chip / CSP – Materials & Processes

Chair: Andrew Strandjord, FlipChip International, LLC

WA2
3D – Wafer Level 3D Packaging

Chairs: Thorsten Matthias, EV Group; Christo Bojkov, MAXIM-DallasSemi

WA3
MEMS – MEMS and Related Microsystems

Chair: Ajay Malshe, University of Arkansas

Biomedical/Sensors Session on
Thursday, March 22nd.

11:00 am

SolderJet® for Flip Chip and Wafer-Level Packaging
Donald J. Hayes, MicroFab Technologies, Inc.

Design and Application of 3D Memories
Robert Patti, Tezzaron Semiconductor Corporation

Flip Chip Ultrasonic Gold to Gold Interconnect for Small Die using Organic Substrates
Philip Couts, M. Kawahara, TDK Corporation of America

11:30 am

Effect of External Stress on Sn Whisker Growth
Jae-Hoon Choi, Si-Suk Kim, Hun Han, Seong-Chan Han, Dong-Chun Lee, Heui-Seog Kim, Samsung Electronics

Assembly and Cooling Technology for 3-D VLSI Chip Stacks
Leonard W. Schaper, Yang Liu, Susan Burkett, Li Cai, University of Arkansas / Xanodics LLC

High Flux Value Micro-Heat-Pipe Arrays using a Liquid Metal as the Working Fluid
Daniel K. Harris, Robert Dean, Ashish Palkar, Auburn University

12:00 pm – 1:00 pm

Lunch in the Exhibit Hall

1:00 pm

Lead Free Flux Cleaning Problem and its Solution
Kunihiko Okaoto, Junichi Maeno, Arakawa Chemical Industries Ltd.

Science, Materials, and Process Technology of Cu Bonding for 3D Integration
Kuan-Neng Chen, IBM T. J. Watson Research Center 

Wafer Bonding for MEMS: Low Temperature Processes using Plasma Activation
V. Drago, G. Mittendorferc, Thannerp Lindneri, EV Group

1:30 pm

Low Temperature Curable Photosensitive Polymer Dielectrics for Wafer Level Packaging Application
Takeshi Eriguchi, Masahiro Ito, Kaori Tsuruoka, Yuichiro Ishibashi, Hiromasa Yamamoto, Yong Zhang, Shunsuke Yokotsuka, Asahi Glass Co. Ltd.

Fabrication of 3D Packaging TSV using DRIE 
Jean-Marc Thevenoud, M. Puech, J. M. Gruffat, N. Launay, N. Arnal, P. Godinat, Alcatel Micro Machining Systems 

Fabrication and Characterization of Wafer Level Micro Package (WLμP®) 
Jongoh Kwon, JaeYong Ahn, ByungGil Jung, SukJin Ham, WoonBae Kim, InSang Song, Samsung Advanced Institute of Technology

2:00 pm

MicroLithographic Polymer Films - A Dry Film Lithography Solution for Advanced Packaging
Pedro Jorge, Hidehiro Yamada,Toshiaki Itabashi, DuPont Advanced Packaging Lithography

Back-End Copper Plating for 3D Chip Stacking Applications
Bioh Kim, Semitool, Inc.

Air Cavity Plastic Packaging, the New Near Hermetic Flexible Platform for Base-Station Microwave Applications
Raimond Dumoulin, NXP Semiconductors; David DeWire, RJR Polymers, Inc.

2:30 pm

Recent Developments in Flip Chip Lid Adhesives
Lyndon Larson, Stan Dent, Yi Zhao, Dow Corning Electronics

Ultra High Aspect Ratio Plating and 3-D Air Bridges with KMPR Photoresist
Harris R. Miller, MicroChem Corp. 

Plastic Air Cavity QFN Achieves True Hermetic Performance for MEMS Applications
Michael A. Zimmerman, Chris Lee, Quantum Leap Packaging, Inc. 

3:00 pm – 3:30 pm

Break in the Exhibit Hall

3:30 pm

The Development of a Single Chamber, Multi-Metal, Bump Plating Tool
Lee R. Levine, Miles Prim, Doug Welter, Yixiang Xie, Qiang Fu, Solomon Basame, Surfect Technologies, Inc.

3D Integration - Advances in Chip-to-Wafer and Wafer-to-Wafer Manufacturing Schemes
Thorsten Matthias, Stefan Pargfrieder, Paul Lindner, Markus Wimplinger, Eric Pabo, EV Group 

Uniformity Control in Si Deep Etching by NLD Plasma
Yasuhiro Morikawa, Takahide Murayama, Kousaku Yamaguchi, Koukou Suu, ULVAC, Inc.

4:00 pm

Assembly Strategies for 3D-Integration; Wafer-to-Wafer versus Chip-to-Wafer
Gilbert Lecarpentier, SUSS MicroTec 

Sealing of MEMS Device Cavity: Thermo-Mechanical Considerations
Ujjwala Darvemula, Ajay P. Malshe, University of Arkansas; Li Sun, Shawn Cunningham, Art Morris, wiSpry

4:30 pm

An Electronic Packaging Roadmap
Voya Markovich, F. D. Egitto, B. Chan, J. M. Lauffer, R. N. Das, Endicott Interconnect Technologies, Inc. 

Defect Free Through Silicone Via Fill with Minimum Overburden
Yun Zhang, Stream Chung, Cookson Electronics - Enthone Inc.

3D Panel Session: Roadmap of 3D Integration and Packaging

EMC-3D Consortium Presentations

EMC-3D Consortium Overview by Dr. Bioh Kim, Consortium Program Director, Semitool

Technologies and Activities in Fraunhofer IZM by Dr. Jurgen Wolf, Project Manager, IZM

EMC-3D Consortium Poster Session & Reception

Via Etch by RIE by Dr. Michel Puech, CTO, Alcatel

Via Etch by Laser by Dr. Dick Toftness, VP Business Development, XSiL

ECD Cu Fill and Wet-etch based Thinning by Dr. Bioh Kim, Business Development Manager, Semitool

Opening Remarks

Product and Market Trends in 3D Packaging by Ms. Jan Vardaman, President, TechSearch International, Inc.

3D Integration/Packaging - Status and Trend by Dr. Rajen Chanchani, Senior Scientist, Sandia National Laboratories

3D Technology Status and Trends by Dr. Phil Garrou, Consultant, TechSearch International

The PoP Ecosystem by Mr. Lee Smith, Senior Director Business Development, Amkor Technology

3D Panel Discussion

Topics cover 3D technology platforms (SiP, PoP, Die-stack, Die-wafer, Wafer-to-wafer and Device-by-Device), unit processing technologies and equipment/material capabilities, and future trends and technology drivers (applications and benefit).

Panelists:

• Flynn Carson, Director of 3D Packages, STATS ChipPAC, Inc.
• Robert Patti, CTO, Tezzaron Semiconductor Corporation
• Kuan-Neng Chen, Research Staff Member, IBM T. J. Watson Research Center
• Jan Vardaman, President, TechSearch International, Inc.
• Phil Garrou, Consultant, TechSearch International, Inc.
• Rajen Chanchani, Senior Scientist, Sandia National Laboratories
• Christo Bojkov, Director WLP, MAXIM-DallasSemi
• James J.-Q. Lu, Professor, Rensselaer Polytechnic Institute

FLIPCHIP / CSP

3D

OPTOELECTRONICS - MEMS - SENSORS

BIOMEDICAL - SENSORS

7:00 am – Noon

Registration

7:00 am – 8:00 am

Continental Breakfast

8:00 am – Noon

THA1
Flip Chip / CSP – CSP Reliability

Chair: Lee Levine, Surfect Technologies, Inc.

THA2
3D – Packaging Based 3D Issues

Chairs: Kuan-Neng Chen, IBM – T.J. Watson Research Center; Rajen Chanchani, Sandia National Laboratories

THA3
Biomedical/Sensors – Biomedical Devices

Chair: Steve Adamson, Asymtek

8:00 am

Wafer Level Packaging - Bringing Size and Performance Benefits to an Expanding Application Space
Ravi Chilukuri, David Hays, Glenn Rinne, Amkor Technology Inc.

Power Integrity: Design Tradeoffs at the PCB Level, Investigated Through Measurement and Simulation
Mark Alexander, Michael Brenneman, Xilinx, Inc.

Photoresist Aerosol Spray Can for Fabricating Microfluidic Devices
Harris R. Miller, MicroChem Corp.

8:30 am

C4NP - Reliability and Yield Data for Lead Free Wafer Bumping
Eric Laine, Klaus Ruhmer, Eric Perfecto, David Hawken, Hai Longworth, SUSS MicroTec

Sealing Hermetic Packages Using the Gold-N-Flo™ Process
K. J. Huth, V. A. Tanzi, L. C. Monterulo, C. M. Italiano, Semiconductor Packaging Materials Co.

Configurable, Modular Wireless Retinal Prosthesis and Hermetic Packaging Development at the VA Center for Innovative Visual Rehabilitation
Douglas B. Shire, M. D. Gingerich, S. F. Cogan, S. K. Kelly, J. L. Wyatt, J. F. Rizzo, Cornell University 

9:00 am

Mechanical and Electromigration Reliability Evaluation of Various Lead-Free Binary/Ternary Solder Ball on Electroplated Ni/Au under Bump Metallurgy in Wafer Level Package
Yun-Mook Park, NEPES

A Survey of Organic Materials for Printed Circuit Board Based Cavity Packaging
Linas Jauniskis, Brian Farrell, Andrew Harvey, David Walker, Scott Kennedy, Foster-Miller, Inc.

Ink Jet Microdispensing - a Tool for Fabrication and Packaging of BioMEMS Devices
David B. Wallace, Donald J. Hayes, MicroFab Technologies, Inc.

9:30 am – 10:00 am

Break

10:00 am

The Advances of the Electro-less Ni/Pd/Au Metal Stack as UBM for the Flip Chip Technology
Robert Preisser, ATOTECH Deutschland GmbH

The Application of SEMI E142 for Single Device Traceability
Dave Huntley, Kinesys Software  

Palm-Sized Enzyme-Based Electrochemical Breath Acetone Sensor
B. Landini, B. Sanchez, D.Lutrull, S. Bravard, J. McIntyre, P. Cranley, J. Vrtis, Kemeta, LLC

10:30 am

Investigation of the Current Crowding Effects during Electromigration of Lead-Free Flip Chip Solder Joint
Jin-Wook Jang, L. N. Ramanathan, J. Tang, J. K. Lin, D. R. Frear, Freescale Semiconductor, Inc.

Photoresists for 3D-Packaging - Challenges and Solutions
Georg Pawlowski, Chunwei Chen, Bob Plass, AZ Electronic Materials 

Inclined Angle Optical Lithography Micro-Structures for Improved Micro-Mixing
Arun K. Nallani, Jeong-Bong (J-B.) Lee, University of Texas at Dallas; David S. Silva, Donald J. Hayes, MicroFab Technologies, Inc.

11:00 am

Analysis of Non-ENIG Pad Finish on Solder Joint Reliability
Tim Pham, Thomas Koschmieder, Trent Uehling, Freescale Semiconductor

11:30 am

Noon

Closing Remarks